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103 条记录 (耗时 0.029 秒)

    Feed screw mechanism
    71.
    发明授权
    Feed screw mechanism 有权
    进料螺杆机构

    公开(公告)号：US08973453B2

    公开(公告)日：2015-03-10

    申请号：US13004256

    申请日：2011-01-11

    申请人： Yoshihiro Fukano ,  Toru Sugiyama ,  Masaki Imamura

    发明人： Yoshihiro Fukano ,  Toru Sugiyama ,  Masaki Imamura

    IPC分类号： F16H25/24 ,  F16H25/22

    CPC分类号： F16H25/24 ,  F16H25/2204 ,  F16H2025/2445 ,  Y10T74/18648 ,  Y10T74/18656 ,  Y10T74/1868

    摘要： A feed screw mechanism includes a feed screw shaft connected to a drive source and formed with first screw threads on an outer circumferential surface thereof, and a displacement nut, which is screw-engaged with respect to the feed screw shaft through a plurality of balls. The displacement nut is supported with respect to a slider that makes up an electric actuator by a pair of pins. The pins are inserted and fixed in first pin holes formed in the slider, and distal end portions of the pins are inserted respectively into second pin holes formed in the displacement nut.

    摘要翻译： 进料螺杆机构包括连接到驱动源并且在其外周表面上形成有第一螺纹的进给螺杆轴以及通过多个滚珠相对于进给螺杆轴螺纹接合的位移螺母。 位移螺母相对于通过一对销构成电致动器的滑块来支撑。 销被插入并固定在形成在滑块中的第一销孔中，并且销的远端部分别插入形成在位移螺母中的第二销孔中。

    Semiconductor device
    72.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08866151B2

    公开(公告)日：2014-10-21

    申请号：US13425246

    申请日：2012-03-20

    申请人： Takao Noda ,  Ryoichi Ohara ,  Kenya Sano ,  Toru Sugiyama

    发明人： Takao Noda ,  Ryoichi Ohara ,  Kenya Sano ,  Toru Sugiyama

    IPC分类号： H01L29/161 ,  H01L29/47 ,  H01L29/872 ,  H01L29/66 ,  H01L29/16 ,  H01L29/20 ,  H01L29/43 ,  H01L29/06 ,  H01L21/04

    CPC分类号： H01L29/1608 ,  H01L21/0465 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/2003 ,  H01L29/43 ,  H01L29/6606 ,  H01L29/872

    摘要： According to one embodiment, a semiconductor device includes a semiconductor layer of a first conductivity type, a first region of a second conductivity type selectively provided in a first major surface of the semiconductor layer, a second region of the second conductivity type selectively provided in the first major surface and connected to the first region, a first electrode provided in contact with the semiconductor layer and the first region, a second electrode provided in contact with the second region, and a third electrode electrically connected to a second major surface of the semiconductor layer opposite to the first major surface.

    摘要翻译： 根据一个实施例，半导体器件包括第一导电类型的半导体层，选择性地设置在半导体层的第一主表面中的第二导电类型的第一区域，第二导电类型的第二区域选择性地设置在 第一主表面并连接到第一区域，与半导体层和第一区域接触设置的第一电极，与第二区域接触的第二电极和与半导体的第二主表面电连接的第三电极 层与第一主表面相对。

    SEMICONDUCTOR DEVICE
    73.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20120241762A1

    公开(公告)日：2012-09-27

    申请号：US13425246

    申请日：2012-03-20

    申请人： Takao NODA ,  Ryoichi Ohara ,  Kenya Sano ,  Toru Sugiyama

    发明人： Takao NODA ,  Ryoichi Ohara ,  Kenya Sano ,  Toru Sugiyama

    IPC分类号： H01L29/161 ,  H01L29/47

    CPC分类号： H01L29/1608 ,  H01L21/0465 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/2003 ,  H01L29/43 ,  H01L29/6606 ,  H01L29/872

    摘要： According to one embodiment, a semiconductor device includes a semiconductor layer of a first conductivity type, a first region of a second conductivity type selectively provided in a first major surface of the semiconductor layer, a second region of the second conductivity type selectively provided in the first major surface and connected to the first region, a first electrode provided in contact with the semiconductor layer and the first region, a second electrode provided in contact with the second region, and a third electrode electrically connected to a second major surface of the semiconductor layer opposite to the first major surface.

