公开(公告)号：US07968995B2

公开(公告)日：2011-06-28

申请号：US12483087

申请日：2009-06-11

申请人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

发明人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base substrate; mounting a second base integrated circuit over the first base integrated circuit; attaching a stacking interconnect to the base substrate and adjacent to the first base integrated circuit; and forming a base encapsulation, having a recess portion from a corner of the base encapsulation and a step portion adjacent to the recess portion, with the step portion over the second base integrated circuit and the recess portion exposing the stacking interconnect.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基底; 在基底基板上安装第一基底集成电路; 在第一基础集成电路上安装第二基础集成电路; 将堆叠互连附接到所述基底基板并且邻近所述第一基底集成电路; 以及形成基底封装，所述基底封装具有从所述基底封装的拐角处的凹陷部分和与所述凹部相邻的台阶部分，所述台阶部分在所述第二基底集成电路上方，所述凹部暴露所述堆叠互连。

公开(公告)号：US20100244221A1

公开(公告)日：2010-09-30

申请号：US12413302

申请日：2009-03-27

申请人： Chan Hoon Ko ,  Soo-San Park ,  YoungChul Kim

发明人： Chan Hoon Ko ,  Soo-San Park ,  YoungChul Kim

IPC分类号： H01L23/488 ,  H01L21/02

CPC分类号： H01L23/49833 ,  H01L23/481 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.

摘要翻译： 一种制造集成电路封装系统的方法，包括：通过穿过集成电路和通过通孔连接到设备的器件互连，通过穿过集成电路和器件互连的装置，在衬底上安装具有穿过通孔和器件互连的器件的集成电路; 将所述导电支撑件附接在所述基板上，所述导电支撑件与所述集成电路相邻; 提供预先形成的插入器，其具有通过通孔和预连接互连件的插入件，预连接的互连件通过通孔连接到插入器; 将预先形成的插入件安装在集成电路和导电支撑件上，预先连接的互连件通过通孔穿过器件; 以及在覆盖所述集成电路的所述衬底，所述导电支撑件上形成封装，并且部分地覆盖所述预先形成的所述插入件。

公开(公告)号：US20100046183A1

公开(公告)日：2010-02-25

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H05K7/10 ,  H01L21/00

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US20090166886A1

公开(公告)日：2009-07-02

申请号：US11965653

申请日：2007-12-27

申请人： YoungJoon Kim ,  Soo-San Park

发明人： YoungJoon Kim ,  Soo-San Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L25/105 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A mountable integrated circuit package system comprising: mounting a first integrated circuit device over a package carrier; mounting an interposer including a central aperture over the package carrier, an intra-stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and forming an intra-stack encapsulation over the package carrier and surrounding the interposer.

摘要翻译： 一种可安装的集成电路封装系统，包括：将第一集成电路器件安装在封装载体上; 安装包括在所述封装载体上的中心孔的插入器，连接在所述插入器和所述封装载体之间的堆叠内互连以及所述中心孔内的所述第一集成电路器件; 以及在所述封装载体上形成堆叠内封装并围绕所述插入件。

公开(公告)号：US07238258B2

公开(公告)日：2007-07-03

申请号：US10907991

申请日：2005-04-22

申请人： Soo-San Park ,  Gab-Yong Min ,  Jin-Wook Jeong ,  Hee Bong Lee ,  Jason Lee

发明人： Soo-San Park ,  Gab-Yong Min ,  Jin-Wook Jeong ,  Hee Bong Lee ,  Jason Lee

IPC分类号： B32B38/10 ,  H01L21/687

CPC分类号： B29C63/0013 ,  B29L2031/3061 ,  H01L21/67132 ,  Y10S156/932 ,  Y10S438/976 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

摘要翻译： 用于从胶带剥离半导体芯片的系统在外壳上设置有鼻子。 鼻子的横向尺寸小于目标芯片的横向尺寸。 通过鼻子从外壳提供孔径。 在靠近鼻子的外壳中设有真空口。 真空源可控制地连接到孔和真空端口。 鼻子位于与其相对侧附接到目标芯片的带附近。 施加真空以将胶带吸引到鼻子和壳体的相邻部分，以将带从支撑在目标芯片的中心的磁带的目标芯片的周边边缘剥离。

公开(公告)号：US08906740B2

公开(公告)日：2014-12-09

申请号：US13085475

申请日：2011-04-12

申请人： Chan Hoon Ko ,  Soo-San Park ,  YoungChul Kim

发明人： Chan Hoon Ko ,  Soo-San Park ,  YoungChul Kim

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/10 ,  H01L25/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49833 ,  H01L23/481 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.

摘要翻译： 一种制造集成电路封装系统的方法，包括：通过穿过集成电路和通过通孔连接到设备的器件互连，通过穿过集成电路和器件互连的装置，在衬底上安装具有穿过通孔和器件互连的器件的集成电路; 将所述导电支撑件附接在所述基板上，所述导电支撑件与所述集成电路相邻; 提供预先形成的插入器，其具有通过通孔和预连接互连件的插入件，预连接的互连件通过通孔连接到插入器; 将预先形成的插入件安装在集成电路和导电支撑件上，预先连接的互连件通过通孔穿过器件; 以及在覆盖所述集成电路的所述衬底，所述导电支撑件上形成封装，并且部分地覆盖所述预先形成的所述插入件。

公开(公告)号：US20100314736A1

公开(公告)日：2010-12-16

申请号：US12483087

申请日：2009-06-11

申请人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

发明人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base substrate; mounting a second base integrated circuit over the first base integrated circuit; attaching a stacking interconnect to the base substrate and adjacent to the first base integrated circuit; and forming a base encapsulation, having a recess portion from a corner of the base encapsulation and a step portion adjacent to the recess portion, with the step portion over the second base integrated circuit and the recess portion exposing the stacking interconnect.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基底; 在基底基板上安装第一基底集成电路; 在第一基础集成电路上安装第二基础集成电路; 将堆叠互连附接到所述基底基板并且邻近所述第一基底集成电路; 以及形成基底封装，所述基底封装具有从所述基底封装的拐角处的凹陷部分和邻近所述凹部的台阶部分，所述台阶部分在所述第二基底集成电路上方，所述凹部暴露所述堆叠互连。