公开(公告)号：US07263396B2

公开(公告)日：2007-08-28

申请号：US10900146

申请日：2004-07-28

申请人： Yunquan Chen ,  Luya Li ,  Rakesh Kumar Sethi ,  Ming Sun ,  Christopher Grant Denny ,  Scott Howard Phillips

发明人： Yunquan Chen ,  Luya Li ,  Rakesh Kumar Sethi ,  Ming Sun ,  Christopher Grant Denny ,  Scott Howard Phillips

IPC分类号： A61B5/00

CPC分类号： A61B5/14552 ,  A61B5/6816

摘要： A sensor assembly for monitoring physiological characteristics interfaces to a subject's ear. The sensor assembly has a projection that projects into the subject's concha. The projection may have a notch to accommodate the subject's anti-tragus. A clip connected to the projection holds a sensor against the subject's lobule. The sensor may comprise a pulse-oximetry-type sensor.

摘要翻译： 用于监测生理特征的传感器组件与受试者的耳朵接口。 传感器组件具有投影到被检者的外观中的突出部。 该投影可以具有凹口以适应受试者的反耳屏。 连接到突起的夹子将传感器保持在对象的小叶上。 传感器可以包括脉搏血氧测定型传感器。

公开(公告)号：US20070075406A1

公开(公告)日：2007-04-05

申请号：US11242625

申请日：2005-09-30

申请人： Yueh-Se Ho ,  Ming Sun

发明人： Yueh-Se Ho ,  Ming Sun

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/73221 ,  H01L2224/84345 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A wafer level method for metallizing source, gate and drain contact areas of a semiconductor die includes the steps of (a) plating Ni onto the source, gate and drain contact areas of the semiconductor die, and (b) plating Au onto the source, gate and drain contact areas of the semiconductor die after completing step (a). A semiconductor package having plate interconnections between leadframe leads and the metalized passivation areas is also disclosed.

摘要翻译： 用于金属化半导体管芯的源极，栅极和漏极接触区域的晶片级方法包括以下步骤：（a）将Ni镀在半导体管芯的源极，栅极和漏极接触区域上，和（b）将Au电镀到源极上， 在完成步骤（a）之后半导体管芯的栅极和漏极接触区域。 还公开了在引线框引线和金属化钝化区之间具有板互连的半导体封装。

公开(公告)号：US20070057368A1

公开(公告)日：2007-03-15

申请号：US11226913

申请日：2005-09-13

申请人： Yueh-Se Ho ,  Ming Sun

发明人： Yueh-Se Ho ,  Ming Sun

IPC分类号： H01L23/48 ,  H01L23/28

CPC分类号： H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having metalized source and gate areas separated by a passivation area, a patterned source connection coupling the source lead to the semiconductor die metalized source area, a patterned gate connection coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.

摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有金属化源的半导体管芯和由钝化区域分开的栅极区域，将源极引线耦合到半导体管芯金属化源 将栅极引线耦合到半导体管芯金属化栅极区域的图案化栅极连接，耦合到漏极引线的半导体管芯漏极区域和覆盖半导体管芯和漏极，源极和栅极引线的至少一部分的密封剂。

公开(公告)号：US20050087533A1

公开(公告)日：2005-04-28

申请号：US10690939

申请日：2003-10-22

申请人： James Robertson ,  Bernard Primiano ,  Ming Sun

发明人： James Robertson ,  Bernard Primiano ,  Ming Sun

IPC分类号： A47F3/04 ,  B60N3/10 ,  F25B21/02 ,  B65D51/18

CPC分类号： A47F3/0404 ,  B60H1/00592 ,  B60N3/104 ,  F25B21/02 ,  F25B2321/0251 ,  F25D2400/12

摘要： A lid for a cold box has a shell-like configuration with front and rear shell members hingedly connected. The front shell member pivots relative to the rear shell member to provide access to the interior of the cold box when the front shell member is lifted by a handle. A viewing window is provided in the front shell member. The rear shell member is vented to provide passageways for the intake and outtake of air.

公开(公告)号：US06615995B2

公开(公告)日：2003-09-09

申请号：US09999317

申请日：2001-10-31

申请人： Bernard Primiano ,  Ming Sun

发明人： Bernard Primiano ,  Ming Sun

IPC分类号： A47F104

CPC分类号： A47F1/12

摘要： An elongate display track device has one or more intermediate sections, a front section with a front piece and product identification panels, and a rear section with a stop member. The sections are frangibly connected to alter the length of the track device. The sections are releasably connected by keys and keyways. The length is changed by removing one or more intermediate sections, then re-attaching the rear section to provide the stop member. The front piece provides a surface along its bottom for a product identification label. Arms upstanding from the front track section support a panel which provides a surface for product identification.

摘要翻译： 细长的显示轨道装置具有一个或多个中间部分，具有前部件和产品标识面板的前部部分和具有止动部件的后部部分。 这些部分是易碎连接的，以改变轨道装置的长度。 这些部分通过键和键槽可释放地连接。 通过移除一个或多个中间部分来改变长度，然后重新附接后部以提供止挡部件。 前部件沿其底部提供了一个表面，用于产品识别标签。 从前轨道部分直立的武器支撑一个面板，该面板为产品识别提供了一个表面。

公开(公告)号：US5962336A

公开(公告)日：1999-10-05

申请号：US953930

申请日：1997-10-20

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： G01N33/543

CPC分类号： G01N33/54366 ,  Y10S435/805 ,  Y10S435/81 ,  Y10S435/97 ,  Y10S435/973 ,  Y10S435/975 ,  Y10S436/805 ,  Y10S436/81

摘要： A multi-test panel with several test strips containing a separate and different immunochromatographic system, each strip being housed in a separate structure so that the structures may be joined together and interchanged, depending upon what substances within a fluid sample are being detected.

