摘要:
The invention is intended to present an insulated gate type semiconductor device that can be manufactured easily and its manufacturing method while realizing both higher withstand voltage design and lower on-resistance design. The semiconductor device comprises N+ source region 31, N+ drain region 11, P− body region 41, and N− drift region 12. By excavating part of the upper side of the semiconductor device, a gate trench 21 is formed. The gate trench 21 incorporates the gate electrode 22. A P floating region 51 is provided beneath the gate trench 21. A further trench 35 differing in depth from the gate trench 21 may be formed, a P floating region 54 being provided beneath the trench 25.
摘要:
A semiconductor device includes: a semiconductor substrate having first and second semiconductor layers; an IGBT having a collector region, a base region in the first semiconductor layer, an emitter region in the base region, and a channel region in the base region between the emitter region and the first semiconductor layer; a diode having an anode region in the first semiconductor layer and a cathode electrode on the first semiconductor layer; and a resistive region. The collector region and the second semiconductor layer are disposed on the first semiconductor layer. The resistive region for increasing a resistance of the second semiconductor layer is disposed in a current path between the channel region and the cathode electrode through the first semiconductor layer and the second semiconductor layer with bypassing the collector region.
摘要:
A semiconductor device includes: a semiconductor substrate having first and second semiconductor layers; an IGBT having a collector region, a base region in the first semiconductor layer, an emitter region in the base region, and a channel region in the base region between the emitter region and the first semiconductor layer; a diode having an anode region in the first semiconductor layer and a cathode electrode on the first semiconductor layer; and a resistive region. The collector region and the second semiconductor layer are disposed on the first semiconductor layer. The resistive region for increasing a resistance of the second semiconductor layer is disposed in a current path between the channel region and the cathode electrode through the first semiconductor layer and the second semiconductor layer with bypassing the collector region.
摘要:
A vertical type MOS field effect transistor has a super junction structure between a source electrode and an N+-type drain region. The super junction structure is constituted by a plurality of P-type single crystal silicon regions and a plurality of N-type single crystal silicon regions. Each of the plurality of P-type single crystal silicon regions and each of the plurality of N-type single crystal silicon regions are arrayed alternately. The super junction has two parts, that is, a cell forming region where a MOS structure is disposed and a peripheral region located at a periphery of the cell forming region. The source electrode contacts one of the P-type single crystal silicon regions in the peripheral region while disposed away from an end portion of the peripheral region that is located at an outermost in the peripheral region.
摘要:
A vertical type MOS field effect transistor has a super junction structure between a source electrode and an N+-type drain region. The super junction structure is constituted by a plurality of P-type single crystal silicon regions and a plurality of N-type single crystal silicon regions. Each of the plurality of P-type single crystal silicon regions and each of the plurality of N-type single crystal silicon regions are arrayed alternately. The super junction has two parts, that is, a cell forming region where a MOS structure is disposed and a peripheral region located at a periphery of the cell forming region. The source electrode contacts one of the P-type single crystal silicon regions in the peripheral region while disposed away from an end portion of the peripheral region that is located at an outermost in the peripheral region.
摘要:
A silicon carbide semiconductor device having a high blocking voltage, low loss, and a low threshold voltage is provided. An n.sup.+ type silicon carbide semiconductor substrate 1, an n.sup.- type silicon carbide semiconductor substrate 2, and a p type silicon carbide semiconductor layer 3 are successively laminated on top of one another. An n.sup.+ type source region 6 is formed in a predetermined region of the surface in the p type silicon carbide semiconductor layer 3, and a trench 9 is formed so as to extend through the n.sup.+ type source region 6 and the p type silicon carbide semiconductor layer 3 into the n.sup.- type silicon carbide semiconductor layer 2. A thin-film semiconductor layer (n type or p type) 11a is extendedly provided on the surface of the n.sup.+ type source region 6, the p type silicon carbide semiconductor layer 3, and the n.sup.- type silicon carbide semiconductor layer 2 in the side face of the trench 9.
