公开(公告)号：US06381021B1

公开(公告)日：2002-04-30

申请号：US09602569

申请日：2000-06-22

Applicant: Sasson Somekh ,  Manoocher Birang

Inventor： Sasson Somekh ,  Manoocher Birang

IPC: G01N2155

CPC classification number: G01N21/55

Abstract: The present invention provides a method and apparatus for measuring the reflectivity of a substrate surface in situ. A transmitting assembly includes a light source positioned externally to a vacuum chamber and proximate an opening to transmit an optical beam into the vacuum chamber. An optical beam supplied by the light source is transmitted into the chamber via one or more optical devices such as fiber optics cables, lens and the like. Reflected portions of the optical beam are collected by a receiving assembly. A signal processing system coupled to the receiving assembly is programmed to determine the reflectivity of a substrate disposed in the vacuum chamber.

Abstract translation: 本发明提供了一种用于原位测量衬底表面的反射率的方法和装置。 传输组件包括位于真空室外部并且靠近开口的光源，以将光束传输到真空室中。 由光源提供的光束通过诸如光纤电缆，透镜等的一个或多个光学装置传输到腔室中。 光束的反射部分由接收组件收集。 耦合到接收组件的信号处理系统被编程以确定设置在真空室中的衬底的反射率。

公开(公告)号：US6165271A

公开(公告)日：2000-12-26

申请号：US52763

申请日：1998-03-31

Applicant: Jun Zhao ,  Sasson Somekh ,  Talex Sajoto ,  Charles Dornfest ,  Leonid Selyutin

Inventor： Jun Zhao ,  Sasson Somekh ,  Talex Sajoto ,  Charles Dornfest ,  Leonid Selyutin

IPC: C23C16/52 ,  C23C16/44 ,  C23C16/448 ,  C23C16/455 ,  H01L21/00 ,  H01L21/31 ,  C23C16/00

CPC classification number: C23C16/4409 ,  C23C16/4401 ,  C23C16/4412 ,  C23C16/4481 ,  C23C16/45561 ,  C23C16/4557 ,  H01L21/67017 ,  H01L21/6715 ,  Y10S261/65 ,  Y10T137/87684

Abstract: The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules.

Abstract translation: 本发明涉及一种用于蒸发液体前体并将膜沉积在合适基底上的装置和方法。 特别考虑的是用于在硅晶片上沉积诸如钡，锶，氧化钛（BST）膜的金属氧化物膜的装置和方法，以使集成电路电容器用于高容量动态存储器模块。

公开(公告)号：US6126517A

公开(公告)日：2000-10-03

申请号：US42204

申请日：1998-03-13

Applicant: Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

Inventor： Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

IPC: B24B27/00 ,  B24B37/30 ,  B24B37/34 ,  B24B41/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  B24B5/00

CPC classification number: H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/67051 ,  H01L21/30625

Abstract: An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.

Abstract translation: 一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括抛光表面，诸如安装在相应压板上的焊盘，位于多个抛光站。 多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。 晶片头从可旋转支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，例如径向地在可旋转支撑件内摆动。 装载/卸载站可以位于与抛光表面对称的位置。 可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。 多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。 这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。 或者，可以在多个抛光站等效地抛光多于一个晶片。

公开(公告)号：US6023405A

公开(公告)日：2000-02-08

申请号：US24917

申请日：1998-02-17

Applicant: Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

Inventor： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

IPC: B25J15/06 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H02N13/00

CPC classification number: C23C16/45521 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00 ,  Y10T279/23 ,  Y10T29/49117

Abstract: An electrostatic chuck (20) for holding a substrate (45) is described. One version of the chuck (20) suitable for mounting on a base (25), comprises (i) an electrostatic member (33) having an electrode (50) therein, and (ii) an electrical lead (60) extending through the base (25) to electrically engage the electrode (50) of the electrostatic member (33). When the chuck (20) is used to hold a substrate (45) in a process chamber (80) containing erosive process gas, the substrate (45) covers and substantially protects the electrical lead (60) from erosion by the erosive process gas. In a preferred version of the chuck (20), an electrical connector (55) forming an integral extension of the electrode (50), electrically connects the electrode (50) to a voltage supply terminal (70) used to operate the chuck (20). The electrical connector (55) comprises (i) an electrical lead (60) that extends through the base (25), and (ii) an electrical contact (65) on the electrical lead (60), the contact sized sufficiently large to directly contact and electrically engage the voltage supply terminal (70). The electrode (50) of the chuck (20) can comprise first and second electrodes (130), (135) electrically isolated from one another by an electrical isolation void (52), the electrodes sized and configured so that the electrical isolation void (52) can serve as a cooling groove (105) for holding coolant for cooling the substrate (45) held on the chuck (20). Preferably, the two electrode chuck (20) is used in conjunction with a switching system capable of operating the chuck (20) in either a monopolar mode or in a bipolar mode.

