摘要:
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip and a second chip electrically and mechanically coupled by a grid of connectors. The chip stack includes a thermal interface material (TIM) between the first chip and the second chip. The TIM includes nanofibers aligned parallel to mating surfaces of the first and second chips, and a thermosetting polymer that when heated, will reduce the viscosity of the TIM to allow for optimal alignment of the carbon nanofibers. The method includes adding at least one thermosetting polymer to the TIM, dispersing nanofibers into the TIM, and heating the TIM until the thermosetting polymer un-crosslinks. The method further includes applying a magnetic field to align the graphite nanofibers and cooling the TIM until the thermosetting polymer re-crosslinks.
摘要:
An enhanced chelator includes a chelating agent and a volatile material encapsulated in a biologically benign microcapsule. The enhanced chelator possesses significantly improved shelf-life in aqueous biological buffer solutions because the chelating agent is encapsulated in the microcapsule and, therefore, separated from solution components with which the chelating agent would react. The enhanced chelator is activated at a predetermined elevated temperature defined by the boiling point of the volatile material. At this predetermined elevated temperature, the volatile material exerts a vapor pressure sufficient to rupture the microcapsule and thereby release the chelating agent from the microcapsule. In one embodiment, a manganese chelator such as ethylene glycol tetraacetic acid (EGTA) is solubilized in ethanol and encapsulated in a poly(lactic-co-glycolide) (PLGA) microsphere. Upon heating to 80° C., ethanol boils within the PLGA microsphere and undergoes several orders of magnitude volume change, thereby rupturing the PLGA microsphere and releasing EGTA.
摘要:
A solvent wash employing a polar washing solvent is employed to effectively remove the sizing agent on a woven glass cloth, while retaining the tensile strength of the woven glass cloth. Loss of tensile strength of the woven glass cloth due to removal of a sizing agent from the woven glass cloth is compensated by simultaneous or subsequent deposition of a coupling agent on surfaces from which the sizing agent is removed. The concurrent removal of the sizing agent and deposition of the coupling agent provides an effective removal of the sizing agent while maintaining sufficient tensile strength to structurally support the woven glass cloth. Further, integration of the removal of the sizing agent and the simultaneous deposition of the coupling agent in the washing solvent in a same processing step can provide a cost-effective manufacturing method for forming a finished woven glass cloth.
摘要:
An approach is provided in detecting plated-through hole defects in printed circuit boards (PCBs). The printed circuit board is exposed to a modified-silane solution. The modified-silane solution has a luminescent moiety and the modified-silane solution binds to exposed glass within a glass fiber layer of the printed circuit board. Plated-through hole defects are identified in the printed circuit board by detecting a luminescence at a surface location of the printed circuit board. Each surface location where the luminescence is detected corresponds to one of the plated-through hole defects.
摘要:
Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances.
摘要:
A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads.
摘要:
An early warning sulfur detection system for detecting the presence of corrosive gases, especially elemental sulfur (S8), in air employs a substrate that includes a polymer-bound phosphine compound having sulfur-getting functionality. The phosphine compound in the polymer reacts with any airborne elemental sulfur. This reaction is accompanied by a decrease in the fluorescence intensity (If) of the substrate. The If of the substrate is monitored in real time by a spectrofluorometer to detect a change in fluorescence intensity (ΔIf). In an embodiment sited in a data center, an alarm is triggered if the ΔIf is above a predetermined threshold, thereby providing a real-time, early warning to IT professionals that corrective action is required to protect metal conductors from corrosion. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide).
摘要:
A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.
摘要:
A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.
摘要:
A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.