公开(公告)号：US20140362324A1

公开(公告)日：2014-12-11

申请号：US14290263

申请日：2014-05-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hiroyuki MIYAKE ,  Kouhei TOYOTAKA ,  Masahiko HAYAKAWA ,  Daisuke MATSUBAYASHI ,  Shinpei MATSUDA

IPC: G02F1/1343

CPC classification number: G02F1/134309 ,  G02F1/133345 ,  G02F1/1343 ,  G02F1/136213 ,  G02F1/13624 ,  G02F1/1368 ,  G02F2001/13685 ,  H01L27/1225 ,  H01L27/127 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/78696

Abstract: The following semiconductor device provides high reliability and a narrower frame width. The semiconductor device includes a driver circuit and a pixel portion. The driver circuit has a first transistor including a first gate and a second gate electrically connected to each other with a semiconductor film sandwiched therebetween, and a second transistor electrically connected to the first transistor. The pixel portion includes a third transistor, a liquid crystal element, and a capacitor. The liquid crystal element includes a first transparent conductive film electrically connected to the third transistor, a second conductive film, and a liquid crystal layer. The capacitor includes the first conductive film, a third transparent conductive film, and a nitride insulating film. The nitride insulating film is positioned between the first transparent conductive film and the third transparent conductive film, and positioned between the semiconductor film and the second gate of the first transistor.

Abstract translation: 以下半导体器件提供高可靠性和较窄的帧宽度。 半导体器件包括驱动电路和像素部分。 驱动电路具有包括第一栅极和第二栅极的第一晶体管，其中夹在其间的半导体膜彼此电连接，第二晶体管与第一晶体管电连接。 像素部分包括第三晶体管，液晶元件和电容器。 液晶元件包括与第三晶体管电连接的第一透明导电膜，第二导电膜和液晶层。 电容器包括第一导电膜，第三透明导电膜和氮化物绝缘膜。 氮化物绝缘膜位于第一透明导电膜和第三透明导电膜之间，位于第一晶体管的半导体膜和第二栅极之间。

公开(公告)号：US20240079479A1

公开(公告)日：2024-03-07

申请号：US18388883

申请日：2023-11-13

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Junichi KOEZUKA ,  Yukinori SHIMA ,  Hajime TOKUNAGA ,  Toshinari SASAKI ,  Keisuke MURAYAMA ,  Daisuke MATSUBAYASHI

IPC: H01L29/66 ,  H01L21/02 ,  H01L27/12 ,  H01L29/51 ,  H01L29/786

CPC classification number: H01L29/66969 ,  H01L21/022 ,  H01L21/02263 ,  H01L27/1225 ,  H01L29/513 ,  H01L29/78609 ,  H01L29/7869

Abstract: To reduce defects in an oxide semiconductor film in a semiconductor device. To improve the electrical characteristics and the reliability of a semiconductor device including an oxide semiconductor film. In a semiconductor device including a transistor including a gate electrode formed over a substrate, a gate insulating film covering the gate electrode, a multilayer film overlapping with the gate electrode with the gate insulating film provided therebetween, and a pair of electrodes in contact with the multilayer film, a first oxide insulating film covering the transistor, and a second oxide insulating film formed over the first oxide insulating film, the multilayer film includes an oxide semiconductor film and an oxide film containing In or Ga, the first oxide insulating film is an oxide insulating film through which oxygen is permeated, and the second oxide insulating film is an oxide insulating film containing more oxygen than that in the stoichiometric composition.

