公开(公告)号：US07662655B2

公开(公告)日：2010-02-16

申请号：US12164850

申请日：2008-06-30

申请人： Ijaz H. Jafri ,  Galen P. Magendanz

发明人： Ijaz H. Jafri ,  Galen P. Magendanz

IPC分类号： H01L21/00

CPC分类号： B81C1/00333 ,  B81B2201/0271 ,  B81C1/00142 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/051 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2447 ,  H03H9/462 ,  H03H2009/02511

摘要： A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices.

摘要翻译： 一种用于形成具有使用双晶片工艺形成的单晶硅（SCS）微机械谐振器的振动微机械结构的方法，其包括绝缘体上硅（SOI）或绝缘基底和谐振器晶片，其中谐振器锚，电容空气 间隙，隔离沟槽和对准标记被微加工在基底晶片的有源层中; 谐振器晶片的有源层直接接合到基底晶片的有源层; 去除谐振器晶片的手柄和电介质层; 窗口在谐振器晶片的有源层中打开; 用光致抗蚀剂掩蔽谐振器晶片的有源层; 使用硅干蚀刻微加工技术在谐振器晶片的有源层中加工SCS谐振器; 随后将光致抗蚀剂干燥剥离。 图案化的SCS覆盖层结合到谐振器晶片，从而形成密封的芯片级晶片级真空封装器件。

公开(公告)号：US20090167107A1

公开(公告)日：2009-07-02

申请号：US11462338

申请日：2006-08-03

申请人： Yongli Huang

发明人： Yongli Huang

IPC分类号： H02N11/00

CPC分类号： B06B1/0292 ,  B81C1/00103 ,  G01N29/2406 ,  H01L2924/0002 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/2405 ,  H03H9/462 ,  H01L2924/00

摘要： A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base having a lower portion and an upper portion; a top plate disposed above the upper portion of the base forming a gap therebetween; and a spring-like structure disposed between the top plate and the lower portion of the base. The spring-like structure has a spring layer connected to the lower portion of the base and a spring-plate connector connecting the spring layer and a top plate. In an alternate embodiment, the spring-like has a vertical bendable connector connecting the top plate and the lower portion of the base. The spring-like structure transports the top plate vertically in a piston like manner to perform the function of the transducer. Fabrication methods to make the same are also disclosed.

摘要翻译： 公开了一种微机电换能器（例如cMUT）。 换能器具有底部，其具有下部和上部; 顶板，其设置在所述基座的上部上方，在其间形成间隙; 以及设置在所述顶板和所述基座的下部之间的弹簧状结构。 弹簧状结构具有连接到基座的下部的弹簧层和连接弹簧层和顶板的弹簧板连接器。 在替代实施例中，弹簧状具有连接顶板和底座下部的垂直可弯曲连接件。 弹簧状结构以类似活塞的方式垂直地输送顶板，以执行换能器的功能。 也公开了制造方法。

公开(公告)号：US07545236B2

公开(公告)日：2009-06-09

申请号：US10599957

申请日：2005-04-11

申请人： Yasuyuki Naito

发明人： Yasuyuki Naito

IPC分类号： H03H9/46 ,  H03H9/48 ,  H03H9/52 ,  H03H9/62 ,  H03H9/22 ,  H03H9/24

CPC分类号： H03H9/2426 ,  H03H9/02259 ,  H03H9/2463 ,  H03H9/462 ,  H03H9/465 ,  H03H2009/02496

摘要： An electromechanical filter capable of attaining a size reduction and a higher integration and executing a high-sensitivity signal sensing is provided. A quantum device is used as a sensing portion to implement a fine and highly sensitive sensing. A microvibrator 101 that is able to resonate with an input signal, and a sensing electrode 103 arranged at a predetermined interval to the microvibrator are provided. Since a change in an electrostatic capacity between the microvibrator and the sensing electrode can be sensed, a high-sensitivity sensing mechanism that is hard to realize in the prior art can be achieved.

