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公开(公告)号：US20240431066A1
公开(公告)日：2024-12-26
申请号：US18340577
申请日：2023-06-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Chi Chou Cheng , Jeffrey Ho , Chih-Tsung Hu , Srinivasarao Konakalla , Tsung-Kai Lin , Arnab Sen , Chiu-Chun Wang , Jiacheng Wu
Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.
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公开(公告)号：US20240431061A1
公开(公告)日：2024-12-26
申请号：US18824590
申请日：2024-09-04
Applicant: Intel Corporation
Inventor： Alonso Rodriguez Chacon , Arturo Navarro Alvarez , Jeff Ku
Abstract: Example fittings that combine standoffs and springs for supporting thermal solutions are disclosed herein. An example electronic device includes a chassis; a substrate; a thermal solution; and a fitting to separate the substrate from the chassis and to separate the thermal solution from the substrate, the fitting including a standoff end and a spring end.
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公开(公告)号：US12146476B2
公开(公告)日：2024-11-19
申请号：US17561605
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Mark J. Gallina , Min Suet Lim , Jianfang Zhu
Abstract: Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
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公开(公告)号：US12130665B2
公开(公告)日：2024-10-29
申请号：US17230724
申请日：2021-04-14
Applicant: Intel Corporation
Inventor： Jeff Ku , Gavin Sung , Ivan Wang , Tim Liu , Jason Y. Jiang
CPC classification number: G06F1/1632 , G06F1/1616 , G06F1/1681 , G06F1/266 , H02J7/0042 , H02J7/0044 , H02J50/10 , H02J50/80
Abstract: An example portable computer disclosed herein includes a first housing, a keyboard carried by the first housing, a second housing pivotally coupled to the first housing, a display carried by the second housing, a wireless charger, and a pad to carry the wireless charger. The pad is pivotally coupled to the first housing. The pad is moveable relative to the first housing between a first orientation to position the wireless charger above the first housing and a second orientation to position the wireless charger adjacent the first housing. The pad to support a body part of a user adjacent the keyboard when the pad is in the first orientation. The pad is to support an external electronic device proximate the wireless charger when the pad is in the second orientation.
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公开(公告)号：US12082378B2
公开(公告)日：2024-09-03
申请号：US17131137
申请日：2020-12-22
Applicant: Intel Corporation
Inventor： Aleksander Magi , Jeff Ku , Juha Paavola , Prakash Kurma Raju
CPC classification number: H05K7/20454 , F16F7/128 , F16F2222/025 , F16F2230/0023 , F16F2230/48
Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.
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Patent Agency Ranking
公开(公告)号：US12081952B2
公开(公告)日：2024-09-03
申请号：US17111130
申请日：2020-12-03
Applicant: Intel Corporation
Inventor： Shantanu D. Kulkarni , Jeff Ku , Sumod Cherukkate , Tongyan Zhai , Srikanth Potluri , Jordan E. Maslov
IPC: H04R3/04 , G10K11/175 , H04R1/22 , H05K7/20
CPC classification number: H04R3/04 , G10K11/175 , G10K11/1752 , H04R1/222 , H05K7/20
Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.
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77.发明公开公开(公告)号：US20240244772A1
公开(公告)日：2024-07-18
申请号：US18619554
申请日：2024-03-28
Applicant: Intel Corporation
Inventor： Smit Kapila , Jeff Ku , Min Suet Lim , Sarma Vmk Vedhanabhatla
IPC: H05K5/02
CPC classification number: H05K5/0213
Abstract: Techniques are described to dynamically adjust the open air ratio (OAR) while ensuring compliance with regulatory requirements. An adjustable thermal vent assembly is described that dynamically adjusts the OAR for inlet/outlet vents depending on the current use case. The adjustable thermal vent assembly functions to increase the grating spacing only when a triggering condition is met that ensures that a corresponding thermal vent location is inaccessible. Such temporarily inaccessible regions may include the bottom cover of an electronic device when positioned on the surface of an object, for thermal intake vents, or the rear portion of an electronic device when the display cover exceeds a predetermined angle, for thermal exhaust vents.
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公开(公告)号：US11662777B2
公开(公告)日：2023-05-30
申请号：US17893931
申请日：2022-08-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Tim Liu , Yihua Lai , Lance Lin , Gavin Sung
IPC: G06F1/16 , G06F3/02 , G06F3/0354
CPC classification number: G06F1/1662 , G06F1/1616 , G06F1/1647 , G06F1/1681 , G06F3/0213 , G06F3/03547
Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.
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公开(公告)号：US20230045113A1
公开(公告)日：2023-02-09
申请号：US17893931
申请日：2022-08-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Tim Liu , Yihua Lai , Lance Lin , Gavin Sung
IPC: G06F1/16 , G06F3/02 , G06F3/0354
Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.
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公开(公告)号：US11388344B2
公开(公告)日：2022-07-12
申请号：US17150723
申请日：2021-01-15
Applicant: Intel Corporation
Inventor： Jeff Ku , Tom Chen , Vincent Hung
Abstract: System and method for enabling capturing of multiple images from a display device in which one or more image capturing devices disposed, at least partially, in the display device are controllably oriented to capture one or more views of a subject for combining (e.g., via optical tiling of captured image data) into a composite view.
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