公开(公告)号：US5572419A

公开(公告)日：1996-11-05

申请号：US183806

申请日：1994-01-21

申请人： Makoto Nishimura

发明人： Makoto Nishimura

IPC分类号： G05B19/18 ,  G05B19/414 ,  G05B19/4155 ,  G05B15/00

CPC分类号： G05B19/4141 ,  G05B2219/33129 ,  G05B2219/33337 ,  G05B2219/33346 ,  G05B2219/33347 ,  G05B2219/34157 ,  G05B2219/34208

摘要： A control system having multiple control apparatuses connected by a data transmission path. Each of the control apparatuses comprises a communication control section, sequence control section, and positioning control section. The positioning control section of each control apparatus has a memory. A position controlling program is stored in the memory of a first one of the control apparatuses. The position controlling program has codes, each of which to be used by a positioning control sections of a particular control apparatus, for controlling its respective servo motor. The codes of the position controlling program are transmitted from the first control apparatus to another control apparatuses to cause the positioning control section of that apparatus to control its respective servo motor in accordance with the codes.

摘要翻译： 一种具有由数据传输路径连接的多个控制装置的控制系统。 每个控制装置包括通信控制部分，序列控制部分和定位控制部分。 每个控制装置的定位控制部分具有存储器。 位置控制程序存储在第一个控制装置的存储器中。 位置控制程序具有用于控制其各自的伺服电动机的特定控制装置的定位控制部分使用的代码。 位置控制程序的代码从第一控制装置发送到另一个控制装置，使得该装置的定位控制部分根据代码来控制其各自的伺服电动机。

公开(公告)号：US5565748A

公开(公告)日：1996-10-15

申请号：US268109

申请日：1994-07-06

申请人： Yoshichika Takizawa ,  Yasuyuki Suzuki ,  Misako Okada ,  Makoto Nishimura ,  Hidehiko Matsumoto ,  Yasuharu Kudo ,  Tohru Tsujimoto

发明人： Yoshichika Takizawa ,  Yasuyuki Suzuki ,  Misako Okada ,  Makoto Nishimura ,  Hidehiko Matsumoto ,  Yasuharu Kudo ,  Tohru Tsujimoto

IPC分类号： G05B9/02 ,  B65G43/08 ,  B65H23/04 ,  G05B15/02 ,  G05B19/18 ,  G05B19/4069 ,  G05B19/414 ,  G05B19/418 ,  G05D3/00 ,  G05D3/12 ,  G05B19/04

CPC分类号： G05B19/4069 ,  B65G43/08 ,  B65H23/048 ,  G05B19/4147 ,  G05B19/4182 ,  B65H2511/20 ,  B65H2511/232 ,  B65H2555/24 ,  B65H2557/23 ,  G05B2219/32137 ,  G05B2219/36025 ,  G05B2219/36143 ,  G05B2219/43174 ,  Y02P90/04 ,  Y02P90/083 ,  Y02P90/16 ,  Y02P90/185 ,  Y02P90/26 ,  Y10S706/92

摘要： An apparatus for synchronously controlling the actual operation of a machine using one or more motors, such as servo motors, by simulating in program form a combination of selectable machine mechanisms, including drivers, connecting shafts, clutches, gears and cams. Each such machine mechanism is represented by a virtual mechanism, preferably as a software module that contains information uniquely identifying the module, operation information that defines the generation of position information and connection information that defines other modules to which connection is made. The software modules comprise drive modules for generating position information, transmission modules for simulating the transmission mechanisms and output modules for outputting motor commands.

