Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
    72.
    发明授权
    Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings 有权
    使用导热垫圈和O形圈的电极组件和等离子体处理室

    公开(公告)号:US08216418B2

    公开(公告)日:2012-07-10

    申请号:US12112112

    申请日:2008-04-30

    IPC分类号: C23F1/00 H01L21/306 C23C16/00

    摘要: The present invention relates generally to plasma processing and, more particularly, to plasma processing chambers and electrode assemblies used therein. According to one embodiment of the present invention, an electrode assembly is provided comprising a thermal control plate, a silicon-based showerhead electrode, a thermally conductive gasket, and a plurality of o-rings, wherein respective profiles of a frontside of the thermal control plate and a backside of the showerhead electrode cooperate to define a thermal interface. The thermally conductive gasket and the o-rings are positioned along this thermal interface with the o-rings separating the thermally conductive gasket from the showerhead passages such that the gasket is isolated from the showerhead passages. The gasket may facilitate heat transfer across the thermal interface from the showerhead electrode to the thermal control plate.

    摘要翻译: 本发明一般涉及等离子体处理,更具体地,涉及其中使用的等离子体处理室和电极组件。 根据本发明的一个实施例,提供一种电极组件,其包括热控制板,硅基喷头电极,导热衬垫和多个O形环,其中热控制器的前侧的各个轮廓 板和喷头电极的背面配合以限定热界面。 导热垫圈和O形环沿着该热界面定位,O形环将导热垫圈与喷头通道分开,使得垫圈与喷头通道隔离。 衬垫可以促进从喷头电极到热控制板的热界面的热传递。

    MODULATED MULTI-FREQUENCY PROCESSING METHOD
    73.
    发明申请
    MODULATED MULTI-FREQUENCY PROCESSING METHOD 有权
    调制多频处理方法

    公开(公告)号:US20100253224A1

    公开(公告)日:2010-10-07

    申请号:US12621590

    申请日:2009-11-19

    IPC分类号: H05B31/26

    摘要: A method is provided for operating a processing system having a space therein arranged to receive a gas and an electromagnetic field generating portion operable to generate an electromagnetic field within the space. The method includes providing a gas into the space, and operating the electromagnetic field generating portion with a driving potential to generate an electromagnetic field within the space to transform at least a portion of the gas into plasma. The driving potential as a function of time is based on a first potential function portion and a second potential function portion. The first potential function portion comprises a first continuous periodic portion having a first amplitude and a first frequency. The second potential function portion comprises a second periodic portion having an maximum amplitude portion, and minimum amplitude portion and a duty cycle. The maximum amplitude portion is a higher amplitude than the minimum amplitude portion. The duty cycle is the ratio of a duration of the maximum amplitude portion to the sum of the duration of the maximum amplitude portion and the duration of the minimum amplitude portion. The second periodic portion additionally has a second frequency during the maximum amplitude portion. An amplitude modulation of the second periodic portion is phase locked to the first continuous periodic portion.

    摘要翻译: 提供了一种操作处理系统的方法,该处理系统具有布置成接收气体的空间和可操作以在该空间内产生电磁场的电磁场产生部分。 所述方法包括向所述空间提供气体,以及利用驱动电位操作所述电磁场产生部分,以在所述空间内产生电磁场,以将所述气体的至少一部分转化为等离子体。 作为时间的函数的驱动电位基于第一潜在功能部分和第二电位功能部分。 第一潜在功能部分包括具有第一幅度和第一频率的第一连续周期部分。 第二电位功能部分包括具有最大振幅部分和最小振幅部分和占空比的第二周期部分。 最大幅度部分比最小振幅部分的幅度更大。 占空比是最大幅度部分的持续时间与最大振幅部分的持续时间和最小振幅部分的持续时间之和的比率。 第二周期部分在最大振幅部分期间另外具有第二频率。 第二周期部分的幅度调制被锁相到第一连续周期部分。

    GROUNDED CONFINEMENT RING HAVING LARGE SURFACE AREA
    74.
    发明申请
    GROUNDED CONFINEMENT RING HAVING LARGE SURFACE AREA 有权
    具有大面积区域的接地约束环

