公开(公告)号：US08608349B2

公开(公告)日：2013-12-17

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： F21V3/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

公开(公告)号：US08446004B2

公开(公告)日：2013-05-21

申请号：US12215319

申请日：2008-06-26

申请人： Ban P. Loh ,  Gerald H. Negley

发明人： Ban P. Loh ,  Gerald H. Negley

IPC分类号： H01L23/34

CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

公开(公告)号：US20120061702A1

公开(公告)日：2012-03-15

申请号：US13149197

申请日：2011-05-31

申请人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Bernd P. Keller

发明人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Bernd P. Keller

IPC分类号： H01L33/58 ,  H01L33/52

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

摘要翻译： 用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域 并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。 第一和第二弯液面控制特征可以与管芯附接垫基本共面。 封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂 。 还公开了方法实施例。

公开(公告)号：US08123375B2

公开(公告)日：2012-02-28

申请号：US12093698

申请日：2006-11-17

申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

IPC分类号： F21V23/00

CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第一颜色的LED在所述瓷砖的第一端具有阴极接触（28），在所述第二颜色的第二端具有阳极接触（26） 瓦。

公开(公告)号：US20120025254A1

公开(公告)日：2012-02-02

申请号：US13253657

申请日：2011-10-05

申请人： Ban P. Loh ,  Nicholas W. Medendorp, JR.

发明人： Ban P. Loh ,  Nicholas W. Medendorp, JR.

IPC分类号： H01L33/58

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/34 ,  B29C2045/14844 ,  B29K2083/00 ,  B29K2995/0018 ,  B29L2011/0016 ,  H01L24/97 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

摘要翻译： 半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。 衬底可以包括被配置为将半导体发光器件安装在其中的空腔。 半导体发光器件安装在基板上并电连接到基板的接触部分。 衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。 之前可以在空腔中的电连接的半导体发光器件上施加软树脂。 还提供了半导体发光器件衬底条。

公开(公告)号：US20110186895A1

公开(公告)日：2011-08-04

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： H01L33/60

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

公开(公告)号：US07910944B2

公开(公告)日：2011-03-22

申请号：US11744286

申请日：2007-05-04

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： Side-mountable semiconductor light emitting device packages include an electrically insulating substrate having a front face and a back face and a side face extending therebetween. The side face is configured for mounting on an underlying surface. An electrically conductive contact is provided proximate an edge of the substrate on the back face of the substrate and/or on a recessed region on the side face of the substrate. The contact is positioned to be positioned proximate an electrical connection region of the underlying surface when the semiconductor light emitting device package is side mounted on the underlying surface. A conductive trace extends along the front face of the substrate and is electrically connected to the contact. A semiconductor light emitting device is mounted on the front face of the substrate and electrically connected to the conductive trace.

摘要翻译： 侧面安装的半导体发光器件封装包括具有正面和背面的电绝缘基板和在其间延伸的侧面。 侧面被配置为安装在下面的表面上。 在衬底的背面和/或衬底的侧面上的凹陷区域上靠近衬底的边缘设置导电触点。 当半导体发光器件封装侧面安装在下面的表面上时，触点定位成位于下表面的电连接区域附近。 导电迹线沿着衬底的前表面延伸并且电连接到触点。 半导体发光器件安装在基板的正面上并与导电迹线电连接。

公开(公告)号：US07805048B2

公开(公告)日：2010-09-28

申请号：US11431304

申请日：2006-05-10

申请人： Ban P. Loh ,  Nicholas Medendorp

发明人： Ban P. Loh ,  Nicholas Medendorp

IPC分类号： G02B6/10

CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Sideways emission enhancements are described for light emitting diode (LED) lighting solutions having a wide variety of applications. While a typical LED lighting device has a substantial portion of its light emitted near a normal to the semiconductor photonic chip emitting the light, the present approach may suitable provide a compact, easily manufacturable device with good thermal design characteristics and a changed emission pattern without changing the horizontal mounting plane of the semiconductor photonic chip.

摘要翻译： 针对具有各种应用的发光二极管（LED）照明解决方案描述了侧向发射增强。 虽然典型的LED照明装置的光的大部分发射在发射光的半导体光子芯片的正常附近，但是本方法可以适合提供具有良好的热设计特性和改变的发射图案的紧凑的，易于制造的装置，而不改变 半导体光子芯片的水平安装平面。

公开(公告)号：US20100109029A1

公开(公告)日：2010-05-06

申请号：US12685883

申请日：2010-01-12

申请人： Ban P. Loh ,  Nicholas Medendorp, JR. ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas Medendorp, JR. ,  Bernd Keller

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

公开(公告)号：US07655957B2

公开(公告)日：2010-02-02

申请号：US11412381

申请日：2006-04-27

申请人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

IPC分类号： H01L29/22 ,  H01L23/48

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。