SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
    71.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE 失效
    半导体发光器件和发光模块

    公开(公告)号:US20130313581A1

    公开(公告)日:2013-11-28

    申请号:US13601336

    申请日:2012-08-31

    IPC分类号: H01L33/50 H01L33/08

    CPC分类号: H01L33/505

    摘要: According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.

    摘要翻译: 根据一个实施例,半导体发光器件包括:包括第一和第二表面的半导体层和发光层; 设置在第二表面上的p侧电极; 设置在所述第二表面上的n侧电极; 覆盖p侧和n侧电极的第一绝缘膜; 通过第一绝缘膜电连接到p侧电极的p侧布线部分; 通过第一绝缘膜与n侧电极电连接的n侧配线部; 以及设置在第一表面上的荧光体层。 荧光体层具有上表面和倾斜表面,倾斜表面与上表面形成钝角并相对于第一表面倾斜。 斜面正下方的荧光体层的厚度小于上表面正下方的荧光体层的厚度。

    Plasma processing apparatus of substrate and plasma processing method thereof
    73.
    发明授权
    Plasma processing apparatus of substrate and plasma processing method thereof 有权
    基板等离子体处理装置及其等离子体处理方法

    公开(公告)号:US08252193B2

    公开(公告)日:2012-08-28

    申请号:US12052522

    申请日:2008-03-20

    摘要: A substrate plasma processing apparatus includes a chamber of which an interior is evacuated under a predetermined vacuum condition; an RF electrode which is disposed in the chamber and configured so as to hold a substrate to be processed on a main surface thereof; an opposing electrode which is disposed opposite to the RF electrode in the chamber; an RF voltage applying device for applying an RF voltage with a predetermined frequency to the RF electrode; and a pulsed voltage applying device for applying a pulsed voltage to the RF electrode so as to be superimposed with the RF voltage and which includes a controller for controlling a timing in application of the pulsed voltage and defining a pause period of the pulsed voltage.

    摘要翻译: 基板等离子体处理装置包括在预定的真空条件下将内部抽真空的室; RF电极,其设置在所述室中并且构造成在其主表面上保持要处理的基板; 在所述室中与所述RF电极相对设置的对置电极; RF电压施加装置,用于向RF电极施加预定频率的RF电压; 以及脉冲电压施加装置,用于向RF电极施加脉冲电压以与RF电压叠加,并且包括用于控制施加脉冲电压的定时并且限定脉冲电压的暂停时段的控制器。

    PLASMA PROCESSING APPARATUS OF SUBSTRATE AND PLASMA PROCESSING METHOD THEREOF
    75.
    发明申请
    PLASMA PROCESSING APPARATUS OF SUBSTRATE AND PLASMA PROCESSING METHOD THEREOF 有权
    基板等离子体处理装置及其等离子体处理方法

    公开(公告)号:US20080237185A1

    公开(公告)日:2008-10-02

    申请号:US12052522

    申请日:2008-03-20

    IPC分类号: H01L21/3065

    摘要: A substrate plasma processing apparatus includes a chamber of which an interior is evacuated under a predetermined vacuum condition; an RF electrode which is disposed in the chamber and configured so as to hold a substrate to be processed on a main surface thereof; an opposing electrode which is disposed opposite to the RF electrode in the chamber; an RF voltage applying device for applying an RF voltage with a predetermined frequency to the RF electrode; and a pulsed voltage applying device for applying a pulsed voltage to the RF electrode so as to be superimposed with the RF voltage and which includes a controller for controlling a timing in application of the pulsed voltage and defining a pause period of the pulsed voltage.

    摘要翻译: 基板等离子体处理装置包括在预定的真空条件下将内部抽真空的室; RF电极,其设置在所述室中并且构造成在其主表面上保持要处理的基板; 在所述室中与所述RF电极相对设置的对置电极; RF电压施加装置,用于向RF电极施加预定频率的RF电压; 以及脉冲电压施加装置,用于向RF电极施加脉冲电压以与RF电压叠加,并且包括用于控制施加脉冲电压的定时并且限定脉冲电压的暂停时段的控制器。

    Projection type image display apparatus
    76.
    发明申请
    Projection type image display apparatus 失效
    投影型图像显示装置

    公开(公告)号:US20050035943A1

    公开(公告)日:2005-02-17

    申请号:US10943860

    申请日:2004-09-20

    申请人: Akihiro Kojima

    发明人: Akihiro Kojima

    CPC分类号: H04N9/3129

    摘要: Disclosed herein is a projection type image display apparatus comprising projection means for projecting an image on an image-displaying screen by scanning with a laser beam, and detection means for detecting the presence or absence of an intruding object between the projection means and the screen, wherein detection by the detection means is conducted relative to a position preceding the laser beam in the scan direction of the laser beam.

