Integrated micro-optical systems
    71.
    发明授权
    Integrated micro-optical systems 有权
    集成微光系统

    公开(公告)号:US08059345B2

    公开(公告)日:2011-11-15

    申请号:US11976260

    申请日:2007-10-23

    IPC分类号: G02B9/06 G02B9/00

    摘要: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.

    摘要翻译: 集成微光学系统包括至少两个晶片,其中至少两个光学元件设置在至少两个晶片的相应表面上,两个光学元件中的至少一个是球面透镜。 所得光学系统呈现高数值孔径。 光学元件中的一个可以是在具有高折射率的材料中形成的折射元件。

    Method of making an optical system
    72.
    发明授权
    Method of making an optical system 有权
    制造光学系统的方法

    公开(公告)号:US07729051B2

    公开(公告)日:2010-06-01

    申请号:US12222154

    申请日:2008-08-04

    IPC分类号: G02B5/18 G02B27/44

    摘要: A method of making a plurality of micro-optical systems includes providing a plurality of diffractive optical elements and aligning each diffractive optical element with a refractive optical element. Each micro-optical system includes a refractive optical element and a diffractive optical element. The diffractive optical element provides different focal lengths at three different wavelengths for each micro-optical system and includes adjacent steps within a cycle having a difference of more the 2π for at least one of the three different wavelengths.

    摘要翻译: 制造多个微光学系统的方法包括提供多个衍射光学元件并使每个衍射光学元件与折射光学元件对准。 每个微光学系统包括折射光学元件和衍射光学元件。 衍射光学元件为每个微光学系统在三个不同波长处提供不同的焦距,并且包括具有更多2&pgr的差异的周期内的相邻步骤; 对于三种不同波长中的至少一种。

    Integration of array on non-rod shaped optical elements with array of fibers in a structure and associated methods
    74.
    发明授权
    Integration of array on non-rod shaped optical elements with array of fibers in a structure and associated methods 有权
    在非杆形光学元件与结构中的纤维阵列和相关方法中集成阵列

    公开(公告)号:US06621976B2

    公开(公告)日:2003-09-16

    申请号:US09893457

    申请日:2001-06-29

    IPC分类号: G02B600

    摘要: Arrays of non-rod shaped optical elements may be integrated with fiber arrays arranged in a positioning structure. The use of non-rod shaped optical elements allow the elements to be lithographically created already accurately aligned relative to one another. This also allows for simultaneous alignment of the array of optical elements with the array of fibers. The arrays may be one or two dimensional. The support structure for the fibers may be any desired structure. The fiber endfaces may be angled. The array of optical elements may include more than one substrate bonded together. Passive alignment features, including visual alignment marks and/or mechanical mating features, may be provided on

    摘要翻译: 非棒状光学元件的阵列可以与布置在定位结构中的光纤阵列集成。 使用非杆形光学元件允许光刻地创建已经相对于彼此精确对准的元件。 这也允许光学元件阵列与光纤阵列的同时对准。 阵列可以是一维或二维。 纤维的支撑结构可以是任何期望的结构。 纤维端面可以是成角度的。 光学元件的阵列可以包括多于一个的衬底结合在一起。 可以提供被动对准特征,包括视觉对准标记和/或机械配合特征

    Integrated parallel transmitter
    75.
    发明授权
    Integrated parallel transmitter 有权
    集成并行发射器

    公开(公告)号:US06600845B1

    公开(公告)日:2003-07-29

    申请号:US09690763

    申请日:2000-10-18

    IPC分类号: G02B612

    CPC分类号: G02B6/4204 G02B6/4249

    摘要: An integrated parallel transmitter includes an array of light sources, a corresponding array of diffractive elements splitting off a portion of the beam to be monitored, a corresponding array of power monitors for respectively monitoring each light source, and an array of couplers that couples light into a corresponding waveguide. The coupler is preferably a phase-matched coupler. All of the passive optical elements are integrated onto a single substrate or a plurality of substrates that have been bonded together on a wafer level.

    摘要翻译: 集成并行发射器包括光源阵列,分离出要被监视的光束的一部分的衍射元件的相应阵列,用于分别监测每个光源的相应的功率监视器阵列,以及耦合器阵列,将光耦合到 相应的波导。 耦合器优选地是相位匹配耦合器。 所有无源光学元件集成在单个衬底或已经在晶片级上结合在一起的多个衬底上。

    Fabricating optical elements using a photoresist formed from proximity printing of a gray level mask
    78.
    发明授权
    Fabricating optical elements using a photoresist formed from proximity printing of a gray level mask 有权
    使用由灰度级掩模的接近印刷形成的光致抗蚀剂制造光学元件

    公开(公告)号:US06420073B1

    公开(公告)日:2002-07-16

    申请号:US09584095

    申请日:2000-05-31

    IPC分类号: G03F900

    摘要: Gray scale masks used to create optical elements are formed. Desired gray scale patterns may be created by varying the thickness of a light absorbing layer. Such variations in thickness may be created using multiple binary masks. Desired gray scale patterns may also be created on a computer using available software and then imaged onto film or a glass film plate. Direct contact or proximity printing is then used to transfer the true gray scale pattern onto a photoresist layer. The photoresist layer is then etched, thereby forming the desired pattern therein. All portions of the desired pattern are simultaneously formed in the photoresist layer. The etched photoresist layer is then used to photolithographically fabricate either the optical element itself or a master element to be used in injection molding or other replication techniques. The gray scale mask itself may be used repeatedly to generate photoresist layers. The imaging is particularly useful for forming optical elements having a plurality of arrays of refractive elements.