    公开(公告)号:US20100252200A1

    公开(公告)日:2010-10-07

    申请号:US12570359

    申请日:2009-09-30

    IPC分类号: H01L21/3065

    摘要: A wafer processing system is provided for use with a driver and a material supply source. The driver is operable to generate a driving signal. The material supply source is operable to provide a material. The wafer processing system includes an upper confinement chamber portion, a lower confinement chamber portion, a confinement ring, and an electro-static chuck. The upper confinement chamber portion has an upper confinement chamber portion inner surface. The lower confinement chamber portion is detachably disposed in contact with the upper confinement chamber portion. The lower confinement chamber portion has a lower confinement chamber portion inner surface. The confinement ring is removably disposed in contact with the upper confinement chamber portion inner surface and the lower confinement chamber portion inner surface. The confinement ring has a confinement ring inner surface. The electro-static chuck has an electro-static chuck upper surface and is arranged to receive the driving signal. The upper confinement chamber portion, the lower confinement chamber portion, the confinement ring and the electro-static chuck are arranged such that the upper confinement chamber portion inner surface, the lower confinement chamber portion inner surface, the confinement ring inner surface and the electro-static chuck upper surface surround a plasma-forming space that is capable of receiving the material. The upper confinement chamber portion, the lower confinement chamber portion, the confinement ring and the electro-static chuck are operable to transform the material into a plasma when the electro-static chuck receives the driving signal. The confinement ring has a non-rectangular cross section.

    摘要翻译: 提供了与驱动器和材料供应源一起使用的晶片处理系统。 驱动器可操作以产生驱动信号。 材料供应源可操作以提供材料。 晶片处理系统包括上限制室部分,下限制室部分,限制环和静电卡盘。 上约束室部分具有上约束室部分内表面。 下部限制室部分可拆卸地设置成与上部限制室部分接触。 下部限制室部分具有下部限制室部分内表面。 限制环可拆卸地设置成与上部限制室部分内表面和下部限制室部分内表面接触。 限制环具有限制环内表面。 静电卡盘具有静电卡盘上表面,并被布置成接收驱动信号。 上部限制室部分,下部限制室部分,限制环和静电卡盘被布置成使得上部限制室部分内表面,下部限制室部分内表面,限制环内表面和电 - 静态卡盘上表面包围能够接收材料的等离子体形成空间。 当静电卡盘接收到驱动信号时,上部限制室部分,下部限制室部分,限制环和静电卡盘可操作以将材料转换成等离子体。 限制环具有非矩形截面。

    APPARATUS FOR DETERMINING THE ENDPOINT OF A CLEANING OR CONDITIONING PROCESS IN A PLASMA PROCESSING SYSTEM
    75.
    发明申请
    APPARATUS FOR DETERMINING THE ENDPOINT OF A CLEANING OR CONDITIONING PROCESS IN A PLASMA PROCESSING SYSTEM 失效
    用于确定等离子体处理系统中的清洁或调节过程的端点的装置

    公开(公告)号:US20090277584A1

    公开(公告)日:2009-11-12

    申请号:US12504833

    申请日:2009-07-17

    IPC分类号: C23F1/08

    CPC分类号: H01J37/32963 H01J37/32935

    摘要: An apparatus for determining an endpoint of a process by measuring a thickness of a layer is provided. The layer is disposed on the surface by a prior process. The apparatus includes means for providing a sensor that is coplanar with the surface, wherein the sensor is configured to measure the thickness. The apparatus also includes means for exposing the plasma chamber to a plasma, wherein the thickness is changed by the exposing, and means for determining the thickness as a function of time. The apparatus further includes means for ascertaining a steady state condition in the thickness, the steady state condition being characterized by a substantially stable measurement of the thickness, a start of the steady state condition representing the endpoint.