摘要翻译： 一种使用一个或多个电动机（例如伺服电动机）同步控制机器的实际操作的装置，通过在程序中形成包括驾驶员，连接轴，离合器，齿轮和凸轮的可选机械机构的组合。 每个这样的机器机构由虚拟机构表示，优选地作为包含唯一地标识模块的信息的软件模块，定义产生位置信息的操作信息和定义到其进行连接的其他模块的连接信息。 软件模块包括用于产生位置信息的驱动模块，用于模拟传动机构的传输模块和用于输出电动机命令的输出模块。

公开(公告)号：US5416982A

公开(公告)日：1995-05-23

申请号：US160778

申请日：1993-12-03

申请人： Makoto Nishimura

发明人： Makoto Nishimura

IPC分类号： B01D53/26 ,  B23K3/00 ,  F26B25/00 ,  F26B21/12

CPC分类号： F26B25/008

摘要： Disclosed herein is a moisture sealing apparatus for a powdery brazing flux, comprising an open-topped container for the powdery brazing flux, a nozzle positioned at the center over the container and adapted to cause dry air to flow out through a slit opened out in all horizontal directions, and an air pipe for supplying the dry air, which is connected to the nozzle. According to the apparatus, a powdery flux having strong deliquescence is always kept a completely dry state.

摘要翻译： 本发明公开了一种用于粉末钎焊焊剂的防潮密封装置，包括用于粉末钎焊焊剂的开顶容器，位于容器中心的喷嘴，适于引起干燥空气通过所有开口的狭缝流出 水平方向，以及用于供给连接到喷嘴的干燥空气的空气管。 根据该装置，具有强潮解性的粉末状助焊剂总是保持完全干燥状态。

公开(公告)号：US4833372A

公开(公告)日：1989-05-23

申请号：US50429

申请日：1987-05-18

申请人： Mamoru Kobayashi ,  Makoto Nishimura

发明人： Mamoru Kobayashi ,  Makoto Nishimura

IPC分类号： H02P8/00 ,  H02P8/14 ,  H02P8/38

CPC分类号： H02P8/14 ,  H02P8/00 ,  H02P8/38

摘要： A control circuit can drive an electric motor such as a stepping motor and a DC torque motor within a wide supply voltage range so that its rotor follows a selected speed pattern without error. The control circuit includes a monitoring circuit for monitoring a level of the supply voltage to output a detection signal. The control circuit also includes a memory storing a plurality of speed patterns, the plurality of speed patterns corresponding respectively to different levels of the supply voltage. One of the plurality of speed patterns is selectively read in response to the detection signal. The electric motor is then driven in accordance with the read speed pattern.

摘要翻译： 控制电路可以在宽电源电压范围内驱动诸如步进电动机和直流转矩电动机的电动机，使得其转子以无错误的方式跟随所选择的速度模式。 控制电路包括用于监视电源电压的电平以输出检测信号的监视电路。 控制电路还包括存储多个速度模式的存储器，多个速度模式分别对应于电源电压的不同级别。 响应于检测信号选择性地读取多个速度图案中的一个。 然后根据读取速度模式驱动电动机。

公开(公告)号：US4752788A

公开(公告)日：1988-06-21

申请号：US903789

申请日：1986-09-04

申请人： Takeshi Yasuhara ,  Makoto Nishimura

发明人： Takeshi Yasuhara ,  Makoto Nishimura

IPC分类号： B41J2/14 ,  B41J2/16 ,  G01D15/16

CPC分类号： B41J2/1623 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1632 ,  B41J2002/14225

摘要： An ink jet recording head in which the ink in an ink cavity is jetted in the form of a droplet from an ink nozzle by utilizing a piezo-electric effect. The recording head includes a piezo-electric plate made of piezo-electric material and having a plurality of elongated ink cavities formed therein, and a cover plate fixedly placed on the piezo-electric plate. In one of the embodiments, each of the plurality of elongated ink cavities has two deep grooves formed in the longitudinal direction of the ink cavities and a shallow groove provided between the two deep grooves. Voltage applying electrodes are provided on piezo-electric portions which form the shallow grooves.