    摘要翻译： 根据一个实施例，半导体器件包括第一导电类型的半导体层，选择性地设置在半导体层的第一主表面中的第二导电类型的第一区域，第二导电类型的第二区域选择性地设置在 第一主表面并连接到第一区域，与半导体层和第一区域接触设置的第一电极，与第二区域接触的第二电极和与半导体的第二主表面电连接的第三电极 层与第一主表面相对。

    BATTERY MANUFACTURING METHOD, BATTERY, PRE-WELDING POSITIVE PLATE MANUFACTURING METHOD, AND PRE-WELDING POSITIVE PLATE
    74.
    发明申请
    BATTERY MANUFACTURING METHOD, BATTERY, PRE-WELDING POSITIVE PLATE MANUFACTURING METHOD, AND PRE-WELDING POSITIVE PLATE 有权
    电池制造方法，电池，预焊接正极板制造方法和预焊平板

    公开(公告)号：US20120052380A1

    公开(公告)日：2012-03-01

    申请号：US13217570

    申请日：2011-08-25

    申请人： Hideo NAKAMURA ,  Yoshinori Shibata ,  Toru Sugiyama ,  Takahiro Kuhara ,  Yoshinori Nishio ,  Takeshi Kotani ,  Satoshi Yoneyama

    发明人： Hideo NAKAMURA ,  Yoshinori Shibata ,  Toru Sugiyama ,  Takahiro Kuhara ,  Yoshinori Nishio ,  Takeshi Kotani ,  Satoshi Yoneyama

    IPC分类号： H01M4/64 ,  B23K31/02 ,  H01M4/04 ,  H01M10/00

    CPC分类号： H01M10/049 ,  H01M4/70 ,  H01M4/808 ,  H01M10/0413 ,  H01M10/345

    摘要： Provided is a method of manufacturing a battery having an electrode module including: a positive plate having a cathode collector portion formed by attaching a lead member to a cathode substrate made of a foamed metal plate; and a cathode collector plate welded to the cathode collector portion. The method includes: a pre-welding positive plate forming process of forming a pre-welding positive plate, which is the positive plate before welding, such that the pre-welding positive plate has a projection projecting from a pre-welding cathode collector portion, which is the cathode collector portion before welding; and a welding process of melting a pre-welding cathode collector plate to weld it to the projection. In the pre-welding positive plate forming process, the projection is formed into such a shape that the condition that S≦1.3W is satisfied, where W and S represent the width and the circumferential length of the projection, respectively.

    摘要翻译： 本发明提供一种具有电极模块的电池的制造方法，所述电池模块包括：正极板，具有通过将引线部件附接到由发泡金属板制成的阴极基板而形成的阴极集电部; 以及阴极收集板，其与阴极收集部焊接。 该方法包括：预焊正极板形成工艺，其形成预焊正极板，其为焊接前的正极板，使得预焊正极板具有从预焊阴极集电器部分突出的突起， 其为焊接前的阴极集电体部分; 以及熔化预焊阴极集电板以将其焊接到突起的焊接工艺。 在预焊正极板形成工序中，突起形成为满足S＆lt; l1; 1.3W的条件，其中W和S分别表示突起的宽度和周长。

    Parking assist device
    76.
    发明授权
    Parking assist device 失效
    停车辅助装置

    公开(公告)号：US07599773B2

    公开(公告)日：2009-10-06

    申请号：US10928256

    申请日：2004-08-30

    申请人： Yuu Tanaka ,  Yoshifumi Iwata ,  Hideyuki Iwakiri ,  Hisashi Satonaka ,  Yuichi Kubota ,  Tomohiko Endo ,  Akira Matsui ,  Toru Sugiyama ,  Seiji Kawakami ,  Katsuhiko Iwazaki ,  Hiroaki Kataoka

    发明人： Yuu Tanaka ,  Yoshifumi Iwata ,  Hideyuki Iwakiri ,  Hisashi Satonaka ,  Yuichi Kubota ,  Tomohiko Endo ,  Akira Matsui ,  Toru Sugiyama ,  Seiji Kawakami ,  Katsuhiko Iwazaki ,  Hiroaki Kataoka

    IPC分类号： G06K9/32 ,  G08G1/14

    CPC分类号： B62D15/0285 ,  B60T2201/10

    摘要： A parking assist device for assisting parking operation to a target parking position includes an initial position setting device for setting an initial position of the target parking position to park a vehicle, a designation display showing the target parking position, a display position calculation device for calculating an initial display position of the designation display showing the target parking position at a screen showing vehicle surroundings based on the initial position determined by the initial position setting device, and an initial display position shifting device for shifting the initial display position of the designation display to a position within a display range on the screen in case the initial display position calculated by the display position calculation device is positioned outside of the display range on the screen.

