Electronic package and device including same

    公开(公告)号:US12082354B2

    公开(公告)日:2024-09-03

    申请号:US17574362

    申请日:2022-01-12

    Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

    MEDICAL FLUID DELIVERY DEVICE PROGRAMMING
    86.
    发明公开

    公开(公告)号:US20240269377A1

    公开(公告)日:2024-08-15

    申请号:US18643658

    申请日:2024-04-23

    Inventor: Touby A. Drew

    Abstract: In some aspects, systems, devices, and techniques for programming a medical fluid delivery device are described. In one example, the disclosure relates to a system including a medical fluid delivery device configured to deliver a therapeutic agent to a patient, and a processor. The processor may be configured to receive a proposed therapy dosing program that defines a fluid therapy for delivery to a patient via a medical fluid delivery device for a first period of time, determine a total dosage over a second period of time, where the second period of time at least partially overlaps the first period of time, and compare the total dosage over the second period of time to a reference dosage.

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