摘要翻译： 一种喷墨记录头，其中油墨腔中的油墨通过利用压电效应从墨喷嘴以液滴的形式喷射。 记录头包括由压电材料制成的压电板，并且其中形成有多个细长的油墨腔，以及固定地放置在压电板上的盖板。 在其中一个实施例中，多个细长油墨腔中的每一个具有在油墨腔的纵向方向上形成的两个深槽和设置在两个深槽之间的浅槽。 电压施加电极设置在形成浅槽的压电部分上。

公开(公告)号：US08736880B2

公开(公告)日：2014-05-27

申请号：US13440688

申请日：2012-04-05

申请人： Jyunya Yamada ,  Makoto Nishimura ,  Kazuaki Ozawa ,  Masahiro Oishi

发明人： Jyunya Yamada ,  Makoto Nishimura ,  Kazuaki Ozawa ,  Masahiro Oishi

IPC分类号： G06F3/12 ,  G06K15/00

CPC分类号： G06F21/34 ,  G06F3/1222 ,  G06F3/1238 ,  G06F3/1285 ,  H04N1/00228 ,  H04N1/00233 ,  H04N1/4413 ,  H04N1/4426 ,  H04N1/4433 ,  H04N2201/0082

摘要： An image forming system includes an image forming apparatus, a transmission apparatus, a reception section that is provided in the image forming apparatus and receives a designation of the transmission apparatus, a first transmission section that is provided in the image forming apparatus and transmits apparatus information indicating the own apparatus to a transmission apparatus designated in the reception section, a first storage unit that is provided in the transmission apparatus and stores the apparatus information transmitted from the first transmission section, a second transmission section that is provided in the transmission apparatus and transmits image data to an image forming apparatus indicated by the apparatus information stored in the first storage section, and an image forming unit that is provided in the image forming apparatus and forms an image corresponding to the image data transmitted from the second transmission section.

摘要翻译： 图像形成系统包括图像形成装置，发送装置，设置在图像形成装置中并接收发送装置的指定的接收部，设置在图像形成装置中的第一发送部，发送装置信息 向接收部指定的发送装置指示本装置，设置在发送装置中并存储从第一发送部发送的装置信息的第一存储部，设置在发送装置中的第二发送部，发送 将图像数据传送到由存储在第一存储部分中的装置信息指示的图像形成装置，以及图像形成单元，其被设置在图像形成装置中并形成与从第二传输部分发送的图像数据相对应的图像。

公开(公告)号：US08526843B2

公开(公告)日：2013-09-03

申请号：US12915635

申请日：2010-10-29

申请人： Yuji Terai ,  Makoto Nishimura

发明人： Yuji Terai ,  Makoto Nishimura

IPC分类号： G03G15/02

CPC分类号： G03G15/0225

摘要： A cleaning element for an image-forming apparatus, includes: a shaft; a strip-shaped sheet which is disposed helically on an outer circumferential surface of the shaft; and an adhesive layer which is disposed between the shaft and the strip-shaped sheet and binds the shaft and the strip-shaped sheet, the strip-shaped sheet having, on a surface thereof facing the shaft, an unbound region in which the adhesive layer is absent, at an end in a width direction of the strip-shaped sheet which faces a downstream side in a rotation direction of the shaft.

摘要翻译： 一种用于图像形成装置的清洁元件，包括：轴; 螺旋形地设置在所述轴的外周面上的带状片; 以及粘合剂层，其设置在所述轴和所述带状片材之间并且结合所述轴和所述条形片材，所述带状片材在其面向所述轴部的表面上具有未结合区域，其中所述粘合剂层 在条形片的宽度方向上在轴的旋转方向上面向下游侧的端部不存在。

公开(公告)号：US08492882B2

公开(公告)日：2013-07-23

申请号：US13464257

申请日：2012-05-04

申请人： Junichi Arita ,  Kazuko Hanawa ,  Makoto Nishimura

发明人： Junichi Arita ,  Kazuko Hanawa ,  Makoto Nishimura

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

摘要： A semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and leads so as to surround the die pad, members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate. A semiconductor chip larger than the die pad is mounted over the die pad and the members. Top surfaces of the die pad and the members in opposition to the back surface of the chip are bonded to the back surface of the chip with silver paste. Heat is conducted from the back surface of the chip to the heat dissipating plate via the silver paste, the die pad, and the members, and dissipated to the outside of the semiconductor device via the leads.