Abstract translation: 描述了用于保持基板（45）的静电卡盘（20）。 适于安装在基座（25）上的卡盘（20）的一个版本包括（i）其中具有电极（50）的静电部件（33）和（ii）延伸穿过底座 （25）电连接静电部件（33）的电极（50）。 当卡盘（20）用于将基板（45）保持在包含腐蚀性处理气体的处理室（80）中时，基板（45）覆盖并基本上保护电引线（60）免受侵蚀性处理气体的侵蚀。 在卡盘（20）的优选形式中，形成电极（50）的整体延伸的电连接器（55）将电极（50）电连接到用于操作卡盘（20）的电压供应端子 ）。 电连接器（55）包括（i）延伸穿过基座（25）的电引线（60）和（ii）电引线（60）上的电触头（65），触头尺寸足够大以直接 接触和电接合电压端子（70）。 卡盘（20）的电极（50）可以包括通过电隔离空隙（52）彼此电隔离的第一和第二电极（130），电极的尺寸和构造使得电隔离空隙（ 52）可以用作用于保持冷却剂的冷却槽（105），以冷却保持在卡盘（20）上的基板（45）。 优选地，两个电极卡盘（20）与能够以单极模式或双极模式操作卡盘（20）的开关系统结合使用。

公开(公告)号：US5957751A

公开(公告)日：1999-09-28

申请号：US862350

申请日：1997-05-23

Applicant: Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

Inventor： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

IPC: B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B49/00

CPC classification number: B24B37/30 ,  B24B37/0053

Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

公开(公告)号：US5882165A

公开(公告)日：1999-03-16

申请号：US926568

申请日：1997-09-10

Applicant: Dan Maydan ,  Sasson Somekh ,  David Nin-Kou Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

Inventor： Dan Maydan ,  Sasson Somekh ,  David Nin-Kou Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

IPC: H01L21/00 ,  H01L21/677 ,  C23C16/00

CPC classification number: H01L21/67161 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748

Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R--.THETA. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.

Abstract translation: 公开了一种集成的模块化多室真空处理系统。 该系统包括一个加载锁定，可以包括一个外部盒式电梯和一个内部装载锁定晶片升降机，并且还包括围绕负载锁的周边的站，用于将一个，两个或几个真空处理室连接到负载锁定室。 机器人被安装在装载锁中，并利用同轴的驱动系统，该系统通过双重四杆连杆机构连接到末端执行器，用于将选定的R-THETA运动传递给叶片，以在外部升降机，内部升降机 和各个处理室。 该系统独特地适用于实现各种类型的IC处理，包括蚀刻，沉积，溅射和快速热退火室，从而为使用不同工艺的多步骤顺序处理提供了机会。

公开(公告)号：US5822171A

公开(公告)日：1998-10-13

申请号：US410449

申请日：1995-03-24

Applicant: Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspiel ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

Inventor： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspiel ,  Ron Northrup ,  Semyon Shertinsky ,  Sasson Somekh

IPC: B25J15/06 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H02N13/00

CPC classification number: C23C16/45521 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00 ,  Y10T279/23 ,  Y10T29/49117

Abstract: An electrostatic chuck (20) for holding a substrate (45) is described. One version of the chuck (20) suitable for mounting on a base (25), comprises (i) an electrostatic member (33) having an electrode (50) therein, and (ii) an electrical lead (60) extending through the base (25) to electrically engage the electrode (50) of the electrostatic member (33). When the chuck (20) is used to hold a substrate (45) in a process chamber (80) containing erosive process gas, the substrate (45) covers and substantially protects the electrical lead (60) from erosion by the erosive process gas. In a preferred version of the chuck (20), an electrical connector (55) forming an integral extension of the electrode (50), electrically connects the electrode (50) to a voltage supply terminal (70) used to operate the chuck (20). The electrical connector (55) comprises (i) an electrical lead (60) that extends through the base (25), and (ii) an electrical contact (65) on the electrical lead (60), the contact sized sufficiently large to directly contact and electrically engage the voltage supply terminal (70). The electrode (50) of the chuck (20) can comprise first and second electrodes (130), (135) electrically isolated from one another by an electrical isolation void (52), the electrodes sized and configured so that the electrical isolation void (52) can serve as a cooling groove (105) for holding coolant for cooling the substrate (45) held on the chuck (20). Preferably, the two electrode chuck (20) is used in conjunction with a switching system capable of operating the chuck (20) in either a monopolar mode or in a bipolar mode. Erosion resistance of the chuck (20) is further enhanced by a masking gas assembly (115) which directs a masking gas at an exposed portion of the insulator (35), to protect the exposed portion of the insulator (35) from the erosive gas contained in the process chamber (80).

