摘要:
A semiconductor memory having charge trapping memory cells and fabrication method thereof. The direction of current flow of each channel region of the memory transistors runs transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive local interconnects of source-drain regions are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and connected to the bit lines, wherein gate electrodes are arranged in trenches at least partly formed in the memory substrate.
摘要:
To manufacture a memory device, a gate dielectric layer is formed over a semiconductor body and a gate electrode layer is formed over the gate dielectric layer. The gate electrode layer is structured to form a gate electrode with sidewalls. An etching process is performed to remove parts of the gate dielectric layer from beneath the gate electrode on opposite sides of the gate electrode. Boundary layers, e.g., oxide layers, are formed on an upper surface of the semiconductor body and a lower surface of the gate electrode adjacent where the gate dielectric has been removed thereby leaving spaces. Charge-trapping layer material can then be deposited to fill the spaces. Source and drain regions are then formed in the semiconductor body adjacent the gate electrode.
摘要:
An inverter which is at least partially formed in a semiconductor substrate includes a first transistor with a first channel and a second transistor with a second channel, wherein each of the first and second transistors is formed as a FinFET with ridge shaped channels. The first and second gate electrodes of the first and second transistors are adjacent to the first and second channels on at least three sides of the corresponding channel. The first gate electrode extends from a top surface of the first channel ridge to a first ridge depth along the first channel, and the second gate electrode extends from a top surface of the second channel ridge to a second ridge depth along the second channel, wherein the first ridge depth is greater than the second ridge depth.
摘要:
A semiconductor memory having charge trapping memory cells, where the direction of current flow of each channel region of the memory transistors runs transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive local interconnects of source-drain regions are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and connected to the bit lines, wherein gate electrodes are arranged in trenches at least partly formed in the memory substrate.
摘要:
The present invention relates to a reprogrammable non-volatile memory cell which comprises a selection transistor and a data storage element. The invention further relates to a method of fabricating such a memory cell, as well as to a memory cell array comprising a number of such memory cells.
摘要:
The semiconductor memory device has a substrate with a main surface, on which parallel trenches are arranged. A memory layer is disposed at the sidewalls of the trenches, and gate electrodes are disposed in the trenches. Buried bitlines are formed as doped regions between neighboring trenches. The buried bitlines abut the sidewalls of the trenches and comprise upper surfaces, which are arranged at a specified distance from the bottom of the trenches. Source/drain regions are formed by sections of the buried bitlines.
摘要:
A memory device includes an array of memory cells that include a memory element having a non-reactive resistance whose magnitude is programmable to assume a high-resistance state or a low-resistance state. Sets of first and second lines provide access to the memory cells, wherein the memory element of each memory cell is coupled between one of the first lines and one of the second lines. A checking unit determines whether to invert data values to be stored in memory cells coupled to at least a section of respective ones of the first lines based on a number of memory cells that would be programmed in the high-resistance state or the low-resistance state as a result of the data values in order to reduce the number memory cells programmed in the low-resistance state and the resulting leakage current.
摘要:
Transistor bodies of semiconductor material located at a main surface of a semiconductor substrate between shallow trench isolations are provided with a rounded or curved upper surface. A floating gate electrode is arranged above said upper surface and electrically insulated from the semiconductor material by a tunnel dielectric having essentially the same tiny thickness throughout a primary tunnel area encompassing the area of curvature. The floating gate electrode may bridge the transistor body and is covered with a coupling dielectric provided for a control gate electrode, which forms part of a wordline.
摘要:
A semiconductor product includes a substrate having a substrate surface. A plurality of wordlines are arranged at a distance from one another and running along a first direction. A plurality of conductive contact structures are provided between the wordlines. The product also includes a plurality of filling structures. Each filling structure separates from one another two respective contact structures arranged between two respective wordlines. The two respective contact structures are arranged at a distance from one another in the first direction. In the preferred embodiment, the contact structures have a top side provided at a distance from the substrate surface and extends to the substrate surface. The contact structures at the substrate surface have a width along the first direction that is larger than a width of the top sides of the contact structures along the first direction.
摘要:
The storage layer (6) is in each case present above a region in which the channel region (3) adjoins a source/drain region (2) and is in each case interrupted above an intervening middle part of the channel region (3). The storage layer (6) is formed by material of the gate dielectric (4) and contains silicon or germanium nanocrystals or nanodots introduced through ion implantation. The gate electrode (5) is widened at the flanks by electrically conductive spacers (7).