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    Semiconductor light emitting device mounting substrates including a conductive lead extending therein
    72.
    发明授权
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein 有权
    半导体发光器件的安装基板包括在其中延伸的导电引线

    公开(公告)号：US07777247B2

    公开(公告)日：2010-08-17

    申请号：US11035716

    申请日：2005-01-14

    申请人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    发明人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    IPC分类号： H01L29/24 ,  H01L23/34

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

    Power surface mount light emitting die package
    73.
    发明授权
    Power surface mount light emitting die package 有权
    功率表面贴装发光管芯封装

    公开(公告)号：US07775685B2

    公开(公告)日：2010-08-17

    申请号：US11703721

    申请日：2007-02-08

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V3/00 ,  H01L23/34

    CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

    摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

    Composite leadframe LED package and method of making the same
    75.
    发明授权
    Composite leadframe LED package and method of making the same 有权
    复合引线框LED封装及其制作方法

    公开(公告)号：US07692206B2

    公开(公告)日：2010-04-06

    申请号：US10721654

    申请日：2003-11-25

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： H01L33/00

    CPC分类号： H01L33/64 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Light emitting die package is disclosed. The die package includes a leadframe, a bottom heatsink, a top heatsink, a reflector and a lens. The top and bottom heatsinks are thermally coupled but electrically insulated from the leadframe. The leadframe includes a plurality of leads and defines a mounting pad for mounting LEDS. The top heatsink defines an opening over the mounting pad. The reflector is coupled to the top heatsink at the opening. The lens is placed over the opening defining an enclosed cavity over the mounting pad. At least one light emitting device (LED) is mounted on the mounting pad within the cavity. Encapsulant optically couples the LED to its surrounding surfaces to maximize its optical performance. When energized, the LED generates light and heat. The light is reflected by the reflector and operated on by the lens. The heat is dissipated by the top and the bottom heatsinks.

    摘要翻译： 公开了发光管芯封装。 模具封装包括引线框架，底部散热器，顶部散热器，反射器和透镜。 顶部和底部散热器热耦合但与引线框架电绝缘。 引线框架包括多个引线并且限定了用于安装LEDS的安装焊盘。 顶部散热器在安装垫上限定一个开口。 反射器在开口处连接到顶部散热器。 透镜被放置在开口上方，在安装垫上方形成封闭空腔。 至少一个发光器件（LED）安装在腔内的安装垫上。 封装材料将LED光耦合到其周围的表面，以最大化其光学性能。 通电时，LED会产生光和热。 光被反射器反射并由透镜操作。 热量由顶部和底部散热片消散。

    Power surface mount light emitting die package
    77.
    发明授权
    Power surface mount light emitting die package 有权
    功率表面贴装发光管芯封装

    公开(公告)号：US07659551B2

    公开(公告)日：2010-02-09

    申请号：US11694046

    申请日：2007-03-30

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V29/00 ,  H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.

    摘要翻译： 提供了一种发光管芯（LED）封装，其包括具有迹线的衬底，安装在衬底上并连接到迹线上的LED以及覆盖LED的密封剂。 该包装包括位于密封剂上并基本上覆盖LED的透镜。 透镜相对于基板自由移动。

    Power light emitting die package with reflecting lens and the method of making the same
    78.
    发明申请
    Power light emitting die package with reflecting lens and the method of making the same 有权

    公开(公告)号：US20080283861A1

    公开(公告)日：2008-11-20

    申请号：US12215319

    申请日：2008-06-26

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： H01L33/00

    CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

    LED package die having a small footprint
    80.
    发明授权
    LED package die having a small footprint 有权
    LED封装模具占地面积小

    公开(公告)号：US07078254B2

    公开(公告)日：2006-07-18

    申请号：US11034598

    申请日：2005-01-13

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： H01L21/00

    CPC分类号： H01L33/647 ,  F21K9/00 ,  F21V29/507 ,  F21V29/74 ,  F21V29/76 ,  F21V29/83 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads are attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

    摘要翻译： 公开了一种发光管芯封装及其制造方法。 模具封装包括具有凹槽的杆基板，附着到凹槽的导线引线和安装在杆基板上的发光二极管（LED）。 还耦合到衬底的是套筒，反射器和透镜。 为了制造发光管芯封装，形成长衬底并且引线附接到衬底。 然后，将包括附接线引线的基板切割以预先确定长度以形成单独的基板。 对于每个茎基板，LED，反射器和透镜被耦合。