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391 条记录 (耗时 0.015 秒)

    Diffraction limited dichroic combiner diode laser
    71.
    发明授权
    Diffraction limited dichroic combiner diode laser 失效
    衍射限制二向色组合二极管激光器

    公开(公告)号：US4823357A

    公开(公告)日：1989-04-18

    申请号：US928356

    申请日：1986-11-10

    申请人： William L. Casey

    发明人： William L. Casey

    IPC分类号： G02B6/34 ,  G02B6/42 ,  H01S3/00 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/06 ,  H01S5/40 ,  H01S3/08

    CPC分类号： G02B6/4246 ,  G02B6/4249 ,  H01S5/02248 ,  H01S5/02415 ,  H01S5/4012 ,  G02B6/29358 ,  G02B6/29365 ,  G02B6/29367 ,  G02B6/4215 ,  G02B6/4259 ,  G02B6/4266 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0078 ,  H01S5/02453 ,  H01S5/4087

    摘要： A laser transmitter is disclosed in which the laser combines the outputs of numerous laser diodes using dichroic combination to produce a high power, diffraction limited beam which may be transmitted at minimum beam divergence using the full aperture of the transmitter telescope. The individual diode beams are combined and superimposed in the laser, and are transmitted superimposed in the near and far field of the transmitter telescope. The dichroic combining process is as follows. A collimate beam of a first wavelength is directed at a narrowband or long wave pass filter which is tilted slightly (about 10 degrees). This beam passes through the filter. A beam of a second wavelength is directed toward the exit side of the filter (which acts as a mirror) at such an angle that the second beam is reflected colinear with the first beam and superimposed on it. This process of superimposing the laser beams continues as each laser beam from the laser diodes is added to form a combined laser beam. Before transmission, a sample is extracted from the combined laser beam, and filtered at the discrete wavelengths of the laser diodes to determine if each of the laser diodes needs to be adjusted. When necessary, the laser diodes are thermally adjusted so that their laser beams are at their specific discrete wavelength.

    摘要翻译： 公开了一种激光发射器，其中激光器使用二向色组合使多个激光二极管的输出相结合，以产生可以使用发射望远镜的全孔径在最小光束发散下传输的高功率衍射受限束。 单个二极管光束被组合并叠加在激光器中，并且被叠加在发射望远镜的近场和远场中。 二向色组合过程如下。 第一波长的准直光束指向稍微倾斜（约10度）的窄带或长波通滤波器。 该光束通过过滤器。 第二波长的光束以与第一光束共线反射并叠加在其上的角度指向滤光器的出射侧（其用作反射镜）。 当加入激光二极管的每个激光束以形成组合的激光束时，叠加激光束的这个过程继续进行。 在传输之前，从组合的激光束中提取样本，并在激光二极管的离散波长处进行滤波，以确定是否需要调整每个激光二极管。 必要时激光二极管进行热调节，使其激光束处于其特定的离散波长。

    400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERMOELECTRIC COOLER (TEC) SUBSTRATE
    73.
    发明公开
    400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERMOELECTRIC COOLER (TEC) SUBSTRATE 审中-公开

    公开(公告)号：US20240280771A1

    公开(公告)日：2024-08-22

    申请号：US18437258

    申请日：2024-02-09

    申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

    发明人： Jie Huang

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4271 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4286

    摘要： A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PCB substrate; the silicon photonic integrated circuit board is provided on the TEC substrate; the silicon photonic integrated circuit board is provided with an extended segment; the extended segment extends to one side and to the PCB substrate; a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.

    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD
    74.
    发明公开
    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD 审中-公开

    公开(公告)号：US20240231023A9

    公开(公告)日：2024-07-11

    申请号：US18493097

    申请日：2023-10-24

    申请人： Formerica Optoelectronics, Inc.

    发明人： Yun-Cheng HUANG ,  Yi-Nan SHIH ,  Chih-Chung LIN ,  Yun-Chin TSAI

    IPC分类号： G02B6/42 ,  H05K1/02

    CPC分类号： G02B6/4271 ,  G02B6/4246 ,  G02B6/428 ,  H05K1/0203 ,  H05K2201/10151 ,  H05K2201/10219

    摘要： An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

    RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND OPTICAL MODULE
    75.
    发明公开
    RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND OPTICAL MODULE 审中-公开

    公开(公告)号：US20240201459A1

    公开(公告)日：2024-06-20

    申请号：US18179788

    申请日：2023-03-07

    申请人： Global Technology Inc.

    发明人： Na ZHANG ,  Fan YANG ,  Qikun HUANG

    IPC分类号： G02B6/42 ,  H04B10/2575

    CPC分类号： G02B6/428 ,  G02B6/4251 ,  G02B6/4271 ,  H04B10/2575

    摘要： A RoF communication device includes a RF circuit board and an optical module. The optical module includes a casing, a connection circuit board, an optical transmitting unit and an optical receiving unit. The casing is connected with the RF circuit board. The connection circuit board is accommodated in the casing. The optical transmitting unit is mounted on the connection circuit board. The optical receiving unit is mounted on the connection circuit board. The electrical interface of the RF circuit board is provided in the casing, and the optical transmitting unit and the optical receiving unit are electrically connected with the electrical interface.

    Optical subassembly
    77.
    发明授权
    Optical subassembly 有权

    公开(公告)号：US11740419B2

    公开(公告)日：2023-08-29

    申请号：US17038076

    申请日：2020-09-30

    申请人： CIG Photonics Japan Limited

    发明人： Daisuke Noguchi ,  Hiroshi Yamamoto

    IPC分类号： H05K1/02 ,  H05K1/18 ,  G02B6/42 ,  H01S5/024 ,  H04Q11/00 ,  H01S5/02212 ,  H01S5/02345

    CPC分类号： G02B6/428 ,  G02B6/4246 ,  G02B6/4263 ,  G02B6/4271 ,  H01S5/02212 ,  H01S5/02345 ,  H01S5/02415 ,  H04Q11/0005 ,  H04Q2011/0041

    摘要： Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.

    A Connector System
    78.
    发明公开
    A Connector System 审中-公开

    公开(公告)号：US20230213714A1

    公开(公告)日：2023-07-06

    申请号：US18008540

    申请日：2020-06-10

    申请人： Telefonaktiebolaget LM Ericsson (publ)

    发明人： Marco Assale ,  Angelo Rivara ,  Claudio D'Incà ,  Sergio Lanzone ,  Sergio Mosti

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4269 ,  G02B6/4292 ,  G02B6/428 ,  G02B6/4271

    摘要： There is provided an interface module (200), comprising: an interface (208) for connection with a signal connector (250); a cage (206) for guiding the signal connector towards the interface; and a heat sink (202). The cage (206) comprises a cage portion (212) that is configured to move from a first position to a second position upon insertion of the signal connector (250) into the cage. In the first position, the cage portion is not in thermal contact with the heat sink; when in the second position, the cage portion is in thermal contact with the heat sink. The cage portion (212) comprises one or more apertures (218).