Abstract:
The present invention relates to an open optical access network system in which one optical access network is open to enable a plurality of service providers and a plurality of subscribers to simultaneously use the optical access network, to thereby improve the efficiency of using the optical access network, wherein each subscriber can be provided with a plurality of different services from the plurality of service providers, thereby enabling the flexible selection of services and the flexible change in services, thus improving the efficiency of using an optical infrastructure.
Abstract:
An electroconductive particle that includes (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.
Abstract:
A nonvolatile memory device comprises a gate insulating layer, a floating gate and a dielectric layer sequentially formed over a semiconductor substrate, a capping layer formed over the dielectric layer, and a control gate formed over the capping layer, wherein the control gate includes nitrogen or carbon as an additive.
Abstract:
Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.
Abstract:
An apparatus and method for protection switching of an optical channel at each node in an optical network based on wavelength division multiplexing optical transmission technology are provided. The method can be applied to any node having at least two optical fiber inputs and outputs. The apparatus includes: a splitter receiving an electrical signal and splitting the received electrical signal into a plurality of electrical signals which are substantially identical to the received electrical signal; an output switching unit selecting output paths of the electrical signals split by the splitter according to an optical channel path control command of the optical network; and a plurality of optical transponders being assigned to the respective output paths of the electrical signals, converting the electrical signal input by the selection of the output switching unit to an optical signal, and transmitting the converted optical signal to another node of the optical network.
Abstract:
Disclosed herein is a fabrication method of a semiconductor device to order to increase an operation liability of the semiconductor device. A method for fabricating a semiconductor device comprises forming a buried-type wordline in an active region defined on a SOI substrate, forming a silicon connection region for connecting an upper silicon layer to a lower silicon layer between neighboring buried type wordlines, and recovering the upper silicon layer on the silicon connection region.
Abstract:
A seed light module based on a single longitudinal mode oscillation light source is provided. The seed light module includes a multi-wavelength signal generation light source unit generating a continuous wave (CW) of different wavelengths, a multiplexer wavelength-division multiplexing the light output from the light source unit, a polarization beam splitter splitting the light of multiple wavelength components output from the multiplexer according to specific polarization components, phase modulators phase-modulating signals of a first polarization component and a second polarization component split by the polarization beam splitter onto a sine wave having a frequency and amplitude, a radio frequency (RF) signal generator generating the sine wave, a RF signal distributor distributing the generated RF signal, amplifiers amplifying the distributed RF signals, and a polarization beam combiner combining the lights phase-modulated by the respective phase modulators and providing the combined light as a seed light output.
Abstract:
A method and apparatus for generating an optical short pulse for quantum cryptography communication is provided. The apparatus is incorporated as a module in an electronic integrated circuit chip, such as a field programmable gate array (FPGA) chip which performs quantum key distribution post-processing and open channel optical signal processing of a quantum cryptography system. The apparatus generates an electrical short pulse and converts the electrical short pulse into an optical short pulse, and it is possible to manufacture a compact apparatus for generating an optical short pulse for quantum cryptography communication.
Abstract:
A method of forming a tunnel insulating layer in a flash memory device, comprising: forming an oxide layer on a semiconductor substrate, forming a nitrogen-containing layer to a surface of the oxide layer, and forming a nitrogen-accumulating layer on an interface defined between the semiconductor substrate and the oxide layer.
Abstract:
A cutting insert is disclosed, where the shape of a cutting edge is improved so that the minimum cutting load is applied during a cutting process to obtain the same surface roughness although the cutting insert is fed at high speed and to thus obtain high efficiency and high productivity. The diamond-shaped cutting insert includes an upper part and a lower part, a top surface and a bottom surface that are lower than the upper part and higher than the lower part, respectively, side parts for connecting the top surface to the bottom surface, corner parts for smoothly connecting the side parts to each other, a cutting edge formed by crossing the top surface, the bottom surface, the side parts, and the corner parts, and a chip breaker formed from the cutting edge to between the top surface and the bottom surface.