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71.发明授权公开(公告)号：US09254997B2
公开(公告)日：2016-02-09
申请号：US14013080
申请日：2013-08-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Kai-Chih Liang , Chia-Hua Chu
CPC classification number: B81C1/00238 , B81B2201/0264
Abstract: A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device.
Abstract translation: 传感器由粘合在一起的两个基板组成。 第一衬底包括压敏微电机械（MEMS）结构和向外突出超过第一衬底的第一面的导电接触结构。 第二基板包括互补金属氧化物半导体（CMOS）器件和由侧壁构成的接收结构，所述接收结构满足从第二基板的第一面凹入的导电表面。 导电接合材料将导电接触结构物理地粘附到导电表面并将MEMS结构电耦合到CMOS器件。
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72.发明申请公开(公告)号：US20150091153A1
公开(公告)日：2015-04-02
申请号：US14041298
申请日：2013-09-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Chia Liu , Chia-Hua Chu , Kuei-Sung Chang , Chun-Wen Cheng
CPC classification number: B81C1/00293 , B81B3/0018 , B81B3/0059 , B81B3/0067 , B81B7/0032 , B81B7/0041 , B81B7/02 , B81C1/00158 , B81C2203/0145 , H01L29/84
Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.
Abstract translation: 本公开涉及一种在晶片封装系统上形成具有多个具有不同压力的空腔的多个MEM器件的方法，以及相关联的装置。 在一些实施例中，该方法通过提供具有多个微机电系统（MEM）装置的工件来执行。 帽盖晶片在具有第一压力的第一周围环境中结合到工件上。 接合形成与多个保持在第一压力下的多个MEM装置邻接的多个空腔。 一个或多个开口形成在多个空腔中的一个或多个空腔中，导致可以保持在不同于第一压力的压力水平的气体流动路径。 然后将多个空腔中的一个或多个中的一个或多个开口密封在具有不同压力的不同周围环境中，从而使多个空腔中的一个或多个保持在不同的压力。
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73.发明申请公开(公告)号：US20150061046A1
公开(公告)日：2015-03-05
申请号：US14013155
申请日：2013-08-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Kuei-Sung Chang , Chia-Hua Chu , Yu-Chia Liu
CPC classification number: B81B7/04 , B81B7/0041 , B81B7/02 , B81B2201/0235 , B81C1/00214 , B81C1/00269 , B81C1/00293 , B81C2203/0109 , B81C2203/0145
Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure.
Abstract translation: 本公开涉及一种在基板上形成具有多个具有不同压力的室的多个MEM装置的方法，以及相关联的装置。 在一些实施例中，该方法通过提供具有多个微机电系统（MEM）装置的装置晶片来执行。 帽盖晶片在具有第一压力的第一环境环境中结合到器件晶片上。 接合形成与多个保持在第一压力下的多个MEM装置邻接的多个室。 一个或多个开口形成在多个室中的一个或多个室中。 然后将多个腔室中的一个或多个室中的一个或多个开口密封在具有不同压力的不同环境环境中，从而使多个室中的一个或多个保持在不同的压力。
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公开(公告)号：US11530130B2
公开(公告)日：2022-12-20
申请号：US16950169
申请日：2020-11-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Kuei-Sung Chang , Chia-Hua Chu , Shang-Ying Tsai
Abstract: Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) structure including an epitaxial layer overlying a MEMS substrate. The method includes bonding a MEMS substrate to a carrier substrate. The epitaxial layer is formed over the MEMS substrate, where the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts is formed over the epitaxial layer.
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公开(公告)号：US11486854B2
公开(公告)日：2022-11-01
申请号：US16727738
申请日：2019-12-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Alexander Kalnitsky , Yi-Shao Liu , Kai-Chih Liang , Chia-Hua Chu , Chun-Ren Cheng , Chun-Wen Cheng
Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.
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Patent Agency Ranking
公开(公告)号：US11342266B2
公开(公告)日：2022-05-24
申请号：US16934144
申请日：2020-07-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu
IPC: H01L23/532 , B81C1/00 , H01L21/82
Abstract: An integrated circuit (IC) with an integrated microelectromechanical systems (MEMS) structure is provided. In some embodiments, the IC comprises a semiconductor substrate, a back-end-of-line (BEOL) interconnect structure, the integrated MEMS structure, and a cavity. The BEOL interconnect structure is over the semiconductor substrate, and comprises wiring layers stacked in a dielectric region. Further, an upper surface of the BEOL interconnect structure is planar or substantially planar. The integrated MEMS structure overlies and directly contacts the upper surface of the BEOL interconnect structure, and comprises an electrode layer. The cavity is under the upper surface of the BEOL interconnect structure, between the MEMS structure and the BEOL interconnect structure.
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公开(公告)号：US11292712B2
公开(公告)日：2022-04-05
申请号：US16731183
申请日：2019-12-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yi-Chuan Teng , Chun-Yin Tsai , Chia-Hua Chu , Chun-Wen Cheng
IPC: H01L41/113 , B81B3/00 , B81C1/00 , H04R19/00
Abstract: Structures and formation methods of a semiconductor device structure are provided. The method includes forming a first dielectric layer over a substrate and forming a first recess in the first dielectric layer. The method also includes conformally forming a first movable membrane over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion in the first recess. The method further includes forming a second dielectric layer over the first movable membrane and partially removing the substrate, the first dielectric layer, and the second dielectric layer to form a cavity. In addition, the first corrugated portion of the first movable membrane is partially sandwiched between the first dielectric layer and the second dielectric layer.
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公开(公告)号：US11206493B2
公开(公告)日：2021-12-21
申请号：US16174159
申请日：2018-10-29
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Chen Hsiung Yang , Chun-Wen Cheng , Chia-Hua Chu , En-Chan Chen
Abstract: A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.
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公开(公告)号：US11184694B2
公开(公告)日：2021-11-23
申请号：US16813923
申请日：2020-03-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun-Yin Tsai , Tzu-Heng Wu , Wen-Cheng Kuo
Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.
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公开(公告)号：US11089408B2
公开(公告)日：2021-08-10
申请号：US16907657
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen Cheng , Chia-Hua Chu , Chun Yin Tsai
Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
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