摘要翻译： 具有多个测试条的多测试面板包含单独和不同的免疫层析系统，每个条带以独立的结构容纳，使得结构可以连接在一起并互换，这取决于在检测流体样品内的什么物质。

公开(公告)号：US20160260876A1

公开(公告)日：2016-09-08

申请号：US14395094

申请日：2014-08-15

申请人： Ming SUN ,  Jian DAI ,  SHANGHAI OPPELLIGHTING CO., LTD.

发明人： Ming Sun ,  Wen-Jung Chuang ,  Xing-Bao Chen ,  Jian Dai

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/64 ,  H01L33/50 ,  H01L33/56

CPC分类号： H01L33/62 ,  F21K9/232 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/502 ,  H01L33/56 ,  H01L33/641 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075

摘要： The present invention is related to a LED light source and its manufacturing method. It is related to the LED technology field. The LED light source includes a glass case, LED chips sealed inside the glass case and the transparent substrate carrying the LED chips. The manufacturing method of the present invention is simple and easy.

摘要翻译： 本发明涉及一种LED光源及其制造方法。 它与LED技术领域有关。 LED光源包括玻璃外壳，密封在玻璃外壳内的LED芯片和承载LED芯片的透明基板。 本发明的制造方法简单易行。

公开(公告)号：US08513784B2

公开(公告)日：2013-08-20

申请号：US12726892

申请日：2010-03-18

申请人： Jun Lu ,  Ming Sun ,  Yueh-Se Ho ,  Kai Liu ,  Lei Shi

发明人： Jun Lu ,  Ming Sun ,  Yueh-Se Ho ,  Kai Liu ,  Lei Shi

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/37 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73263 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/84 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume.

摘要翻译： 本发明的特征在于具有第一，第二，第三和第四导电结构的引线框架封装，其中设置在其间的一对半导体管芯限定堆叠结构。 第一和第二结构与第一结构隔开并与第一结构重叠。 半导体管芯设置在第一和第二结构之间。 半导体管芯具有电连接到第一和第二结构的触点。 第三结构的一部分位于具有第二结构的一部分的共同平面中。 第三结构耦合到半导体管芯。 附加的半导体管芯附接到第一和第二结构中的一个。 第四结构与附加的半导体管芯电接触。 设置模塑料以封装所述包装的一部分，其中模制化合物的一部分设置在体积中。

公开(公告)号：US08487291B2

公开(公告)日：2013-07-16

申请号：US12362640

申请日：2009-01-30

申请人： Nurul Amin ,  Insik Jin ,  Wei Tian ,  Andrew James Wirebaugh ,  Venugopalan Vaithyanathan ,  Ming Sun

发明人： Nurul Amin ,  Insik Jin ,  Wei Tian ,  Andrew James Wirebaugh ,  Venugopalan Vaithyanathan ,  Ming Sun

IPC分类号： H01L47/00 ,  G11C11/00

CPC分类号： H01L45/16 ,  H01L45/085 ,  H01L45/1266 ,  H01L45/14

摘要： Programmable metallization memory cells having an active electrode, an opposing inert electrode and a variable resistive element separating the active electrode from the inert electrode. The variable resistive element includes a plurality of alternating solid electrolyte layers and electrically conductive layers. The electrically conductive layers electrically couple the active electrode to the inert electrode in a programmable metallization memory cell. Methods to form the same are also disclosed.

摘要翻译： 可编程金属化存储单元具有有源电极，相对的惰性电极和将活性电极与惰性电极分开的可变电阻元件。 可变电阻元件包括多个交替的固体电解质层和导电层。 导电层在可编程金属化存储单元中将有源电极电耦合到惰性电极。 也公开了形成它们的方法。

公开(公告)号：US08451563B1

公开(公告)日：2013-05-28

申请号：US13331208

申请日：2011-12-20

申请人： Jinqiu Zhang ,  Feng Liu ,  Shaoping Li ,  Ming Sun

发明人： Jinqiu Zhang ,  Feng Liu ,  Shaoping Li ,  Ming Sun

IPC分类号： G11B5/17 ,  G11B5/127

CPC分类号： G11B5/112 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315 ,  G11B5/3163 ,  Y10T29/49044

摘要： A method fabricates a side shield for a magnetic transducer having a nonmagnetic layer and an ABS location corresponding to an ABS. The nonmagnetic layer has a pole trench therein. The pole trench has a shape and location corresponding to the pole. A wet etchable layer is deposited. Part of the wet etchable layer resides in the pole trench. A pole is formed. The pole has a bottom and a top wider than the bottom in the pole tip region. Part of the pole in the pole tip region is in the pole trench on at least part of the wet etchable layer. At least parts of the wet etchable layer and the nonmagnetic layer are removed, forming an air bridge. The air bridge is between part of the pole at the ABS location and an underlying layer. Side shield layer(s) that substantially fill the air bridge are deposited.

摘要翻译： 一种制造用于具有对应于ABS的非磁性层和ABS位置的磁换能器的侧屏蔽的方法。 非磁性层在其中具有极沟槽。 极沟具有对应于极的形状和位置。 沉积湿蚀刻层。 湿蚀刻层的一部分位于极沟槽中。 一个极点形成。 电极具有底部和顶部宽于电极尖端区域中的底部。 极尖区域中的极的一部分在至少部分湿蚀刻层的极沟中。 去除湿蚀刻层和非磁性层的至少一部分，形成空气桥。 空气桥在ABS位置的极点的一部分和下层之间。 基本上填充空气桥的侧面屏蔽层被沉积。