Abstract:
A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.
Abstract:
A method includes coupling two conducting rods between terminals of a battery cell of a battery having several branches coupled in parallel, each branch having several battery cells coupled in series. A force tending to squeeze the rods against each other is applied, with the rods being held apart from each other using an insulating block. At least one operating state signal of the cell is monitored, and the insulating block is removed based on the monitoring, allowing the rods to come into electrical contact and short-circuit the battery cell.
Abstract:
A method for controlling an IC having logic cells and a clock-tree cell. Each logic cell has first and second FETs, which are pMOS and nMOS respectively. The clock-tree cell includes third and fourth FETs, which are pMOS and nMOS respectively. The clock-tree cell provides a clock signal to the logic cells. A back gate potential difference (“BGPD”) of a pMOS-FET is a difference between its source potential less its back-gate potential, and vice versa for an nMOS-FET. The method includes applying first and second back gate potential difference (BGPD) to a logic cell's first and second FETs and either applying a third BGPD to a third FET, wherein the third BGPD is positive and greater than the first BGPD applied, which is applied concurrently, or applying a fourth BGEPD to a fourth FET, wherein the fourth BGPD is positive and greater than the second BGPD that is applied concurrently.
Abstract:
The method for producing a substrate provided with protection of its edges has a first step which is providing a substrate having a semiconductor material base. The substrate has opposite first and second main surfaces connected by a lateral surface. A first layer made from first protective material is then formed so as to coat the substrate. The first protective material is then etched on the lateral surface leaving a pattern of first protective material at least partially covering each of the first and second surfaces, and a second protective layer made from second protective material is then formed on the lateral surface devoid of the first protective material. After formation of the second protective layer, the first protective material is eliminated from the substrate.
Abstract:
A first assembly of critical cells is to be monitored. An equivalent capacitance of output cells coupled to the critical path is determined. Logic level inputs of the critical cells for signal propagation are also determined. A second assembly of control logic cells is provided which copies the first assembly in terms of number of cells, type of cells and cell connection such that each of the control cells is a homolog of a corresponding critical cell. Charge cells are provided at the outputs of the control cells having an equivalent capacitance in accordance with the determined capacitance of the output cells. For each control cell, logic levels are asserted in accordance with the determined configuration of the critical path. A signal generator applies a signal the input of the second assembly and a signal receiver is coupled to the output of the second assembly.
Abstract:
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Abstract:
Embodiments described in the present disclosure relate to a method for providing power for an integrated system, including acts of: providing the system with power, ground and body bias voltages, the body bias voltages comprising a body bias voltage of p-channel MOS transistors, greater or lower than the supply voltage, and a body bias voltage of n-channel MOS transistors, lower or greater than the ground voltage, selecting by means of the system out of the voltages provided, depending on whether a processing unit of the system is in a period of activity or inactivity, voltages to be supplied to bias the bodies of the MOS transistors of the processing unit, and providing the bodies of the MOS transistors of the processing unit with the voltages selected.
Abstract:
A frequency oscillator includes a ring oscillator having N inverters coupled in series, where N is an odd integer equal to three or more. A first filter is coupled between an output node of a first of the inverters and an output line of the frequency oscillator. A second filter is coupled between an output node of a second of the inverters and the output line of the frequency oscillator.
Abstract:
A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.
Abstract:
An integrated circuit includes a transistor, an UTBOX buried insulating layer disposed under it, a ground plane disposed under the layer, a well disposed under the plane, a first trench made at a periphery of the transistor and extending through the layer and into the well, a substrate situated under the well, a p-n diode made on a side of the transistor and comprising first and second zones of opposite doping, the first zone being configured for electrical connection to a first electrode of the transistor, wherein first and second zones are coplanar with the plane, a second trench for separating the first and second zones, the second trench extending through the layer into the plane and until a depth less than an interface between the plane and the well, and a third zone under the second trench forming a junction between the zones.