摘要翻译:提供了具有高阻断电压,低损耗和低阈值电压的碳化硅半导体器件。 n +型碳化硅半导体衬底1,n型碳化硅半导体衬底2和p型碳化硅半导体层3相互层叠在一起。 在p型碳化硅半导体层3的表面的预定区域中形成n +型源极区6,并且形成沟槽9,以延伸穿过n +型源极区6和p型碳化硅半导体层 在n型碳化硅半导体层2的表面上延伸设置有薄膜半导体层(n型或p型)11a,在n +型源极区6,p型碳化硅半导体层3的表面上, n型碳化硅半导体层2在沟槽9的侧面。
摘要:
In an on-vehicle alternator, both the magnetic flux variation frequency and maximum flux density are decreased sufficiently to thereby decrease the internal iron loss and thereby realize an increase in the current generation efficiency. The on-vehicle alternator comprises a rotor wherein magnetic pole cores that are polarized by a rotor coil to alternately different polarities are circumferentially disposed on the outer periphery thereof at prescribed equi-angular intervals. A permanent magnet which is embedded within a resin-made retainer body is provided between the magnetic pole cores and has side faces, as viewed circumferentially, which are polarized respectively to the same polarities as those of adjacent respective magnetic pole cores to thereby vary the magnetic flux quantity directed toward stator coils so as to exhibit a circumferential gentle curve. A rectifier is constructed using SiC-MOS transistors so that it is conductive and operative to thereby charge a battery with the current developed in the stator coils only when the alternating current voltages generated in the stator coils have become higher than the battery voltage.
摘要:
In an insulated gate type field effect transistor and a manufacturing method of the same, a diffusion region is formed in a semiconductor substrate under an oxidizing atmosphere by thermal diffusion, and a first conductivity type semiconductor layer is formed on the semiconductor substrate by vapor-phase epitaxy after the formation of the diffusion region. Thereafter, the surface of the semiconductor layer is flattened, and a gate insulating film and a gate electrode are formed on the flattened semiconductor layer. Further, a well region as well as a source region are formed in the semiconductor layer to form an insulated gate type field effect transistor. As the surface of the semiconductor layer in which the insulated gate type field effect transistor is formed is flattened, even if the embedded region is formed in the wafer, the gate-source insulation withstand voltage characteristic can be prevented from being deteriorated.
摘要:
A groove is formed on the surface of a semiconductor substrate composed of silicon carbide and a first thermal oxidation film is formed by executing thermal oxidation on a damaged layer of groove inner walls. Then, the first thermal oxidation film is removed so that the damaged layer can be removed. Since a second thermal oxidation film is formed after the damaged layer is removed, the second thermal oxidation film is uniform. A silicon carbide semiconductor device can be achieved with less side etching because substantially a (0001) carbon face of a cubic system is chosen as the plane orientation of the semiconductor substrate.
摘要:
Disclosed is a local area network for a vehicle which comprises a plurality of terminal stations each having an input/output port for various signals, a main-loop formed by series connection of the terminal stations and transmission lines, a sub-loop arranged in parallel to the main-loop and formed by series connection of the terminal stations and transmission lines, and controllers. One of the terminal stations receives a large amount of information such as an audio signal from an audio transmitter and one of the other terminal stations supplies a large amount of information such as an audio signal to an audio receiver. When the main-loop is in a normal operation state, the main-loop operates as a token-passing system and the sub-loop acts as a direct transmission route from one of the terminal stations to another terminal station, and when the main-loop is in an abnormal operation state, the main-loop is coupled with the sub-loop and the transmitting of information such as an audio signal is stopped, and simultaneously, the sub-loop is switched to the token-passing system. Thus, the double loops, i.e., the main-loop and the sub-loop, are effectively utilized. In addition, any decrease in the reliability of various signals transmission when a failure of the main-loop occurs, can be prevented.