    摘要翻译： 一种用于辅助驻车操作到目标停车位置的停车辅助装置包括：初始位置设定装置，用于设定目标停车位置的初始位置以停放车辆;指示显示目标停车位置;显示位置计算装置， 基于由初始位置设定装置决定的初始位置的显示车辆周边的画面的指定显示的初始显示位置和用于将指定显示的初始显示位置移位到的初始显示位置移动装置 在由显示位置计算装置计算的初始显示位置位于屏幕上的显示范围之外的情况下在屏幕上的显示范围内的位置。

    Vehicle information processing apparatus, verification method of a vehicle information processing apparatus, and ID registration method of a vehicle information processing apparatus
    77.
    发明授权
    Vehicle information processing apparatus, verification method of a vehicle information processing apparatus, and ID registration method of a vehicle information processing apparatus 有权
    车辆信息处理装置，车辆信息处理装置的验证方法以及车辆信息处理装置的ID登录方法

    公开(公告)号：US07482913B2

    公开(公告)日：2009-01-27

    申请号：US11480462

    申请日：2006-07-05

    申请人： Hideki Kusunoki ,  Toru Sugiyama

    发明人： Hideki Kusunoki ,  Toru Sugiyama

    IPC分类号： B60C23/02

    CPC分类号： B60C23/0416 ,  B60C23/0415

    摘要： A vehicle information processing apparatus provided in a vehicle is provided with a TPMS valve that includes an air pressure sensor which obtains a tire air pressure as wheel information and a wheel-side communication device that transmits the wheel information and an ID unique to that wheel-side communication device at regular intervals; an ECU which receives the wheel information from the wheel-side communication device in each TPMS valve via a vehicle body-side communication device and processes that wheel information; and an onboard battery which supplies power to the ECU. Upon receiving a command to shift into a verification mode while power is being supplied from the onboard battery, the ECU performs a predetermined verification based on a signal transmitted at regular intervals from each wheel-side communication device. After receiving the command to shift into the verification mode, the ECU remains in the verification mode until a preset condition is satisfied.

    摘要翻译： 设置在车辆中的车辆信息处理装置设置有TPMS阀，其包括获得轮胎气压作为车轮信息的气压传感器和传递车轮信息的车轮侧通信装置和对车轮信息特有的ID， 定期通信设备; ECU，其经由车体侧通信装置从各车体侧通信装置接收车轮信息，并处理车轮信息; 以及向ECU供电的车载电池。 在从车载电池供电的同时接收到转换为验证模式的命令时，ECU基于从每个车轮侧通信装置规则间隔发送的信号进行预定的验证。 在接收到切换到验证模式的命令之后，ECU保持在验证模式，直到满足预设条件。

    Semiconductor device fabrication method
    80.
    发明申请
    Semiconductor device fabrication method 审中-公开
    半导体器件制造方法

    公开(公告)号：US20060128119A1

    公开(公告)日：2006-06-15

    申请号：US11282664

    申请日：2005-11-21

    申请人： Yasunobu Saito ,  Toru Sugiyama

    发明人： Yasunobu Saito ,  Toru Sugiyama

    IPC分类号： H01L21/78 ,  H01L21/461

    CPC分类号： H01L21/78 ,  H01L21/76885

    摘要： According to the present invention, there is provided a semiconductor device fabrication method comprising: forming a circuit pattern of a semiconductor element and a ground pad connected to a ground interconnection of said circuit pattern, in a semiconductor chip region divided into a plurality of portions on a main surface of a semiconductor substrate; forming a separation groove in a separation region for separating a plurality of semiconductor chips; forming a metal film so as to cover the main surface of said semiconductor substrate; forming an insulating film so as to cover said metal film on the main surface of said semiconductor substrate and fill said separation groove; etching an entire surface of said insulating film to leave said insulating film behind on a bottom of said separation groove; forming a metal layer connected to said ground pad via said metal film, and extending to an upper end of said insulating film on the bottom of said separation groove; and polishing a back surface of said semiconductor substrate until the bottom of said separation groove is exposed, and cutting the semiconductor chip region from said separation groove, thereby separating said plurality of semiconductor chips.

    摘要翻译： 根据本发明，提供了一种半导体器件的制造方法，包括：在分成多个部分的半导体芯片区域中形成半导体元件的电路图案和连接到所述电路图案的接地互连的接地焊盘 半导体衬底的主表面; 在用于分离多个半导体芯片的分离区域中形成分离槽; 形成金属膜以覆盖所述半导体衬底的主表面; 形成绝缘膜以覆盖所述半导体衬底的主表面上的所述金属膜并填充所述分离槽; 蚀刻所述绝缘膜的整个表面以将所述绝缘膜留在所述分离槽的底部上; 通过所述金属膜形成连接到所述接地焊盘的金属层，并延伸到所述隔离槽底部的所述绝缘膜的上端; 并抛光所述半导体衬底的背面，直到所述分离槽的底部露出，并从所述分隔槽切割半导体芯片区域，从而分离所述多个半导体芯片。