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    Silicon wafer with non-soluble protective coating
    1.
    发明申请
    Silicon wafer with non-soluble protective coating 审中-公开
    具有不溶性保护涂层的硅片

    公开(公告)号：US20060289966A1

    公开(公告)日：2006-12-28

    申请号：US11159515

    申请日：2005-06-22

    申请人： Ashay Dani ,  Gudbjorg Oskarsdottir ,  James Matayabas

    发明人： Ashay Dani ,  Gudbjorg Oskarsdottir ,  James Matayabas

    IPC分类号： H01L23/58 ,  H01L21/822

    CPC分类号： H01L21/6835 ,  H01L21/78 ,  H01L2221/6834

    摘要： A silicon wafer with an array of integrated circuit (IC) dies formed on the wafer is provided with a protective coat applied to a surface of the wafer to protect the IC dies from debris created during a laser scribing process. The IC dies can include die bumps that can be adversely affected by debris from the laser scribing process. The protective coat is a tape or a film that may be optically transparent, chemically non-reactive to the laser energy and formed of material that can be ablated by the laser scribing. The protective coat is removed from the IC dies after laser scribing leaving the IC dies and die bumps clean of any debris, thereby decreasing the number of defective dies.

    摘要翻译： 具有在晶片上形成的集成电路（IC）模具阵列的硅晶片设置有施加到晶片表面的保护涂层，以保护IC芯片免受在激光划线过程中产生的碎片。 IC芯片可以包括可以受到来自激光划线工艺的碎片的不利影响的模具凸块。 保护涂层是可以是光学透明的，或与激光能量化学反应性不同的胶带或薄膜，并且可以通过激光划线而被烧蚀的材料形成。 在激光划线后，保护涂层从IC芯片中移除，使IC芯片和模具凸块清洁任何碎屑，从而减少有缺陷的裸片的数量。

    Polymer device with a nanocomposite barrier layer
    2.
    发明申请
    Polymer device with a nanocomposite barrier layer 有权
    具有纳米复合阻挡层的聚合物装置

    公开(公告)号：US20060027850A1

    公开(公告)日：2006-02-09

    申请号：US10914862

    申请日：2004-08-09

    申请人： James Matayabas ,  Gudbjorg Oskarsdottir

    发明人： James Matayabas ,  Gudbjorg Oskarsdottir

    IPC分类号： H01L29/94

    CPC分类号： G11C11/22 ,  B82Y10/00 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31699

    摘要： According to one aspect of the invention, a polymer device and a method of constructing a polymer device are provided. The polymer device includes a first conductor, a second conductor, and a polymeric body between the first and second conductors. The polymeric body includes a polymer material and a phyllosilicate material.

    摘要翻译： 根据本发明的一个方面，提供了一种聚合物装置和一种构建聚合物装置的方法。 聚合物装置包括第一导体，第二导​​体和在第一和第二导体之间的聚合体。 聚合物主体包括聚合物材料和页硅酸盐材料。

    Encapsulant mixture having a polymer bound catalyst
    4.
    发明申请
    Encapsulant mixture having a polymer bound catalyst 失效
    具有聚合物结合催化剂的密封剂混合物

    公开(公告)号：US20050124785A1

    公开(公告)日：2005-06-09

    申请号：US10731852

    申请日：2003-12-08

    申请人： James Matayabas

    发明人： James Matayabas

    IPC分类号： C08G59/18 ,  C08G59/24 ,  C08G59/40 ,  C08G59/68 ,  H01L21/56 ,  H01L23/29 ,  H01L21/44 ,  C08G65/34 ,  H01L21/48 ,  H01L21/50

    CPC分类号： C08G59/245 ,  C08G59/18 ,  H01L21/565 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of constructing a microelectronic assembly as provided. A mold piece is locating over a microelectronic die carrying an integrated circuit. An encapsulant is injected into a space defined between surfaces of the mold piece and the microelectronic die. The encapsulant includes a liquid phase epoxy and a solid phase catalyst compound when injected. The encapsulant mixture is heated in the space to a temperature where the catalyst compound becomes a liquid and cures the epoxy. The catalyst compound may, for example, be polystyrene and the catalyst may be diphenyl phosphine. The catalyst compound is then heated to above its glass transition temperature so that the diphenyl phosphine is released from the polystyrene. The diphenyl phosphine then cures the epoxy. The epoxy is preferably a liquid at room temperature.

    摘要翻译： 提供的构造微电子组件的方法。 模具位于承载集成电路的微电子管芯上。 将密封剂注入到在模具的表面和微电子模具之间限定的空间中。 注射剂包括液相环氧树脂和固相催化剂化合物。 将密封剂混合物在该空间中加热到催化剂化合物变成液体并固化环氧树脂的温度。 催化剂化合物可以是例如聚苯乙烯，催化剂可以是二苯基膦。 然后将催化剂化合物加热至高于其玻璃化转变温度，使得二苯基膦从聚苯乙烯释放。 二苯基膦然后固化环氧树脂。 环氧树脂在室温下优选为液体。