公开(公告)号：US20240055299A1

公开(公告)日：2024-02-15

申请号：US18383086

申请日：2023-10-24

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei YAMAZAKI ,  Toshihiko TAKEUCHI ,  Tsutomu MURAKAWA ,  Hiroki KOMAGATA ,  Daisuke MATSUBAYASHI ,  Noritaka ISHIHARA ,  Yusuke NONAKA

IPC: H01L21/8234 ,  H01L27/06 ,  H01L27/088 ,  H01L29/786 ,  H10B12/00

CPC classification number: H01L21/8234 ,  H01L27/06 ,  H01L27/088 ,  H01L29/7869 ,  H10B12/00

Abstract: A semiconductor device which has favorable electrical characteristics and can be highly integrated is provided.
The semiconductor device includes a first insulator; an oxide over the first insulator; a second insulator over the oxide; a first conductor over the second insulator; a third insulator in contact with a top surface of the first insulator, a side surface of the oxide, a top surface of the oxide, a side surface of the second insulator, and a side surface of the first conductor; and a fourth insulator over the third insulator. The third insulator includes an opening exposing the first insulator, and the fourth insulator is in contact with the first insulator through the opening.

公开(公告)号：US20230335646A1

公开(公告)日：2023-10-19

申请号：US18211652

申请日：2023-06-20

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Hideomi SUZAWA ,  Tetsuhiro TANAKA ,  Hirokazu WATANABE ,  Yuhei SATO ,  Yasumasa YAMANE ,  Daisuke MATSUBAYASHI

IPC: H01L29/786 ,  H01L29/45 ,  H01L29/66

CPC classification number: H01L29/78618 ,  H01L29/7869 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/78696

Abstract: A semiconductor device having a reduced amount of oxygen vacancy in a channel formation region of an oxide semiconductor is provided. Further, a semiconductor device which includes an oxide semiconductor and has improved electric characteristics is provided. Furthermore, a methods for manufacturing the semiconductor device is provided. An oxide semiconductor film is formed; a conductive film is formed over the oxide semiconductor film at the same time as forming a low-resistance region between the oxide semiconductor film and the conductive film; the conductive film is processed to form a source electrode and a drain electrode; and oxygen is added to the low-resistance region between the source electrode and the drain electrode, so that a channel formation region having a higher resistance than the low-resistance region is formed and a first low-resistance region and a second low-resistance region between which the channel formation region is positioned are formed.

公开(公告)号：US20210280718A1

公开(公告)日：2021-09-09

申请号：US17257921

申请日：2019-07-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Daisuke MATSUBAYASHI ,  Yuichi YANAGISAWA ,  Masahiro TAKAHASHI

IPC: H01L29/786 ,  H01L29/10

Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device in which first to third conductors are placed over a first oxide; first and second oxide insulators are placed respectively over the second and third conductors; a second oxide is placed in contact with a side surface of the first oxide insulator, a side surface of the second oxide insulator, and a top surface of the first oxide; a first insulator is placed between the first conductor and the second oxide; and the first oxide insulator and the second oxide insulator are not in contact with the first to third conductors, the first insulator, and the first oxide.

公开(公告)号：US20200343245A1

公开(公告)日：2020-10-29

申请号：US16765398

申请日：2018-11-22

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei YAMAZAKI ,  Hajime KIMURA ,  Munehiro KOZUMA ,  Takeshi AOKI ,  Hiroki INOUE ,  Shintaro HARADA ,  Daisuke MATSUBAYASHI

IPC: H01L27/105 ,  H01L27/12 ,  H01L23/34 ,  H01L29/786

Abstract: Provided is a storage device that achieves both retention operation at high temperatures and high-speed operation at low temperatures.The storage device includes a driver circuit and a plurality of memory cells, and the memory cell includes a transistor and a capacitor; the transistor includes a metal oxide in a channel formation region. In the case where the transistor includes a first gate and a second gate, the driver circuit has a function of driving the second gate, and the driver circuit outputs a potential corresponding to the temperature of the storage device or the temperature of an environment where the storage device is placed to the second gate in a period during which the memory cell retains data.