    摘要翻译: 这里公开了一种投影型图像显示装置,包括用于通过用激光束扫描在图像显示屏幕上投影图像的投影装置,以及检测装置,用于检测投影装置和屏幕之间是否存在入侵物体, 其中,所述检测装置的检测相对于所述激光束在所述激光束的扫描方向上的位置前进。

    Plasma processing apparatus with reduced parasitic capacity and loss in RF power
    77.
    发明授权
    Plasma processing apparatus with reduced parasitic capacity and loss in RF power 有权
    具有降低的寄生容量和RF功率损耗的等离子体处理设备

    公开(公告)号:US06780278B2

    公开(公告)日:2004-08-24

    申请号:US09892481

    申请日:2001-06-28

    IPC分类号: H01L2100

    CPC分类号: H01J37/32082 H01J37/32532

    摘要: A plasma processing apparatus comprises a grounded housing, a thin RF plate electrode, an opposite electrode facing the RF plate electrode, and a RF power source for applying a radio frequency to either the RF plate electrode or the opposite electrode to produce plasma between the two electrodes. If the radio frequency applied to the electrode is f (MHz), the parasitic capacity C (pF) between the grounded portion of the housing and a conductive portion through which the radio frequency propagates is less than 1210*f−0.9. The thickness of the RF plate electrode is 1 mm to 6 mm, and it is supported by a heat sink. The heat sink has a coolant passage in the proximity to the RF plate electrode. The heat sink also has a groove or a cavity in addition to the coolant passage, thereby reducing the value of the dielectric constant of the heat sink as a whole.

    摘要翻译: 等离子体处理装置包括接地壳体,薄RF板电极,面对RF板电极的相对电极和用于将射频施加到RF板电极或相对电极的RF电源,以在两者之间产生等离子体 电极。 如果施加到电极的射频为f(MHz),则壳体的接地部分与射频传播的导电部分之间的寄生电容C(pF)小于1210×f <-0.9>。 RF板电极的厚度为1mm〜6mm,由散热片支撑。 散热器在RF板电极附近具有冷却剂通道。 除了冷却剂通道之外,散热器还具有凹槽或空腔,从而整体上降低了散热器的介电常数值。

    Plasma processing apparatus and plasma processing method
    80.
    发明授权
    Plasma processing apparatus and plasma processing method 有权
    等离子体处理装置和等离子体处理方法

    公开(公告)号:US08545670B2

    公开(公告)日:2013-10-01

    申请号:US12209617

    申请日:2008-09-12

    IPC分类号: C23F1/00 H01L21/306 C23C16/00

    摘要: A plasma processing apparatus for processing a substrate using plasma includes a first electrode configured to mount the substrate, a second electrode disposed to face the first electrode with a predetermined space, a chamber containing the first electrode and the second electrode, the chamber being capable of adjusting an inside atmosphere, a first electric power source device configured to apply a first RF voltage for controlling a self-bias voltage generated on the substrate to the first electrode, the first electric power source device applying a substantially constant width and a substantially constant value in a peak-to-peak voltage of an RF voltage of a first frequency at intervals, and a second electric power source device configured to apply a second RF voltage of a second frequency for generating plasma between the first and second electrodes to one of the first electrode and the second electrode.

    摘要翻译: 使用等离子体处理衬底的等离子体处理装置包括:被配置为安装衬底的第一电极,以预定空间设置为面对第一电极的第二电极,容纳第一电极和第二电极的腔室, 调整内部气氛的第一电源装置,被配置为向第一电极施加用于控制在基板上产生的自偏压的第一RF电压的第一电源装置,施加基本上恒定的宽度和基本恒定的值的第一电力源装置 在间隔的第一频率的RF电压的峰峰值电压中,以及第二电源装置,被配置为将第二频率的第二RF电压施加到第一和第二电极之间的等离子体之一 第一电极和第二电极。