MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
    72.
    发明申请
    MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR 审中-公开
    多层陶瓷电容器,具有多层陶瓷电容器的电路板的安装结构,多层陶瓷电容器的包装单元

    公开(公告)号:US20150279569A1

    公开(公告)日:2015-10-01

    申请号:US14731229

    申请日:2015-06-04

    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

    Abstract translation: 提供一种多层陶瓷电容器,包括:陶瓷体; 包括多个第一和第二内部电极的有源层; 上盖层; 形成在有源层下面的下覆盖层,下覆盖层比上盖层厚; 第一和第二外部电极; 在下覆盖层内重复形成至少一对第一和第二内部电极,其中当A定义为陶瓷体总厚度的1/2时,B定义为下覆盖层的厚度,C被定义 作为有源层的总厚度的1/2,D定义为上覆盖层的厚度,有源层的中心与陶瓷体的中心之间的偏差比(B + C)/ A ,满足1.063≦̸(B + C)/A≦̸1.745。

    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF
    74.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF 有权
    多层陶瓷电容器及其安装板

    公开(公告)号:US20150114702A1

    公开(公告)日:2015-04-30

    申请号:US14518835

    申请日:2014-10-20

    Abstract: A multilayer ceramic capacitor may include a ceramic body and an active layer. The ceramic body includes three external electrodes disposed on amounting surface thereof so as to be spaced apart from each other, and first, second, and third lead parts extending from first and second internal electrodes of the ceramic body so as to be exposed to the mounting surface of the ceramic body. One side of at least one of the first, second, and third lead parts connected to the mounting surface of the ceramic body may be at least partially formed as an inclined extension portion that is inclined with respect to an outer periphery of the first or second internal electrode.

    Abstract translation: 多层陶瓷电容器可以包括陶瓷体和有源层。 陶瓷体包括设置在其表面上的三个外部电极,以便彼此间隔开;以及第一,第二和第三引线部分,其从陶瓷体的第一和第二内部电极延伸以暴露于安装 陶瓷体表面。 连接到陶瓷体的安装表面的第一,第二和第三引线部分中的至少一个的一侧可以至少部分地形成为相对于第一或第二引线的外周倾斜的倾斜延伸部分 内部电极

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    75.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20150098202A1

    公开(公告)日:2015-04-09

    申请号:US14269074

    申请日:2014-05-02

    Abstract: A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′.

    Abstract translation: 嵌入板中的多层陶瓷电子部件可以包括:包括电介质层的陶瓷体; 多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露; 以及分别形成在陶瓷体的两端部的第一外部电极和第二外部电极。 第一外部电极可以包括第一基极电极和第一端子电极,第二外部电极可以包括第二基极和第二端子电极,当第一外部电极的区域中的表面粗糙度为400nm时,可以满足Ra& 第一和第二端子电极中的50μm×50μm的面积被定义为Ra,当在第一和第二端子电极中的10μm×10μm的区域中的表面粗糙度时,可以满足130nm≦̸ Ra'≦̸ 400nm 被定义为Ra'。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    76.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20150053472A1

    公开(公告)日:2015-02-26

    申请号:US14135220

    申请日:2013-12-19

    Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 多个第一和第二内部电极; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极,其中,所述第一外部电极和所述第二外部电极延伸到所述陶瓷体的第一和第二主面,并且当所述陶瓷体的厚度被定义为ts时, 形成在陶瓷体的第一和第二主表面上的第一和第二外部电极的最大厚度被定义为tb,在陶瓷体的第一和第二端面上形成的第一和第二外部电极的最小距离为一定长度 陶瓷体的方向被定义为ta,tb / ts和ta / tb分别满足以下等式:0.1≦̸ tb / ts≦̸ 1.0和0.5≦̸ ta / tb≦̸ 2.0。

    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN
    77.
    发明申请
    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN 有权
    嵌入板中的多层陶瓷电容器及其制造方法以及嵌入式多层陶瓷电容器的制造方法

    公开(公告)号:US20150022943A1

    公开(公告)日:2015-01-22

    申请号:US14067912

    申请日:2013-10-30

    CPC classification number: H01G4/30 H01G4/232

    Abstract: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.