公开(公告)号：US20200287026A1

公开(公告)日：2020-09-10

申请号：US16878758

申请日：2020-05-20

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Junichi KOEZUKA ,  Yukinori SHIMA ,  Hajime TOKUNAGA ,  Toshinari SASAKI ,  Keisuke MURAYAMA ,  Daisuke MATSUBAYASHI

IPC: H01L29/66 ,  H01L21/02 ,  H01L29/51 ,  H01L29/786 ,  H01L27/12

Abstract: To reduce defects in an oxide semiconductor film in a semiconductor device. To improve the electrical characteristics and the reliability of a semiconductor device including an oxide semiconductor film. In a semiconductor device including a transistor including a gate electrode formed over a substrate, a gate insulating film covering the gate electrode, a multilayer film overlapping with the gate electrode with the gate insulating film provided therebetween, and a pair of electrodes in contact with the multilayer film, a first oxide insulating film covering the transistor, and a second oxide insulating film formed over the first oxide insulating film, the multilayer film includes an oxide semiconductor film and an oxide film containing In or Ga, the first oxide insulating film is an oxide insulating film through which oxygen is permeated, and the second oxide insulating film is an oxide insulating film containing more oxygen than that in the stoichiometric composition.

公开(公告)号：US20200279951A1

公开(公告)日：2020-09-03

申请号：US16645669

申请日：2018-09-10

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Ryota HODO ,  Daisuke MATSUBAYASHI ,  Motomu KURATA ,  Ryunosuke HONDA

IPC: H01L29/786 ,  H01L29/24 ,  H01L29/66 ,  H01L21/02 ,  H01L27/105

Abstract: A semiconductor device with excellent electric characteristics is provided. The semiconductor device includes an oxide in a channel formation region. The semiconductor device includes the oxide over a substrate, a first insulator over the oxide, a second insulator over the first insulator, a third insulator, and a conductor over the third insulator. The oxide and the first insulator are in contact with each other in a region. An opening exposing the oxide is provided in the first insulator and the second insulator. The third insulator is placed to cover an inner wall and a bottom surface of the opening. The conductor is placed to fill the opening. The conductor has a region overlapping with the oxide with the third insulator between the conductor and the oxide. The first insulator contains an element other than a main component of the oxide.

公开(公告)号：US20200185528A1

公开(公告)日：2020-06-11

申请号：US16634493

申请日：2018-07-26

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Daisuke MATSUBAYASHI ,  Ryota HODO ,  Daigo ITO ,  Hiroaki HONDA ,  Satoru OKAMOTO

IPC: H01L29/786 ,  G11C11/4091 ,  H01L27/108 ,  H01L27/105 ,  H01L27/12 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66 ,  H01L29/24

Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes an oxide; a first conductor and a second conductor over the oxide; a third conductor over the oxide; a first insulator provided between the oxide and the third conductor and covering a side surface of the third conductor; a second insulator over the third conductor and the first insulator; a third insulator positioned over the first conductor and at a side surface of the second insulator; a fourth insulator positioned over the second conductor and at a side surface of the second insulator; a fourth conductor being in contact with a top surface and a side surface of the third insulator and electrically connected to the first conductor; and a fifth conductor being in contact with a top surface and a side surface of the fourth insulator and electrically connected to the second conductor. The first insulator is between the third insulator and the third conductor, and between the fourth insulator and the third conductor.

公开(公告)号：US20200152671A1

公开(公告)日：2020-05-14

申请号：US16736862

申请日：2020-01-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Tetsuhiro TANAKA ,  Kazuki TANEMURA ,  Daisuke MATSUBAYASHI

IPC: H01L27/12 ,  H01L23/522

Abstract: A miniaturized transistor with reduced parasitic capacitance and highly stable electrical characteristics is provided. High performance and high reliability of a semiconductor device including the transistor is achieved. A first conductor is formed over a substrate, a first insulator is formed over the first conductor, a layer that retains fixed charges is formed over the first insulator, a second insulator is formed over the layer that retains fixed charges, and a transistor is formed over the second insulator. Threshold voltage Vth is controlled by appropriate adjustment of the thicknesses of the first insulator, the second insulator, and the layer that retains fixed charges.