摘要翻译： 提供了能够实现尺寸减小和更高集成度并执行高灵敏度信号感测的机电滤波器。 量子器件用作感测部分以实现精细和高度敏感的感测。 提供能够与输入信号谐振的微振荡器101和以预定间隔布置到微振动器的感测电极103。 由于可以感测到微振荡器和感测电极之间的静电电容的变化，所以可以实现现有技术难以实现的高灵敏度感测机构。

公开(公告)号：US20080238575A1

公开(公告)日：2008-10-02

申请号：US11733025

申请日：2007-04-09

申请人： Masahiro Tada ,  Shun Mitarai ,  Shinya Morita

发明人： Masahiro Tada ,  Shun Mitarai ,  Shinya Morita

IPC分类号： H03H9/05

CPC分类号： H03H9/1057 ,  H03H9/462 ,  H03H2009/02511

摘要： An electro mechanical device including: a main body of an electro mechanical device having a lower electrode and a movable member; an overcoat film sealing the main body of the electro mechanical device by maintaining a space, wherein a support post is provided between the overcoat film and the movable member.

摘要翻译： 一种机电装置，包括：具有下电极和可动构件的机电装置的主体; 通过保持空间来密封机电装置的主体的外涂膜，其中在外涂膜和可动构件之间设置支撑柱。

公开(公告)号：US20080218295A1

公开(公告)日：2008-09-11

申请号：US11809894

申请日：2007-06-01

申请人： Markus Lutz ,  Aaron Partridge ,  Zhiyu Pan

发明人： Markus Lutz ,  Aaron Partridge ,  Zhiyu Pan

IPC分类号： H03H9/46

CPC分类号： H03H9/2405 ,  H03H3/0076 ,  H03H9/02338 ,  H03H9/02448 ,  H03H9/2431 ,  H03H9/462 ,  H03H9/505 ,  H03H2009/02354 ,  H03H2009/0244 ,  H03H2009/02496 ,  H03H2009/02503 ,  H03H2009/02511 ,  H03H2009/02527

摘要： A plurality of mechanically coupled MEMS resonators that are arranged in an N x M MEMS array structure. Each MEMS resonators includes a plurality of straight (or substantially straight) elongated beam sections that are connected by curved/rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved/rounded sections thereby forming a geometric shape (e.g., a rounded square). Further, each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section. The resonator coupling sections may be disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at the same or substantially the same frequency. The resonators oscillate in a combined elongating (or breathing) mode and bending mode; that is, the beam sections exhibit an elongating-like (or breathing-like) motion and a bending-like motion. The one or more of the resonators of the array structure may include one or more nodal points or areas (i.e., portions of the resonator that are stationary, experience little movement, and/or are substantially stationary during oscillation of the resonator/array) in one or more portions or areas of the curved sections of the structure. The nodal points are suitable and/or preferable locations to anchor the resonator/array to the substrate.

摘要翻译： 以N×M MEMS阵列结构排列的多个机械耦合的MEMS谐振器。 每个MEMS谐振器包括通过弯曲/圆形部分连接的多个直的（或基本上直的）细长的梁部分。 每个细长梁部分经由弯曲/圆形部分在远端连接到另一个细长梁部分，从而形成几何形状（例如，圆形方形）。 此外，每个谐振器经由谐振器耦合部分机械耦合到阵列的至少一个其它相邻的谐振器。 谐振器耦合部分可以设置在相邻谐振器的细长波束部分之间。 谐振器在感应时以相同或基本相同的频率振荡。 谐振器以组合延长（或呼吸）模式和弯曲模式振荡; 也就是说，梁段呈现伸长状（或呼吸状）运动和弯曲状运动。 阵列结构的一个或多个谐振器可以包括一个或多个节点或区域（即谐振器的静止的部分，在谐振器/阵列的振荡期间经历少量运动和/或基本上静止） 结构的弯曲部分的一个或多个部分或区域。 节点是合适的和/或优选的位置以将谐振器/阵列锚固到基底。

公开(公告)号：US07407826B2

公开(公告)日：2008-08-05

申请号：US11322842

申请日：2005-12-30

申请人： Ijaz H. Jafri ,  Galen P. Magendanz

发明人： Ijaz H. Jafri ,  Galen P. Magendanz

IPC分类号： H01L21/00

CPC分类号： B81C1/00333 ,  B81B2201/0271 ,  B81C1/00142 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/051 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2447 ,  H03H9/462 ,  H03H2009/02511

摘要： A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices.

