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公开(公告)号：US20240116750A1
公开(公告)日：2024-04-11
申请号：US18480936
申请日：2023-10-04
申请人： ROHM CO., LTD.
发明人： Takashi NAIKI
IPC分类号： B81B7/00
CPC分类号： B81B7/0048 , B81B2201/0264 , B81B2207/07
摘要： A MEMS module includes: a substrate; a semiconductor chip in which a MEMS including a mechanical movable portion is formed; and a soft member that is interposed between the substrate and the semiconductor chip and has a lower hardness than the substrate, wherein the soft member is disposed in a partial region of a first main surface of the semiconductor chip facing the substrate.
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公开(公告)号：US11957059B2
公开(公告)日：2024-04-09
申请号：US17294152
申请日：2019-11-15
发明人： Andrew Vella , Peter Mardilovich
IPC分类号： H01L41/053 , B41J2/14 , B41J2/16 , B81B3/00 , H10N30/00 , H10N30/20 , H10N30/853 , H10N30/87 , H10N30/88
CPC分类号： H10N30/883 , B41J2/14201 , B41J2/1623 , B41J2/1628 , B81B3/0021 , H10N30/10516 , H10N30/2047 , H10N30/8554 , H10N30/8561 , H10N30/871 , B81B2201/057 , B81B2203/04
摘要： The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an insulated electrical component for a microelectromechanical systems device comprising: i) a substrate layer comprising first and second sides spaced apart in a thickness direction; ii) one or more electrical elements arranged over the first side of the substrate layer, wherein each of the one or more electrical elements comprises: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a continuous insulating layer, or laminate of insulating layers, arranged to overlie each of the one or more electrical elements arranged on the first side of the substrate layer; and iv) a passivation layer, or laminate of multiple passivation layers, disposed adjacent to, and at least partially overlying, each of the one or more electrical elements so as to provide electrical passivation between the first and second electrodes of each of the one or more electrical elements; wherein: a) the passivation layer, or at least an innermost layer of the laminate of multiple passivation layers which is disposed adjacent each of the one or more underlying electrical elements, is discontinuous; and/or b) the laminate of multiple passivation layers is recessed at a side which faces away from each of the underlying electrical elements, wherein a recess is provided in a region overlying each of the one or more electrical elements, such that the laminate of passivation layers is thinner in a thickness direction across the recess compared to other non-recessed regions of the laminate of passivation layers.
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公开(公告)号：US11953674B2
公开(公告)日：2024-04-09
申请号：US17153521
申请日：2021-01-20
发明人： Jose A. Martinez
CPC分类号： G02B26/0841 , B81B7/02 , B81C1/00047 , B81B2201/042 , B81C2201/0132 , B81C2201/0133 , G09G3/346
摘要： A microelectromechanical system (MEMS) structure includes at least first and second metal vias. Each of the first and second metal vias includes a respective planar metal layer having a first thickness and a respective post formed from the planar metal layer. The post has a sidewall, and the sidewall has a second thickness greater than 14% of the first thickness.
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公开(公告)号：US11952267B2
公开(公告)日：2024-04-09
申请号：US17584698
申请日：2022-01-26
申请人： INVENSENSE, INC.
发明人： Alan Cuthbertson , Daesung Lee
CPC分类号： B81C1/00166 , B81B3/001 , B81B3/0056 , B81B3/0089 , B81B2203/04 , B81C1/00031 , B81C2201/0166 , B81C2201/115
摘要： A modification to rough polysilicon using ion implantation and silicide is provided herein. A method can comprise depositing a hard mask on a single crystal silicon, patterning the hard mask, and depositing metal on the single crystal silicon. The method also can comprise forming silicide based on causing the metal to react with exposed silicon of the single crystal silicon. Further, the method can comprise removing unreacted metal and stripping the hard mask from the single crystal silicon. Another method can comprise forming a MEMS layer based on fusion bonding a handle MEMS with a device layer. The method also can comprise implanting rough polysilicon on the device layer. Implanting the rough polysilicon can comprise performing ion implantation of the rough polysilicon. Further, the method can comprise performing high temperature annealing. The high temperature can comprise a temperature in a range between around 700 and 1100 degrees Celsius.
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公开(公告)号：US20240114795A1
公开(公告)日：2024-04-04
申请号：US18092942
申请日：2023-01-04
发明人： Yu Shen , Qiang Dan , Yiwei Zhou , Yang Li
IPC分类号： H10N30/20 , B81B7/02 , H10N30/00 , H10N30/057 , H10N30/853
CPC分类号： H10N30/20 , B81B7/02 , H10N30/057 , H10N30/10513 , H10N30/853 , B81B2201/0257 , B81B2203/0315 , B81B2203/04
摘要： The present invention provides a micro electromechanical system (MEMS), which includes: a base with a cavity, a vibration structure includes a structural layer, a piezoelectric composite layer and a flexible layer; the structural layer includes a structural slab, a structural fixing portion and a plurality of structural springs; the piezoelectric composite layer includes a piezoelectric film, a first electrode layer and a second electrode layer; the stress of the piezoelectric composite layer can be released through the elastic actions of the structural springs. In addition, the rigidity of the overall structure is ensured and will not be too low. Therefore, the sound pressure level of the MEMS piezoelectric loudspeaker is improved, and the THD is reduced to improve the performance of the MEMS piezoelectric loudspeaker.