    摘要翻译: 形成用于产生光学元件的灰度掩模。 可以通过改变光吸收层的厚度来产生期望的灰度图案。 可以使用多个二进制掩模来创建厚度的这种变化。 也可以使用可用的软件在计算机上创建所需的灰度图案,然后将其成像到薄膜或玻璃薄膜板上。 然后使用直接接触或接近印刷将真实灰度图案转印到光致抗蚀剂层上。 然后蚀刻光致抗蚀剂层,从而在其中形成所需的图案。 所需图案的所有部分同时形成在光致抗蚀剂层中。 蚀刻的光致抗蚀剂层然后用于光刻制造光学元件本身或用于注射成型或其他复制技术的主元件。 可以重复使用灰度级掩模本身以产生光致抗蚀剂层。 该成像对于形成具有多个折射元件阵列的光学元件特别有用。

    Integrated beam shaper and use thereof
    79.
    发明授权
    Integrated beam shaper and use thereof 失效
    集成光束整形器及其用途

    公开(公告)号:US6128134A

    公开(公告)日:2000-10-03

    申请号:US917865

    申请日:1997-08-27

    摘要: A substrate having an optical element on an input surface thereof receives a light beam not having a desired beam shape and shapes the light beam into a predetermined intensity distribution. The substrate may further include a second optical element for providing a predetermined phase pattern to the light beam provided by the first optical element. The first optical element may, for example, circularize an elliptical light beam using a soft aperture for differential power attenuation or by altering the divergence of the light beam along the different axes of the light beam. When the divergence angles are altered and the collimating optical element is provided on the output surface, the thickness of the transparent substrate is determined in accordance with a resultant difference in the divergence and/or with the initial difference in beam size along each axis and with a required circularity. A light source is mounted close to the first optical element in order to minimize the amount of differing divergence present along the different axes of the light beam. The optical elements may be diffractive, refractive, or hybrids thereof and are preferably prepared photolithographically on the substrate itself. The light source may be mounted using fiducial marks and the photolithographic processes for forming the optical elements may also use fiducial marks. All elements of the integrated beam shaper may be formed on a planar, wafer level.

    摘要翻译: 在其输入表面上具有光学元件的基板接收不具有期望光束形状的光束并将光束形成为预定的强度分布。 基板还可以包括用于向由第一光学元件提供的光束提供预定相位图案的第二光学元件。 例如,第一光学元件可以使用用于差分功率衰减的软孔径或通过改变沿着光束的不同轴的光束的发散来使椭圆形光束圆化。 当发散角被改变并且准直光学元件设置在输出表面上时,透明衬底的厚度根据所得到的发散差异和/或沿着每个轴的光束尺寸的初始差异以及与 要求的圆形度。 光源安装在靠近第一光学元件的位置,以便沿着光束的不同轴线最小化存在的不同发散量。 光学元件可以是衍射,折射或混合,并且优选光刻地制备在衬底本身上。 光源可以使用基准标记安装,并且用于形成光学元件的光刻工艺也可以使用基准标记。 集成光束整形器的所有元件可以形成在平面晶片级上。

    Microelectronic module having optical and electrical interconnects
    80.
    发明授权
    Microelectronic module having optical and electrical interconnects 失效
    具有光学和电气互连的微电子模块

    公开(公告)号:US6097857A

    公开(公告)日:2000-08-01

    申请号:US309280

    申请日:1999-05-11

    摘要: A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.

    摘要翻译: 在集成电路芯片之间具有高密度光电互连的多芯片模块包括覆盖集成电路芯片阵列的衬底。 光学发射器通过衬底产生第一光束,并且光学检测器接收穿过衬底的第二光束。 全息图位于第一和第二光束中的至少一个光路的路径中。 电接触焊盘的阵列位于相应于相应集成电路芯片上的电接触焊盘阵列的衬底上。 电互连线的图案位于基板上,用于电连接集成电路芯片。 衬底上和集成电路芯片之间的电接触焊盘之间的焊料凸块建立了衬底和集成电路芯片之间的电连接,并且还有助于集成电路芯片相对于衬底的对准。 光发射机和检测器可以安装在基板上或集成电路芯片中/之上。 光学发射器和检测器也可用于提供微电子模块外部的光学连接,使用全息基板来光学连接模块。 衬底也可用于建立全息图与下面的光发射器和/或光学检测器的光学对准,而不建立与其的电连接。