摘要翻译： 一种用于形成具有使用双晶片工艺形成的单晶硅（SCS）微机械谐振器的振动微机械结构的方法，其包括绝缘体上硅（SOI）或绝缘基底和谐振器晶片，其中谐振器锚，电容空气 间隙，隔离沟槽和对准标记被微加工在基底晶片的有源层中; 谐振器晶片的有源层直接接合到基底晶片的有源层; 去除谐振器晶片的手柄和电介质层; 窗口在谐振器晶片的有源层中打开; 用光致抗蚀剂掩蔽谐振器晶片的有源层; 使用硅干蚀刻微加工技术在谐振器晶片的有源层中加工SCS谐振器; 随后将光致抗蚀剂干燥剥离。 图案化的SCS覆盖层结合到谐振器晶片，从而形成密封的芯片级晶片级真空封装器件。

公开(公告)号：US20070222541A1

公开(公告)日：2007-09-27

申请号：US10599957

申请日：2005-04-11

申请人： Yasuyuki Naito

发明人： Yasuyuki Naito

IPC分类号： H03H9/46

CPC分类号： H03H9/2426 ,  H03H9/02259 ,  H03H9/2463 ,  H03H9/462 ,  H03H9/465 ,  H03H2009/02496

摘要： An electromechanical filter capable of attaining a size reduction and a higher integration and executing a high-sensitivity signal sensing is provided. A quantum device is used as a sensing portion to implement a fine and highly sensitive sensing. A microvibrator 101 that is able to resonate with an input signal, and a sensing electrode 103 arranged at a predetermined interval to the microvibrator are provided. Since a change in an electrostatic capacity between the microvibrator and the sensing electrode can be sensed, a high-sensitivity sensing mechanism that is hard to realize in the prior art can be achieved.

摘要翻译： 提供了能够实现尺寸减小和更高集成度并执行高灵敏度信号感测的机电滤波器。 量子器件用作感测部分以实现精细和高度敏感的感测。 提供能够与输入信号谐振的微振荡器101和以预定间隔布置到微振荡器的感测电极103。 由于可以感测到微振荡器和感测电极之间的静电电容的变化，所以可以实现现有技术难以实现的高灵敏度感测机构。

公开(公告)号：US20070216496A1

公开(公告)日：2007-09-20

申请号：US11569501

申请日：2005-06-02

申请人： Yoshito Nakanishi ,  Kunihiko Nakamura

发明人： Yoshito Nakanishi ,  Kunihiko Nakamura

IPC分类号： H03H9/46

CPC分类号： H03H9/2405 ,  H03H3/0072 ,  H03H9/02433 ,  H03H9/462 ,  H03H2009/02519 ,  Y10S977/724 ,  Y10S977/932

摘要： An object is to provide an electromechanical filter which can define a vibration mode so that a vibrator can be excited only in a desired vibration mode, that is, a filter which can suppress any vibration mode other than a desired vibration mode. The electromechanical filter includes a first member for inputting a signal, a second member disposed at a predetermined distance from the first member so as to surround the first member and to be excited due to an electrostatic force caused by the signal input from the first member, and a third member disposed at a predetermined distance from the second member so as to surround the second member and to detect vibration of the second member. The second member is designed to receive an attractive force from the first member and the third member so as to be bound and regulated as to a vibration direction.

