Memory device
    72.
    发明授权

    公开(公告)号:US12183415B2

    公开(公告)日:2024-12-31

    申请号:US18203717

    申请日:2023-05-31

    Abstract: A memory device that operates at high speed is provided.
    The memory device includes first and second memory cells, first and second bit lines, first and second switches, and a sense amplifier. The sense amplifier comprises a first node and a second node. The first memory cell is electrically connected to the first node through the first bit line and the first switch, and the second memory cell is electrically connected to the second node through the second bit line and the second switch. The sense amplifier amplifies the potential difference between the first node and the second node. The first memory cell and the second memory cell include an oxide semiconductor in a channel formation region.

    Semiconductor device and electronic device

    公开(公告)号:US12149237B2

    公开(公告)日:2024-11-19

    申请号:US18016888

    申请日:2021-07-19

    Abstract: A semiconductor device with high arithmetic performance is provided. The semiconductor device employs the translinear principle, and the semiconductor device includes first to tenth transistors each including a metal oxide in a channel formation region and a first capacitor. A first terminal of the first transistor is electrically connected to a first terminal of the second transistor, a first terminal of the third transistor is electrically connected to a second terminal of the second transistor and a gate of the second transistor through the first capacitor. The second terminal of the second transistor is electrically connected to first terminals of the fourth and the seventh transistors and gates of the fifth and the eighth transistors. A gate of the seventh transistor is electrically connected to first terminals of the fifth and the sixth transistors, and a gate of the tenth transistor is electrically connected to first terminals of the eighth and the ninth transistors.

    Electric power charge and discharge system

    公开(公告)号:US11621443B2

    公开(公告)日:2023-04-04

    申请号:US17159214

    申请日:2021-01-27

    Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

    Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US11101300B2

    公开(公告)日:2021-08-24

    申请号:US16628920

    申请日:2018-07-13

    Abstract: A semiconductor device enabling high integration is provided. The semiconductor device includes a plug, two capacitors, and two transistors sharing one oxide semiconductor. Each of the transistors includes a stacked-layer structure of a gate insulator and a gate electrode over the oxide semiconductor and an insulator in contact with a side surface of the gate electrode. An opening between the two gate electrodes exposes the insulators in contact with the side surfaces of the gate electrodes, and the plug is in the opening. The capacitor is directly provided over the oxide semiconductor. The side surface area of the capacitor is larger than the projected area of the capacitor.

    Semicondutor device
    77.
    发明授权

    公开(公告)号:US10593683B2

    公开(公告)日:2020-03-17

    申请号:US16275380

    申请日:2019-02-14

    Abstract: [Problem] To provide a semiconductor device suitable for miniaturization. To provide a highly reliable semiconductor device. To provide a semiconductor device with improved operating speed.[Solving Means] A semiconductor device including a memory cell including first to cth (c is a natural number of 2 or more) sub memory cells, wherein: the jth sub memory cell includes a first transistor, a second transistor, and a capacitor; a first semiconductor layer included in the first transistor and a second semiconductor layer included in the second transistor include an oxide semiconductor; one of terminals of the capacitor is electrically connected to a gate electrode included in the second transistor; the gate electrode included in the second transistor is electrically connected to one of a source electrode and a drain electrode which are included in the first transistor; and when j≥2, the jth sub memory cell is arranged over the j-1th sub memory cell.

    Semiconductor device and electronic device

    公开(公告)号:US10446583B2

    公开(公告)日:2019-10-15

    申请号:US15911233

    申请日:2018-03-05

    Abstract: To provide a semiconductor device that is not easily damaged by ESD in a manufacturing process thereof. A layer whose band gap is greater than or equal to 2.5 eV and less than or equal to 4.2 eV, preferably greater than or equal to 2.7 eV and less than or equal to 3.5 eV is provided to overlap with a dicing line. A layer whose band gap is greater than or equal to 2.5 eV and less than or equal to 4.2 eV, preferably greater than or equal to 2.7 eV and less than or equal to 3.5 eV is provided around the semiconductor device such as a transistor. The layer may be in a floating state or may be supplied with a specific potential.

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