利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

1279 条记录 (耗时 0.022 秒)

    Liquid thermosetting ink
    62.
    发明申请
    Liquid thermosetting ink 有权
    液体热固性油墨

    公开(公告)号：US20050165135A1

    公开(公告)日：2005-07-28

    申请号：US10762515

    申请日：2004-01-23

    申请人： Jacob Mozel ,  Izhar Halahmi ,  Ran Vilk

    发明人： Jacob Mozel ,  Izhar Halahmi ,  Ran Vilk

    IPC分类号： C08G59/18 ,  C08L63/00 ,  C09D11/00 ,  C09D11/02 ,  C09D11/10 ,  H05K1/16 ,  H05K3/28

    CPC分类号： C08G59/18 ,  C09D11/101 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2203/013

    摘要： Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower than 50 Cp at the application temperature, a surface tension lower than 80 dyn/cm at the application temperature, and a glass transition temperature of cured ink of greater than 120° C.

    摘要翻译： 用于喷墨应用的液体热固性油墨包括至少一种树脂，至少一种具有最小粒径小于2微米的固体潜在性固化剂和具有细颗粒的惰性填料。 单组分或双组分油墨在使用温度下的粘度低于50CPc，在使用温度下的表面张力低于80dyn / cm，固化油墨的玻璃化转变温度大于120℃。

    Encapsulant mixture having a polymer bound catalyst
    64.
    发明申请
    Encapsulant mixture having a polymer bound catalyst 失效
    具有聚合物结合催化剂的密封剂混合物

    公开(公告)号：US20050124785A1

    公开(公告)日：2005-06-09

    申请号：US10731852

    申请日：2003-12-08

    申请人： James Matayabas

    发明人： James Matayabas

    IPC分类号： C08G59/18 ,  C08G59/24 ,  C08G59/40 ,  C08G59/68 ,  H01L21/56 ,  H01L23/29 ,  H01L21/44 ,  C08G65/34 ,  H01L21/48 ,  H01L21/50

    CPC分类号： C08G59/245 ,  C08G59/18 ,  H01L21/565 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of constructing a microelectronic assembly as provided. A mold piece is locating over a microelectronic die carrying an integrated circuit. An encapsulant is injected into a space defined between surfaces of the mold piece and the microelectronic die. The encapsulant includes a liquid phase epoxy and a solid phase catalyst compound when injected. The encapsulant mixture is heated in the space to a temperature where the catalyst compound becomes a liquid and cures the epoxy. The catalyst compound may, for example, be polystyrene and the catalyst may be diphenyl phosphine. The catalyst compound is then heated to above its glass transition temperature so that the diphenyl phosphine is released from the polystyrene. The diphenyl phosphine then cures the epoxy. The epoxy is preferably a liquid at room temperature.

    摘要翻译： 提供的构造微电子组件的方法。 模具位于承载集成电路的微电子管芯上。 将密封剂注入到在模具的表面和微电子模具之间限定的空间中。 注射剂包括液相环氧树脂和固相催化剂化合物。 将密封剂混合物在该空间中加热到催化剂化合物变成液体并固化环氧树脂的温度。 催化剂化合物可以是例如聚苯乙烯，催化剂可以是二苯基膦。 然后将催化剂化合物加热至高于其玻璃化转变温度，使得二苯基膦从聚苯乙烯释放。 二苯基膦然后固化环氧树脂。 环氧树脂在室温下优选为液体。

    Hardeners for water-based epoxy resin systems and processes for using the same
    65.
    发明申请
    Hardeners for water-based epoxy resin systems and processes for using the same 有权
    用于水性环氧树脂体系的硬化剂及其使用方法

    公开(公告)号：US20050113553A1

    公开(公告)日：2005-05-26

    申请号：US10939681

    申请日：2004-09-13

    申请人： Paul Birnbrich ,  Thorsten Roloff ,  Giorgio Sabbadini ,  Hans-Josef Thomas

    发明人： Paul Birnbrich ,  Thorsten Roloff ,  Giorgio Sabbadini ,  Hans-Josef Thomas

    IPC分类号： C08G59/06 ,  C08G59/18 ,  C09D163/00 ,  C08L63/00

    CPC分类号： C09D163/00 ,  C08G59/066 ,  C08G59/184 ,  Y10T428/31511 ,  Y10T428/31525

    摘要： Hardeners for water-based epoxy resin systems, the hardeners being obtainable by reacting a mixture of: (A) at least one epoxidized polyalkylene oxide selected from the group of epoxidized polyethylene oxides, epoxidized polypropylene oxides and polyethylene propylene oxides, (B) at least one epoxidized aromatic hydroxy compound selected from the group of bisphenol A epoxides and bisphenol F epoxides and (C) at least one aromatic hydroxy compound selected from the group of bisphenol A and bisphenol F, to form an intermediate product and subsequently reacting this intermediate product with a polyamine (E), are disclosed.