公开(公告)号：US5810936A

公开(公告)日：1998-09-22

申请号：US662723

申请日：1996-06-10

Applicant: Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

Inventor： Cissy S. Leung ,  Lawrence Chung-Lai Lei ,  Sasson Somekh

IPC: C30B33/12 ,  C23C16/44 ,  C23F4/00 ,  H01J37/32 ,  H01L21/00 ,  H01L21/205 ,  H01L21/302 ,  H01L21/304 ,  H01L21/3065 ,  C23C16/00 ,  C23F1/02

CPC classification number: H01L21/67028 ,  C23C16/4405 ,  H01J37/32862 ,  H01J2237/022 ,  Y10S438/905

Abstract: A apparatus for removing deposits from within a space at least partially delimited by a surface which is subject to attack from a plasma including a surface cover comprising a material which is inert to the plasma.

Abstract translation: 一种用于从至少部分地由受等离子体侵蚀的表面限定的空间内去除沉积物的装置，包括包含对等离子体是惰性的材料的表面覆盖物。

公开(公告)号：US5738574A

公开(公告)日：1998-04-14

申请号：US549336

申请日：1995-10-27

Applicant: Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

Inventor： Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

IPC: B24B27/00 ,  B24B37/30 ,  B24B37/34 ,  B24B41/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  B24B5/00

CPC classification number: H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/67051 ,  H01L21/30625

Abstract: An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads. The carousel simultaneously positions one of the heads over the transfer and washing station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers and washing of wafers and wafer heads can be performed concurrently with wafer polishing. A robot positioned to the side of the polishing apparatus automatically moves cassettes filled with wafers into a holding tub, and transfers individual wafers vertically held in the cassettes between the holding tub and the transfer and washing station. The multiple polishing pads can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels.

Abstract translation: 一种用于抛光半导体晶片和其它工件的装置，其包括安装在多个抛光站的相应压板上的抛光垫。 与抛光台的数量相比，至少一个数量的多个晶片头可以装载单独的晶片。 晶片头从旋转盘悬挂，其提供头相对于抛光垫的圆周定位，并且晶片头在圆盘传送带支撑下径向摆动，以相对于可旋转圆盘传送器在径向上线性地扫过相应的垫。 每个抛光台包括用于修整抛光垫的垫调节器，使得其保持高抛光速率。 洗涤站可以设置在抛光站之间和抛光站之间，以及传送和洗涤站，以便随着传送带移动而洗涤晶片。 传送和洗涤站的布置类似于抛光垫。 圆盘传送带同时将其中一个头放置在传送和洗涤台上，而其余的头位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载以及晶片和晶片头的清洗。 位于抛光装置一侧的机器人将自动地将装载有晶片的盒子移动到保持桶中，并且将保持在保持桶和转移和洗涤站之间的盒中的垂直保持的各个晶片传送。 多个抛光垫可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。 这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。

公开(公告)号：US5570994A

公开(公告)日：1996-11-05

申请号：US438329

申请日：1995-05-10

Applicant: Sasson Somekh ,  Kevin Fairbairn ,  Gary M. Kolstoe ,  Gregory W. White ,  W. George Faraco, Jr.

Inventor： Sasson Somekh ,  Kevin Fairbairn ,  Gary M. Kolstoe ,  Gregory W. White ,  W. George Faraco, Jr.

IPC: B65G49/07 ,  H01L21/677 ,  H01L21/683 ,  B65G65/00

CPC classification number: H01L21/6838 ,  H01L21/67742 ,  H01L21/67748 ,  Y10S294/907 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

Abstract: A semiconductor wafer processing system for processing wafers from a wafer storage cassette includes a wafer transfer chamber; a wafer storage elevator within the transfer chamber; one or more wafer processing chambers; and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The storage chamber pressure varies between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm; a thin flat wafer carrying blade at the leading end of the robot arm configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray configured for removable engagement with the blade and for engaging and positively positioning a wafer from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper and lower halves together defining vacuum channels and capacitive position sensors.

Abstract translation: 用于从晶片存储盒处理晶片的半导体晶片处理系统包括：晶片传送室; 传送室内的晶片存储电梯; 一个或多个晶片处理室; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。 当从外部接收晶片时，储存室压力在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。 传送装置包括机器人臂; 在所述机器人臂的前端处的薄平板晶片承载叶片，其被配置用于从所述存储盒或电梯接合晶片; 以及晶片支撑托盘，其构造成用于与所述刀片可拆卸地接合并且用于从所述电梯或处理腔室内的支撑座接合和积极地定位晶片。 当传送装置在真空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并有助于在运输过程中保持晶片。 当晶片在大气压下在盒和电梯之间转移时，托盘与叶片脱离并放置在电梯上的静止位置，并且通过单独的叶片执行晶片传送，该真空拾取器与叶片成一整体 。 叶片包括一起限定真空通道和电容位置传感器的上半部和下半部。