摘要翻译： 本发明的目的是提供一种能够限定振动模式的机电滤波器，使得振动器仅能够以期望的振动模式被激励，即，可以抑制除期望振动模式之外的任何振动模式的滤波器。 机电滤波器包括用于输入信号的第一部件，设置在距第一部件预定距离处的第二部件，以便围绕第一部件并由于由第一部件输入的信号引起的静电力而被激励， 以及第三构件，其以与第二构件相隔预定距离的方式设置，以围绕第二构件并且检测第二构件的振动。 第二构件被设计成从第一构件和第三构件接收吸引力，以便结合和调节振动方向。

公开(公告)号：US20070046396A1

公开(公告)日：2007-03-01

申请号：US11462333

申请日：2006-08-03

申请人： Yongli Huang

发明人： Yongli Huang

IPC分类号： H03H9/00

CPC分类号： B06B1/0292 ,  B81C1/00103 ,  G01N29/2406 ,  H01L2924/0002 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/2405 ,  H03H9/462 ,  H01L2924/00

摘要： A MEMS acoustic filter has a MEMS resonator and at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. Multiple MEMS resonators may be stacked to form a high order acoustic filter. An array of MEMS acoustic filters may be designed to function as an acoustic lens. The MEMS acoustic filter is particularly useful with an ultrasonic transducer, such as PZT and MUT. Fabrication methods to make the same are also disclosed.

摘要翻译： MEMS声学滤波器具有MEMS谐振器和至少两个声学I / O端口，用于将输入声学信号改变为输出声学信号。 第一I / O端口适于与介质接口，以及用于将声信号传递到声换能器的第二I / O端口。 可以堆叠多个MEMS谐振器以形成高阶声学滤波器。 可以将MEMS声学滤波器阵列设计为用作声透镜。 MEMS声学滤波器对于诸如PZT和MUT的超声换能器是特别有用的。 也公开了制造方法。

公开(公告)号：US06846691B2

公开(公告)日：2005-01-25

申请号：US10625992

申请日：2003-07-24

申请人： Wan-Thai Hsu ,  John R. Clark ,  Clark T. C. Nguyen

发明人： Wan-Thai Hsu ,  John R. Clark ,  Clark T. C. Nguyen

IPC分类号： B81B3/00 ,  H03H3/007 ,  H03H3/013 ,  H03H9/02 ,  H03H9/24 ,  H03H9/46 ,  H03H9/50 ,  H01L21/00

CPC分类号： B81C1/0019 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0307 ,  B81C1/00626 ,  B81C2201/0109 ,  H03H3/007 ,  H03H3/0072 ,  H03H3/013 ,  H03H9/02362 ,  H03H9/2436 ,  H03H9/46 ,  H03H9/462 ,  H03H9/505 ,  H03H2009/02496

摘要： A method and resulting formed device are disclosed wherein the method combines polysilicon surface-micromachining with metal electroplating technology to achieve a capacitively-driven, lateral micromechanical resonator with submicron electrode-to-resonator capacitor gaps. Briefly, surface-micromachining is used to achieve the structural material for a resonator, while conformal metal-plating is used to implement capacitive transducer electrodes. This technology makes possible a variety of new resonator configurations, including disk resonators and lateral clamped-clamped and free-free flexural resonators, all with significant frequency and Q advantages over vertical resonators. In addition, this technology introduces metal electrodes, which greatly reduces the series resistance in electrode interconnects, thus, minimizing Q-loading effects while increasing the power handling ability of micromechanical resonators.

摘要翻译： 公开了一种方法和产生的形成的器件，其中该方法将多晶硅表面微机械加工与金属电镀技术相结合，以实现具有亚微米电极到谐振器的电容器间隙的电容驱动的横向微机械谐振器。 简而言之，使用表面微加工来实现谐振器的结构材料，而使用保形金属镀来实现电容式换能器电极。 该技术使得各种新的谐振器配置成为可能，包括磁盘谐振器和横向夹紧和自由弯曲谐振器，与垂直谐振器相比具有显着的频率和Q优点。 此外，该技术引入了金属电极，这大大降低了电极互连中的串联电阻，从而在增加微机械谐振器的功率处理能力的同时最大限度地减小了Q负载效应。