公开(公告)号：US20080073026A1

公开(公告)日：2008-03-27

申请号：US11902598

申请日：2007-09-24

Applicant: Junichi Yoshida ,  Seiichi Inoue

Inventor： Junichi Yoshida ,  Seiichi Inoue

IPC: B29C65/14 ,  B05D1/26 ,  C08K3/10

CPC classification number: H05K3/3484 ,  H05K2201/0224 ,  H05K2203/013 ,  H05K2203/0425 ,  H05K2203/09 ,  H05K2203/105

Abstract: The method of supplying a liquid bonding material includes the steps of: preparing a liquid bonding material containing an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge; and condensing and supplying the liquid bonding material by means of an electrostatic force generated between a supply side and a supply receiving side for the liquid bonding material.

Abstract translation: 供给液体接合材料的方法包括以下步骤：制备包含绝缘溶剂和分散在绝缘溶剂中的带电粒子的液体接合材料，带电粒子由金属颗粒构成，绝缘树脂材料涂覆金属颗粒和 负责; 并且通过在液体接合材料的供给侧和供电接收侧之间产生的静电力来冷凝和供给液体粘合材料。

公开(公告)号：US07198983B2

公开(公告)日：2007-04-03

申请号：US11067727

申请日：2005-03-01

Applicant: Kengo Iwata ,  Koji Sato

Inventor： Kengo Iwata ,  Koji Sato

IPC: H01L21/00

CPC classification number: H01L24/11 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3478 ,  H05K2201/0224 ,  H05K2203/041 ,  H05K2203/121 ,  H01L2224/29099

Abstract: The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.

Abstract translation: 本发明提供了一种解决微粘附问题的焊球，并且还解决了微粘附性和润湿性的两个问题，以及防止焊球微粘附的方法。 也就是说，本发明提供一种在气相中凝固和球化获得的焊料球，并且具有吸附在其表面上的金属皂分子，优选厚度为3nm以下的金属皂分子膜。 作为金属皂，可以使用例如硬脂酸钙，硬脂酸镁或硬脂酸钡。 本发明优选应用于直径为400μm以下的焊球。 本发明还提供了一种防止焊锡球的微粘附的方法，其包括将通过固化和球化获得的焊球浸入气相中，在其中分散有金属皂的溶液中，优选将含有分散的金属皂的溶液 其浓度小于5ppm; 从溶液中取出焊球; 汽化锡球表面的溶剂; 然后干燥表面。 干燥优选在相对湿度RH <= 40％的气氛中进行。

公开(公告)号：US20070059503A1

公开(公告)日：2007-03-15

申请号：US11595574

申请日：2006-11-10

Applicant: Jin Park ,  Tae Bae ,  Jung Jun ,  Jae Lee ,  Jae Hong

Inventor： Jin Park ,  Tae Bae ,  Jung Jun ,  Jae Lee ,  Jae Hong

IPC: B32B3/00 ,  B32B5/16

CPC classification number: H01B1/22 ,  H01L2224/29399 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0224 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

Abstract translation: 公开了用于各向异性导电膜的绝缘导电颗粒。 颗粒的一个实施方案包括不连续地固定在导电颗粒的表面上的导电颗粒和绝缘固定颗粒。 绝缘颗粒与其他相邻的绝缘导电颗粒提供绝缘，而绝缘导电颗粒电连接在电极之间，绝缘固定颗粒偏离其位置。 本公开还提供了制造绝缘导电颗粒的方法，包含绝缘导电颗粒的各向异性导电粘合剂膜以及使用该膜的电连接结构。

公开(公告)号：US20070054984A1

公开(公告)日：2007-03-08

申请号：US11325813

申请日：2006-01-05

Applicant: Jung Jun ,  Jin Park ,  Jae Lee

Inventor： Jung Jun ,  Jin Park ,  Jae Lee

IPC: B32B1/00 ,  B32B15/02 ,  C08K9/02

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided. In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.

Abstract translation: 提供绝缘导电颗粒，各向异性粘合膜和使用其的电连接。 在本发明的一些实施方式中，绝缘性导电性粒子包括具有与其结合的绝缘性微粒的导电性粒子，其中绝缘性微粒包括硬质粒子区域和软质功能性树脂区域，其中，所述软质功能性树脂区域具有能够 结合金属。

公开(公告)号：US07179417B2

公开(公告)日：2007-02-20

申请号：US11435614

申请日：2006-05-17

Applicant: Masaaki Yoshikawa ,  Haruo Aoyama ,  Hirotaka Tanaka

Inventor： Masaaki Yoshikawa ,  Haruo Aoyama ,  Hirotaka Tanaka

IPC: B23K35/14 ,  B23K35/26

CPC classification number: C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3484 ,  H05K2201/0224

Abstract: An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content being effective quantity for forming a protective magnesium oxide film on the solder surface and also for destroying said oxide film during soldering. When solder paste is preserved, the inside of solder particle is protected by the protective magnesium oxide film formed on the surface of solder particle, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at elevated temperature during soldering, a state where said protective oxide film is easily destroyed is obtained, so that good wettability is held.