    摘要翻译: 提供了一种通过测量层的厚度来确定工艺的端点的装置。 该层通过先前的工艺设置在表面上。 该装置包括用于提供与表面共面的传感器的装置,其中传感器被配置成测量厚度。 该装置还包括用于将等离子体室暴露于等离子体的装置,其中通过曝光改变厚度,以及用于确定作为时间的函数的厚度的装置。 该装置还包括用于确定厚度中的稳态条件的装置,稳态条件的特征在于厚度的基本上稳定的测量,表示端点的稳态条件的开始。

    SHOWERHEAD ELECTRODE ASSEMBLIES AND PLASMA PROCESSING CHAMBERS INCORPORATING THE SAME
    76.
    发明申请
    SHOWERHEAD ELECTRODE ASSEMBLIES AND PLASMA PROCESSING CHAMBERS INCORPORATING THE SAME 有权
    淋浴电极组件和等离子体加工炉

    公开(公告)号:US20090095424A1

    公开(公告)日:2009-04-16

    申请号:US11871586

    申请日:2007-10-12

    IPC分类号: C23C16/00 H05H1/00

    摘要: The present invention relates generally to plasma processing and, more particularly, to plasma processing chambers and electrode assemblies used therein. According to one embodiment of the present invention, an electrode assembly is provided comprising a thermal control plate, a silicon-based showerhead electrode, and securing hardware, wherein the silicon-based showerhead electrode comprises a plurality of partial recesses formed in the backside of the silicon-based showerhead electrode and backside inserts positioned in the partial recesses. The thermal control plate comprises securing hardware passages configured to permit securing hardware to access the backside inserts. The securing hardware and the backside inserts are configured to maintain engagement of the thermal control plate and the silicon-based showerhead electrode and to permit disengagement of the thermal control plate and the silicon-based showerhead electrode while isolating the silicon-based electrode material of the silicon-based showerhead electrode from frictional contact with the securing hardware during disengagement.

    摘要翻译: 本发明一般涉及等离子体处理,更具体地,涉及其中使用的等离子体处理室和电极组件。 根据本发明的一个实施例,提供一种电极组件,其包括热控制板,硅基喷头电极和固定硬件,其中硅基喷头电极包括多个部分凹部,其形成在 硅基喷头电极和位于部分凹部中的背面插入件。 热控制板包括固定硬件通道,其配置成允许固定硬件以接近背面插入件。 固定硬件和后侧插入件构造成保持热控制板和硅基喷头电极的接合,并且允许热控制板和硅基喷头电极分离,同时隔离硅基电极材料的硅基电极材料 硅基喷头电极在分离时与固定硬件摩擦接触。

    Methods for measuring a set of electrical characteristics in a plasma
    77.
    发明授权
    Methods for measuring a set of electrical characteristics in a plasma 有权
    用于测量等离子体中的一组电特性的方法

    公开(公告)号:US07994794B2

    公开(公告)日:2011-08-09

    申请号:US12786405

    申请日:2010-05-24

    IPC分类号: G01N27/26 H05B31/26

    摘要: Methods using a probe apparatus configured to measure a set of electrical characteristics in a plasma include providing a chamber wall including at least a set of plasma chamber surfaces configured to be exposed to a plasma, the plasma having a set of electrical characteristics. The method includes installing a collection disk structure configured to be exposed to the plasma, wherein the collection disk structure having at least a body disposed within the chamber wall and a collection disk structure surface that is either coplanar or recessed with at least one of the set of plasma chamber surfaces and providing a conductive path configured to transmit the set of electrical characteristics from the collection disk structure to a set of transducers. The method may include coupling a thermal grounding element with the conductive path for providing thermal grounding to at least the conductive path and may alternatively or additionally include disposing an insulation barrier configured to substantially electrically separate at least one of the collection disk and the conductive path.

    摘要翻译: 使用构造成测量等离子体中的一组电特性的探针装置的方法包括提供包括至少一组被配置为暴露于等离子体的等离子体室表面的室壁,所述等离子体具有一组电特性。 该方法包括安装被配置为暴露于等离子体的收集盘结构,其中所述收集盘结构具有至少一个设置在所述室壁内的主体和与所述集合中的至少一个共面或凹入的收集盘结构表面 的等离子体室表面,并且提供导电路径,其被配置为将所述一组电特性从所述收集盘结构传输到一组换能器。 该方法可以包括将热接地元件与导电路径耦合,以便至少提供导电路径的热接地,并且可替代地或另外地包括设置绝缘屏障,该隔离屏障构造成基本上电分离收集盘和导电路径中的至少一个。

    Adjustable height PIF probe
    78.
    发明授权
    Adjustable height PIF probe 失效
    可调高度PIF探头

    公开(公告)号:US07479207B2

    公开(公告)日:2009-01-20

    申请号:US11377074

    申请日:2006-03-15

    IPC分类号: C23F1/02

    CPC分类号: H01J37/32935

    摘要: A plasma probe assembly for use in a plasma processing chamber is provided. A semiconductor probe element with a probe surface at a first end of the semiconductor probe element is provided. An electrical connector is electrically connected to the semiconductor probe element. An electrically insulating sleeve surrounds at least part of the probe element. An adjustment device is connected to the semiconductor probe so that the probe surface is coplanar with an interior chamber surface of the plasma processing chamber.