    摘要翻译： 用于水性环氧树脂体系的硬化剂，所述硬化剂可通过以下混合物反应获得：（A）至少一种选自环氧化聚环氧乙烷，环氧化聚环氧丙烷和聚环氧乙烷的环氧化聚环氧烷烃，（B）至少 一种选自双酚A环氧化物和双酚F环氧化物的环氧化芳族羟基化合物和（C）至少一种选自双酚A和双酚F的芳族羟基化合物，以形成中间产物，随后使该中间产物与 多胺（E）。

    Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation
    66.
    发明申请
    Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation 审中-公开
    环氧聚合物前体和耐高能辐射损伤的环氧聚合物

    公开(公告)号：US20050107580A1

    公开(公告)日：2005-05-19

    申请号：US10971393

    申请日：2004-10-25

    申请人： Sean Armstrong ,  Wendy Lin ,  Alan Kasner

    发明人： Sean Armstrong ,  Wendy Lin ,  Alan Kasner

    IPC分类号： G01T1/20 ,  C08G59/18 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00

    CPC分类号： C08G59/50 ,  C08G59/18 ,  C08G59/42 ,  C08L63/00 ,  C08L2666/20

    摘要： Epoxy polymer precursors and epoxy polymers resulting therefrom are tolerant to bombardment by high-energy radiation. The epoxy polymer precursors comprise at least an epoxy resin free of aromatic units and at least a curing agent selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyamides, aliphatic anhydrides, cycloaliphatic anhydrides, and mixtures thereof. In one embodiment of the invention the epoxy resin comprises at least a cycloparaffinic group, and the curing agent comprises a polyamine derived from cyclohexane. Such epoxy polymer compositions are used to form reflectors elements between adjacent scintillator elements in high-energy radiation detector array.

    摘要翻译： 由此产生的环氧聚合物前体和环氧聚合物可耐受高能辐射的轰击。 环氧聚合物前体至少包含不含芳族单元的环氧树脂和至少一种选自脂族多胺，脂环族多胺，聚酰胺，脂族酸酐，脂环族酸酐及其混合物的固化剂。 在本发明的一个实施方案中，环氧树脂至少包含环烷烃基，并且固化剂包含衍生自环己烷的多胺。 这种环氧聚合物组合物用于在高能辐射探测器阵列中在相邻闪烁体元件之间形成反射器元件。

    Novel terpolymers from lactide
    69.
    发明申请
    Novel terpolymers from lactide 失效
    丙交酯的新型三元共聚物

    公开(公告)号：US20050004338A1

    公开(公告)日：2005-01-06

    申请号：US10819900

    申请日：2004-04-07

    申请人： Dennis Smith ,  Nilmini Abayasinghe

    发明人： Dennis Smith ,  Nilmini Abayasinghe

    IPC分类号： C08G18/32 ,  C08G18/65 ,  C08G59/18 ,  C08G59/56 ,  C08G63/00 ,  C08G63/08 ,  C08G63/42 ,  C08G63/66 ,  C08G63/682 ,  C08G63/685 ,  C08G63/688 ,  C08G65/06

    CPC分类号： C08G59/18 ,  C08G59/56 ,  C08G63/42 ,  C08G63/6822 ,  C08G63/6852 ,  C08G63/6882

    摘要： The present invention is generally directed to a process for producing lactide-based polymers and the polymers produced by this process. The polymers of the present invention are terpolymers formed by the copolymerization of a lactide monomer, a linking monomer and an epoxy-terminated monomer. In one embodiment of the invention, the polymers may be formed from fluorine-containing monomers or aromatic ring-containing monomers. The disclosed materials may display improved hydrolytic and thermal characteristics as compared to previously known lactide-based materials. For example, the lactide based terpolymers may have a glass transition temperature over 60° C. For instance, lactide-based thermoplastic terpolymers of the present invention can have a glass transition temperatures of about 80° C. or higher. Lactide-based thermoset networks of the invention can have glass transition temperatures of up to about 200° C.

    摘要翻译： 本发明一般涉及一种生产基于丙交酯的聚合物的方法和通过该方法生产的聚合物。 本发明的聚合物是通过共聚丙交酯单体，连接单体和环氧基封端的单体形成的三元共聚物。 在本发明的一个实施方案中，聚合物可以由含氟单体或含芳环的单体形成。 与先前已知的基于丙交酯的材料相比，所公开的材料可以显示出改善的水解和热特性。 例如，基于丙交酯的三元共聚物可以具有超过60℃的玻璃化转变温度。例如，本发明的基于丙交酯的热塑性三元共聚物可具有约80℃或更高的玻璃化转变温度。 本发明的基于丙交酯的热固性网络可以具有高达约200℃的玻璃化转变温度

    Storage-stable moulding powder based on epoxy resins
    70.
    发明授权
    Storage-stable moulding powder based on epoxy resins 失效
    基于环氧树脂的储存稳定的成型粉末

    公开(公告)号：US6165558A

    公开(公告)日：2000-12-26

    申请号：US101789

    申请日：1998-07-16

    申请人： Hildegard Schneider

    发明人： Hildegard Schneider

    IPC分类号： C08G59/50 ,  C08G59/18 ,  C09D5/03 ,  C09D163/00 ,  B05D3/02

    CPC分类号： C08G59/184 ,  C09D163/00 ,  Y10S525/934

    摘要： A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60.degree. C., b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60.degree. C. and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 .mu.m, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.

    摘要翻译： PCT No.PCT / EP97 / 00297 Sec。 371日期：1998年7月16日 102（e）日期1998年7月16日PCT 1997年1月23日PCT PCT。 公开号WO97 / 28203 日期1997年8月7日一种通过施加热和压力可固化的成型粉末，其包含机械混合物，其由以下组成：a）在分子中平均包含多于一个环氧基且具有上述软化点的粉末状环氧化合物 60℃，b）基于在分子中平均含有多于一个氨基的脂族，脂环族，芳脂族或N-杂环胺的粉状脂族或N-杂环胺或含氨基氨基加成物，并具有 熔点或软化点高于60℃，任选地，c）用于模制粉末的常规添加剂，a）和b）小于200μm的颗粒非常适合于制备热敏涂层 基材，特别是在粉末涂料中使用。