Abstract translation: 根据本发明的Sn-Zn无铅焊料合金是以至少含有6〜10重量％的锌，还含有0.0015〜0.1重量％的镁的Sn系焊料合金构成的， 所述镁含量是在焊料表面上形成保护性氧化镁膜的有效量，并且还用于在焊接期间破坏所述氧化膜。 当焊膏被保存时，焊料颗粒的内部由形成在焊料颗粒表面上的保护性氧化镁膜保护，锌和活化剂之间的反应被抑制，从而保持了稳定性，并且在高温下 焊接时，获得容易破坏所述保护氧化膜的状态，从而保持良好的润湿性。

公开(公告)号：US20070018315A1

公开(公告)日：2007-01-25

申请号：US10546057

申请日：2003-09-18

Applicant: Hugh Craig ,  Derril Steele

Inventor： Hugh Craig ,  Derril Steele

IPC: H01L23/48

CPC classification number: H01B1/22 ,  C08G59/3209 ,  C09J9/02 ,  C09J163/00 ,  H05K3/321 ,  H05K3/3489 ,  H05K2201/0224 ,  H05K2203/0315 ,  H05K2203/1157

Abstract: A conductive adhesive composition includes a cross-linkable, adhesive component, a fluxing agent, and a conductive metal that has a surface on which is present a metal oxide. The adhesive component includes an epoxy resin and the fluxing agent includes a phenol. The phenol is reactive with the metal oxide on the surface of the conductive metal to at least partially remove the metal oxide from the surface of the conductive metal. As a result, a conductivity of the conductive adhesive composition is increased. The composition is particularly useful at interfaces between electrical or electronic components where it serves to physically mount and electrically connect necessary components and to continuously inhibit metal oxides from forming.

Abstract translation: 导电粘合剂组合物包括可交联的粘合剂组分，助熔剂和导电金属，其表面上存在金属氧化物。 粘合剂组分包括环氧树脂，助熔剂包括苯酚。 该酚与导电金属表面上的金属氧化物反应，以至少部分地从导电金属的表面除去金属氧化物。 结果，导电性粘合剂组合物的导电性提高。 该组合物特别适用于电气或电子组件之间的界面，其用于物理安装和电连接所需组分，并连续地抑制金属氧化物的形成。

公开(公告)号：US20060217462A1

公开(公告)日：2006-09-28

申请号：US11202216

申请日：2005-08-12

Applicant: Takuro Hoshio ,  Hitoshi Okazaki ,  Masayuki Okoshi ,  Michiaki Yasuno

Inventor： Takuro Hoshio ,  Hitoshi Okazaki ,  Masayuki Okoshi ,  Michiaki Yasuno

IPC: C08K3/10 ,  B32B27/38

CPC classification number: H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0224 ,  Y10T428/31511

Abstract: A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.

公开(公告)号：US20060194425A1

公开(公告)日：2006-08-31

申请号：US11337000

申请日：2006-01-23

Applicant: Daijiro Takano ,  Hikaru Fujita

Inventor： Daijiro Takano ,  Hikaru Fujita

IPC: H01L21/4763 ,  H01L23/48 ,  H01L21/324

CPC classification number: H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

公开(公告)号：US20050272249A1

公开(公告)日：2005-12-08

申请号：US11137698

申请日：2005-05-24

Applicant: Andreas Karl ,  Andreas Muller-Hipper ,  Frank Puschner ,  Ewald Simmerlein-Erlbacher

Inventor： Andreas Karl ,  Andreas Muller-Hipper ,  Frank Puschner ,  Ewald Simmerlein-Erlbacher

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H01L21/4763

CPC classification number: G06K19/07749 ,  H05K3/102 ,  H05K3/184 ,  H05K3/246 ,  H05K2201/0224 ,  H05K2203/0315

Abstract: A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.

Abstract translation: 一种在基板上制造导电图案的方法，包括以下步骤：通过直接使用导电图案的粘合力，提供基板的表面，该导电层是通过至少部分地提供导电颗粒来提供基板的表面而形成的 衬底的表面，向导电层施加钝化层，钝化层形成为导电图案的负像，并且在未被钝化层覆盖的区域中形成导电图案。

公开(公告)号：US20050100735A1

公开(公告)日：2005-05-12

申请号：US10888619

申请日：2004-07-09

Applicant: Sanyogita Arora ,  Gerard Minogue

Inventor： Sanyogita Arora ,  Gerard Minogue

IPC: B05D7/00 ,  B22F1/00 ,  B23K35/34 ,  B32B5/16 ,  C23C20060101 ,  H05K3/34

CPC classification number: B22F1/0062 ,  B22F1/0059 ,  B22F2998/00 ,  B23K35/34 ,  H05K3/3484 ,  H05K2201/0224 ,  H05K2203/0425 ,  H05K2203/105 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract translation: 一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。 该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动 。 用于静电或电动沉积过程的静电和电动移动颗粒。 颗粒包括涂层介质和颗粒体上的电荷导向器。