    Abstract translation: 提供一种嵌入板的多层陶瓷电容器,包括:陶瓷体; 第一和第二内部电极通过陶瓷体的端面交替地暴露; 形成在陶瓷体的端面上的第一外部电极和第二外部电极; 以及包围第一外部电极和第二外部电极的第一和第二电镀层,其中当从第一或第二外部电极的另一端的带的一端到另一端的距离为“A”时, 从第一或第二镀层的表面垂直间隔开的距离陶瓷体内部的带的一端的距离陶瓷体的长度方向3μm的点的1/2×A与陶瓷体的长度方向相交, 第二镀层为“B”,B /A≥0.6。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    78.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号:US20140367152A1

    公开(公告)日:2014-12-18

    申请号:US14259011

    申请日:2014-04-22

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes facing each other with one dielectric layer therebetween and alternately exposed to the first or second side surface; upper and lower cover layers disposed on and below the active layer; and a first external electrode disposed on the first side surface and a second external electrode disposed on the second side surface. Thickness T and width W of the ceramic body satisfy 0.75W≦T≦1.25W, gap G between the first and second external electrodes satisfies 30 μm≦G≦0.9W, and an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater.

    Abstract translation: 多层陶瓷电容器可以包括:陶瓷体,其包括电介质层,并且具有彼此相对的第一和第二主表面,彼此相对的第一和第二侧表面以及彼此相对的第一和第二端面; 有源层,被配置为通过包括彼此面对的第一和第二内部电极并且在其间具有一个介电层并交替地暴露于第一或第二侧表面而形成电容; 设置在有源层上和下面的上和下覆盖层; 以及设置在第一侧表面上的第一外部电极和设置在第二侧表面上的第二外部电极。 陶瓷体的厚度T和宽度W满足0.75W≦̸ T≦̸ 1.25W,第一和第二外部电极之间的间隙G满足30μm< NlE; G≦̸ 0.9W,以及单个介电层中的平均电介质颗粒数 厚度方向为2以上。

    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR
    79.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR 审中-公开
    多层陶瓷电容器及其安装板

    公开(公告)号:US20140185184A1

    公开(公告)日:2014-07-03

    申请号:US13943528

    申请日:2013-07-16

    Abstract: A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042≦(B+C)/A≦1.537 is satisfied.

    Abstract translation: 多层陶瓷电容器包括:陶瓷体,其具有沿厚度方向层叠的电介质层,所述电介质层的宽度大于长度; 通过包括交替暴露于彼此相对的陶瓷体的端面的第一和第二内部电极,其中电介质形成在其间的电介质的介电层; 上盖层; 下盖层比上盖层厚; 以及第一和第二外部电极,其中当陶瓷体的厚度的一半由A表示时,下覆盖层的厚度由B表示,有源层的厚度的一半由C表示,上表面的厚度 覆盖层由D表示,1.042≦̸(B + C)/A≦̸ 1.537。

    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME
    80.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME 审中-公开
    多层陶瓷电容器及其安装板

    公开(公告)号:US20140168852A1

    公开(公告)日:2014-06-19

    申请号:US13838636

    申请日:2013-03-15

    CPC classification number: H01G4/30 H01G2/065 H01G4/012 H01G4/12 H01G4/232

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed having a thickness greater than that of the upper cover layer; and first and second external electrodes, wherein when an average of a length of an upper portion, a length of a middle portion, and a length of a lower portion of the ceramic body is I, and an average of values obtained by adding a length of an upper portion, a length of a middle portion, and a length of a lower portion of the first external electrode and a length of an upper portion, a length of a middle portion, and a length of a lower portion of the second external electrode is BW, BW/I satisfies a range of 0.105≦BW/I≦1.049.

    Abstract translation: 提供了一种多层陶瓷电容器,包括:陶瓷体; 包括多个第一和第二内部电极的有源层; 上盖层; 形成有比上盖层的厚度大的下覆盖层; 以及第一外部电极和第二外部电极,其中当陶瓷体的上部的长度,中间部分的长度和下部的长度的平均值为I时,以及通过将陶瓷体的下部的长度, 第一外部电极的上部,中间部分的长度和下部的长度以及上部的长度,中间部分的长度和第二外部电极的下部的长度 电极为BW,BW / I满足0.105≦̸ BW / I≦̸ 1.049的范围。

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