Abstract:
Provided are an apparatus and method for generating digital cinema content and an apparatus and method for playing digital cinema content. The method of playing digital cinema content using a digital cinema package (DCP) including frame data having a first resolution and length information about frame data having a second resolution lower than the first resolution, and a key delivery message (KDM) includes obtaining a material exchange format (MXF) file and a decryption key by parsing the DCP and the KDM, extracting an encrypted triplet from the MXF file, extracting the length information about the second-resolution frame data using the encrypted triplet and the decryption key, decrypting an amount of data required to decrypt the second-resolution frame data in the first-resolution frame data using the length information about the second-resolution frame data, and decoding the decrypted second-resolution frame data.
Abstract:
A semiconductor apparatus includes a controller, a memory, a normal line, a test line, and a path setting unit. The normal line is provided for communication between the controller and the memory. The test line is provided for a test operation of the memory. The path setting unit connects either the normal line or the test line to the memory according to a type of access mode.
Abstract:
A conductive polymer, a conductive polymer composition, a conductive polymer layer, and an organic photoelectric device including the conductive polymer layer, the conductive polymer being doped with a polyacid copolymer, the polyacid copolymer being represented by the following Chemical Formula 1:
Abstract:
Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.
Abstract:
A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units.
Abstract:
A method of controlling a non-volatile memory device includes comparing the number of banks that are in operating states with a threshold value. If the number of the banks is smaller than the threshold value, data stored in a standby bank is read. If there is no bank having data to be read, a standby bank is programmed. If the number of the banks is equal to or greater than the threshold value or if the reading or the programming is performed, it is determined whether there is a reading or programming command to be performed. If there is the reading or programming command to be performed, the process is repeated from the comparing step. The programming may include programming of a most significant bit (MSB) page or a least significant bit (LSB) page.
Abstract:
Embodiments of the inventive concept provide a nonvolatile memory device. The nonvolatile memory device includes a memory cell array, a read/write circuit, and a backup circuit. The memory cell array includes a first memory block including a first word line having first memory cells and a second word line having second memory cells. Each of the first memory cells and second memory cells configured to store first-bit data and second-bit data. The read/write circuit is configured to program data into the first and second memory cells and read data stored in the first and second memory cells. The backup circuit is configured to, after first-bit data are programmed into the first word line, but before second-bit data are programmed into the first word line, store first-bit data stored in the second memory cells of the second word line
Abstract:
A repair circuit of a semiconductor apparatus includes a plurality of through-silicon vias including repeated sets of one repair through-silicon via and an M number of normal through-silicon vias; a transmission unit configured to multiplex input data at a first multiplexing rate based on control signals, and transmit the multiplexed data to the plurality of through-silicon vias; a reception unit configured to multiplex signals transmitted through the plurality of through-silicon vias at a second multiplexing rate based on the control signals, and generate output data; and a control signal generation unit configured to generate sets of the control signals based on an input number of a test signal.
Abstract:
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.
Abstract:
A conductive polymer compound includes: a conductive polymer; a first repeating unit represented by the following Chemical Formula 1; a second repeating unit represented by the following Chemical Formula 2; and a third repeating unit represented by the following Chemical Formula 3 and/or Chemical Formula 4,