摘要:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.
摘要:
A method of making a plurality of micro-optical systems includes providing a plurality of diffractive optical elements and aligning each diffractive optical element with a refractive optical element. Each micro-optical system includes a refractive optical element and a diffractive optical element. The diffractive optical element provides different focal lengths at three different wavelengths for each micro-optical system and includes adjacent steps within a cycle having a difference of more the 2π for at least one of the three different wavelengths.
摘要:
A camera having an imaging system including first and second substrates, a first optical element on a first surface of the first substrate, and a second optical element on a second surface of the second substrate, the first and second surfaces being parallel and the first and second optical elements being substantially centered along an optical axis of the imaging system, and a detector positioned in optical communication with the imaging system, wherein an imaging function of the imaging system is distributed over at least the first and second optical elements.
摘要:
Arrays of non-rod shaped optical elements may be integrated with fiber arrays arranged in a positioning structure. The use of non-rod shaped optical elements allow the elements to be lithographically created already accurately aligned relative to one another. This also allows for simultaneous alignment of the array of optical elements with the array of fibers. The arrays may be one or two dimensional. The support structure for the fibers may be any desired structure. The fiber endfaces may be angled. The array of optical elements may include more than one substrate bonded together. Passive alignment features, including visual alignment marks and/or mechanical mating features, may be provided on
摘要:
An integrated parallel transmitter includes an array of light sources, a corresponding array of diffractive elements splitting off a portion of the beam to be monitored, a corresponding array of power monitors for respectively monitoring each light source, and an array of couplers that couples light into a corresponding waveguide. The coupler is preferably a phase-matched coupler. All of the passive optical elements are integrated onto a single substrate or a plurality of substrates that have been bonded together on a wafer level.
摘要:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.
摘要:
An optical subassembly includes an opto-electronic device, an optics block and a spacer, separate from the optics block and providing spacing between the opto-electronic device and the optics block. The opto-electronic device, the optics block and the spacer are aligned and bonded together. This subassembly is particularly useful when coupling light between the opto-electronic device and a fiber. The optical subassembly may also include an opto-electronic device, an optics block and a sealing structure surrounding the opto-electronic device. The opto-electronic device, the optics block and the sealing structure are aligned and bonded together.
摘要:
Gray scale masks used to create optical elements are formed. Desired gray scale patterns may be created by varying the thickness of a light absorbing layer. Such variations in thickness may be created using multiple binary masks. Desired gray scale patterns may also be created on a computer using available software and then imaged onto film or a glass film plate. Direct contact or proximity printing is then used to transfer the true gray scale pattern onto a photoresist layer. The photoresist layer is then etched, thereby forming the desired pattern therein. All portions of the desired pattern are simultaneously formed in the photoresist layer. The etched photoresist layer is then used to photolithographically fabricate either the optical element itself or a master element to be used in injection molding or other replication techniques. The gray scale mask itself may be used repeatedly to generate photoresist layers. The imaging is particularly useful for forming optical elements having a plurality of arrays of refractive elements.
摘要:
A substrate having an optical element on an input surface thereof receives a light beam not having a desired beam shape and shapes the light beam into a predetermined intensity distribution. The substrate may further include a second optical element for providing a predetermined phase pattern to the light beam provided by the first optical element. The first optical element may, for example, circularize an elliptical light beam using a soft aperture for differential power attenuation or by altering the divergence of the light beam along the different axes of the light beam. When the divergence angles are altered and the collimating optical element is provided on the output surface, the thickness of the transparent substrate is determined in accordance with a resultant difference in the divergence and/or with the initial difference in beam size along each axis and with a required circularity. A light source is mounted close to the first optical element in order to minimize the amount of differing divergence present along the different axes of the light beam. The optical elements may be diffractive, refractive, or hybrids thereof and are preferably prepared photolithographically on the substrate itself. The light source may be mounted using fiducial marks and the photolithographic processes for forming the optical elements may also use fiducial marks. All elements of the integrated beam shaper may be formed on a planar, wafer level.
摘要:
A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.