    摘要翻译: 提供了一种用于等离子体处理室的等离子体探针组件。 提供了在半导体探针元件的第一端具有探针表面的半导体探针元件。 电连接器电连接到半导体探针元件。 电绝缘套管围绕探头元件的至少一部分。 调整装置连接到半导体探针,使得探针表面与等离子体处理室的内部腔室表面共面。

    Plasma processing chamber with an apparatus for measuring set of electrical characteristics in a plasma
    79.
    发明申请
    Plasma processing chamber with an apparatus for measuring set of electrical characteristics in a plasma 有权
    等离子体处理室,其具有用于测量等离子体中的电特性的装置

    公开(公告)号:US20080066861A1

    公开(公告)日:2008-03-20

    申请号:US11948926

    申请日:2007-11-30

    IPC分类号: C23F1/00 C23C16/448

    摘要: A probe apparatus configured to measure a set of electrical characteristics in a plasma processing chamber, the plasma processing chamber including a set of plasma chamber surfaces configured to be exposed to a plasma is disclosed. Tile probe apparatus includes a collection disk structure configured to be exposed to the plasma, whereby the collection disk stricture is coplanar with at least one of the set of plasma chamber surfaces. The probe apparatus also includes a conductive path configured to transmit the set of electrical characteristics from the collection disk structure to a set of transducers, wherein the set of electrical characteristics is generated by an ion flux of the plasma. The probe apparatus further includes an insulation barrier configured to substantially electrically separate the collection disk and the conductive path from the set of plasma chamber surfaces.

    摘要翻译: 公开了一种被配置为测量等离子体处理室中的一组电特性的探针装置,所述等离子体处理室包括被配置为暴露于等离子体的一组等离子体室表面。 平铺探针装置包括构造成暴露于等离子体的收集盘结构,由此收集盘狭窄与所述一组等离子体腔表面中的至少一个共面。 探针装置还包括导电路径,该导电路径被配置为将该组特征从收集盘结构发送到一组换能器,其中该组电特性由等离子体的离子通量产生。 探针装置还包括绝缘屏障,其被配置为基本上将采集盘和导电路径与该组等离子体腔表面电分离。

    Methods and apparatus for igniting a low pressure plasma
    80.
    发明申请
    Methods and apparatus for igniting a low pressure plasma 有权
    用于点燃低压等离子体的方法和装置

    公开(公告)号:US20080038925A1

    公开(公告)日:2008-02-14

    申请号:US11169993

    申请日:2005-06-28

    IPC分类号: H01L21/461 C23F1/00

    CPC分类号: H01J37/32009 H01J37/321

    摘要: In a plasma processing system having a plasma processing chamber, at least one powered electrode and an ignition electrode, a method for igniting a plasma is disclosed. The method includes introducing a substrate into the plasma processing chamber. The method also includes flowing a gas mixture into the plasma processing chamber; energizing the ignition electrode at a strike frequency; and striking a plasma from the gas mixture with the ignition electrode. The method further includes energizing the at least one powered electrode with a target frequency, wherein the strike frequency is greater than the target frequency; and de-energizing the ignition electrode while processing the substrate in the plasma processing chamber.

    摘要翻译: 在具有等离子体处理室,至少一个供电电极和点火电极的等离子体处理系统中,公开了一种用于点燃等离子体的方法。 该方法包括将衬底引入等离子体处理室。 该方法还包括使气体混合物流入等离子体处理室; 以点火频率激励点火电极; 并用点火电极从气体混合物中冲击等离子体。 该方法还包括以目标频率激励至少一个动力电极,其中击发频率大于目标频率; 并且在处理等离子体处理室中的衬底时使点火电极断电。