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公开(公告)号：US11945715B2
公开(公告)日：2024-04-02
申请号：US17089160
申请日：2020-11-04
申请人： Robert Bosch GmbH
发明人： Hans-Peter Brueckner
摘要： A method for determining a temperature compensation parameter for compensation of temperature effects on measured values of a sensor system having a sensor unit for acquiring measured values of a sensor measuring variable. The method includes: monitoring the measuring situation of the sensor unit; determining whether the current measuring situation corresponds to a reference measuring situation for which a reference measured value of the sensor measuring variable is known; monitoring the temperature of the sensor unit; determining whether the current temperature lies within a predefined temperature range; acquiring different temperature values within the predefined temperature range and acquiring the respective associated measured values of the sensor measuring variable when the current measuring situation corresponds to a reference measuring situation; determining a temperature compensation parameter based on the reference measured value of the sensor measuring variable, the different temperature values, and the associated measured values of the sensor measuring variable.
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公开(公告)号：US11944412B2
公开(公告)日：2024-04-02
申请号：US17336725
申请日：2021-06-02
发明人： Hao-Jan Mou , Ying-Lun Chang , Ching-Sung Lin , Chi-Feng Huang , Yung-Lung Han , Chang-Yen Tsai , Wei-Ming Lee , Chun-Yi Kuo , Tsung-I Lin
CPC分类号： A61B5/02133 , B81B3/0021 , A61B2560/0214 , A61B2562/028 , B81B2201/054 , B81B2203/0127 , B81B2207/012
摘要： A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas. The gas is introduced into the flowing-channel space through the inlet apertures and transported into the airbag through the outlet aperture, to inflate the airbag for blood pressure measurement, and a detection datum of blood pressure outputted by the gas-pressure-sensing element is transmitted to the microprocessor to calculate.
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公开(公告)号：US20240106357A1
公开(公告)日：2024-03-28
申请号：US18266963
申请日：2021-10-13
CPC分类号： H02N2/188 , B81B3/0021 , B81C1/00166 , B81B2203/0136 , B81B2203/0163 , B81C2201/0132 , B81C2201/0133
摘要： A great force is prevented from acting on an elastic support section of a MEMS vibration-driven energy harvesting element. A vibration-driven energy harvesting element has a fixed electrode fixed to a base section, a movable electrode movable relative to the fixed electrode, an elastic support section which has one end connected to the base section and the other end connected to the movable electrode and elastically supports the movable electrode, and at least one of a first member which is fixed to the movable electrode and faces the base section or a member fixed to the base section at a distance in a direction orthogonal to a vibration plane on which the movable electrode vibrates, and a second member which is fixed to the base section and faces the movable electrode or a member fixed to the movable electrode at a distance in a direction orthogonal to the vibration plane.
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公开(公告)号：US20240092633A1
公开(公告)日：2024-03-21
申请号：US18466895
申请日：2023-09-14
发明人： Anton MELNIKOV , Jörg AMELUNG , Bert KAISER , Michael STOLZ
IPC分类号： B81B7/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2201/058 , B81B2203/0127 , B81B2207/01 , B81B2207/053 , B81B2207/056
摘要： An MEMS has a substrate and a cavity arranged in the substrate. A movable element is arranged in the cavity, configured to interact with a fluid arranged in the cavity, wherein a movement of the fluid and a movement of the movable element are causally related. A first opening which connects the cavity to an environment of the substrate causes a first phase offset of a first periodic oscillation which is causally related to the movement of the movable element when passing through the first opening. A second opening which connects the cavity to the environment of the substrate causes a second phase offset, different from the first phase offset, of a second periodic oscillation which is causally related to the movement of the movable element when passing through the second opening.
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公开(公告)号：US20240092630A1
公开(公告)日：2024-03-21
申请号：US18263267
申请日：2022-01-17
发明人： Chunzhi DONG , Hiroyuki AIZAWA
IPC分类号： B81B3/00
CPC分类号： B81B3/0021 , B81B2201/0228 , B81B2203/0307 , B81B2203/04
摘要： A capacitive sensor includes at least one support member, a first anchor member, a second anchor member, a first connecting member, and a second connecting member. The first anchor member is fixed to only the first substrate of the first substrate and the second substrate. The second anchor member is fixed to the first substrate and the second substrate. The first connecting member is separate from the first substrate and the second substrate and connects the first anchor member to the movable member. The second connecting member connects the first anchor member to the second anchor member. The first connecting member includes a first elastic member which is elastically deformable. The second connecting member includes at least one second elastic member which is separate from the first substrate and the second substrate and which is elastically deformable.
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