摘要翻译： 半导体器件具有管芯焊盘，布置在管芯焊盘和引线之间的框架形式的散热板，以围绕管芯焊盘，连接管芯焊盘和散热板的内边缘的部件，以及 连接到散热板的外延伸部的悬挂引线。 大于管芯焊盘的半导体芯片安装在管芯焊盘和部件上。 芯片的顶表面和与芯片的背面相对的构件的顶面用银浆粘合到芯片的背面。 通过银膏，芯片焊盘和部件从芯片的背面向散热板传导热量，并通过引线消散到半导体器件的外部。

公开(公告)号：US20130053745A1

公开(公告)日：2013-02-28

申请号：US13639607

申请日：2011-04-06

申请人： Kazutoshi Kobayashi ,  Kunihiro Suto ,  Makoto Nishimura ,  Hiroto Kita

发明人： Kazutoshi Kobayashi ,  Kunihiro Suto ,  Makoto Nishimura ,  Hiroto Kita

IPC分类号： A61F5/00

CPC分类号： A61B17/0218 ,  A61B1/0008 ,  A61B2017/00269 ,  A61B2017/00336

摘要： According to a medical traction device containing a polymer molded article having biocompatibility as a weight for traction of a living tissue to be resected under observation with an endoscope, and a medical traction equipment containing the medical traction device and a grasping member connected to each other, such a medical traction device or traction equipment is provided that in ESD in a digestive tract, a dissected living tissue is efficiently removed from the operative field also in a direction that is different from the moving direction of the endoscope, thereby maintaining the field of view, and the procedures are thus performed safely and rapidly.

摘要翻译： 根据含有具有生物相容性的聚合物成型品的医疗用牵引装置，以及包含所述医疗用牵引装置和将所述夹持部件相互连接的医疗用牵引装置， 提供了这样的医疗牵引装置或牵引装置：在消化道的ESD中，解剖的生物体组织也可以沿着与内窥镜的移动方向不同的方向从手术区域移除，从而保持视野 ，因此安全，快速地执行该程序。

公开(公告)号：US08188583B2

公开(公告)日：2012-05-29

申请号：US12731201

申请日：2010-03-25

申请人： Junichi Arita ,  Kazuko Hanawa ,  Makoto Nishimura

发明人： Junichi Arita ,  Kazuko Hanawa ,  Makoto Nishimura

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

摘要： To improve the heat dissipation characteristics of a semiconductor device.The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality of members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate, wherein a semiconductor chip the outer shape of which is larger than the die pad is mounted over the die pad and the members. The top surface of the die pad and the top surface of the members at the part in opposition to the back surface of the semiconductor chip are bonded to the back surface of the semiconductor chip in their entire surfaces with a silver paste. Heat in the semiconductor chip is conducted from the back surface of the semiconductor chip to the heat dissipating plate via the silver paste, the die pad, and the member, and dissipated to the outside of the semiconductor device therefrom via the lead.

摘要翻译： 提高半导体器件的散热特性。 半导体器件具有管芯焊盘，散热板，其形式为布置在管芯焊盘和多个引线之间的框架形式，以围绕管芯焊盘;多个构件，其将管芯焊盘和内部边缘连接 散热板和连接到散热板的外部延伸部的悬挂引线，其中外部形状大于管芯焊盘的半导体芯片安装在管芯焊盘和部件上。 芯片焊盘的顶表面和与半导体芯片的背面相对的部分的部件的顶表面在银浆的整个表面上与半导体芯片的背面接合。 半导体芯片中的热量通过银膏，芯片焊盘和部件从半导体芯片的背面传导到散热板，并通过引线从其散发到半导体器件的外部。