Abstract:
An embodiment buck converter control circuit comprises an error amplifier configured to generate an error signal based on a feedback signal and a reference signal, a pulse generator circuit configured to generate a pulsed signal having switching cycles set to high and low as a function of the error signal, a driver circuit configured to generate a drive signal for an electronic switch of the buck converter as a function of the pulsed signal, a variable load, connected between two output terminals of the buck converter, configured to absorb a current based on a control signal, and a detector circuit configured to monitor a first signal indicative of an output current provided by the buck converter and a second signal indicative of a negative transient of the output current, and verify whether the second signal indicates a negative transient of the output current.
Abstract:
An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
Abstract:
A reflector micromechanical structure includes a frame with a window. The frame is elastically connected to an anchorage structure by first elastic elements. An actuation structure operatively coupled to the frame is configured to generate a first actuation movement of the frame about a first actuation axis. A mobile mass is positioned within the window and elastically coupled to the frame by second elastic elements. A mass distribution is associated to the mobile mass such as to generate, by an inertial effect in response to the first actuation movement, a second actuation movement of rotation of the mobile mass about a second actuation axis.
Abstract:
A pressure sensor device is to be positioned within a material where a mechanical parameter is measured. The pressure sensor device may include an IC having a ring oscillator with an inverter stage having first doped and second doped piezoresistor couples. Each piezoresistor couple may include two piezoresistors arranged orthogonal to one another with a same resistance value. Each piezoresistor couple may have first and second resistance values responsive to pressure. The IC may include an output interface coupled to the ring oscillator and configured to generate a pressure output signal based upon the first and second resistance values and indicative of pressure normal to the IC.
Abstract:
A pressure sensor device is to be positioned within a material where a mechanical parameter is measured. The pressure sensor device may include an IC having a ring oscillator with an inverter stage having first doped and second doped piezoresistor couples. Each piezoresistor couple may include two piezoresistors arranged orthogonal to one another with a same resistance value. Each piezoresistor couple may have first and second resistance values responsive to pressure. The IC may include an output interface coupled to the ring oscillator and configured to generate a pressure output signal based upon the first and second resistance values and indicative of pressure normal to the IC.
Abstract:
A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.
Abstract:
According to embodiments, a phase change memory (PCM) array includes a plurality of memory cells grouped into memory blocks. In the PCM array, each memory cell is a PCM cell. The PCM array also includes a plurality of erase flag cells. Each erase flag cell of the plurality of erase flag cells is associated with a memory block and indicates whether the memory block stores valid data or erased data.
Abstract:
A method is for reducing pulse skipping from a characteristic affecting a modulating signal input to an integrator of a pulse width modulation (PWM) modulator, together with a square wave carrier signal for generating a triangular waveform of the PWM modulator. The method may include creating a broad synchronous peak at vertexes of the triangular waveform output by the integrator.
Abstract:
An embodiment of a circuit includes an input node, a generator, a combiner, a converter, and a filter. The input node is configured to receive an input signal in a first domain, and the generator is configured to generate a periodic signal in the first domain. The combiner is configured to combine the input and periodic signals into a resulting signal in the first domain, and the converter is configured to convert the resulting signal into a converted signal in a second domain. And the filter is configured to remove from the converted signal substantially all of a frequency component of the converted signal having substantially a same frequency as a frequency component of the periodic signal.
Abstract:
A power electronic device includes first and second electronic switches, each integrated on a package having a low parasitic inductance, a supply terminal and a ground terminal. The first conduction terminal of the first switch may be coupled with the supply terminal, and the second conduction terminal of the second electronic switch may be coupled with the ground terminal. The corresponding control terminals of the switches may be coupled to corresponding pilot drivers. The package may include first and second electric terminals, wherein the second conduction terminal of the first switch is coupled to the first electric terminal, and the first conduction terminal of the second switch is coupled to the second electric terminal. A first inductance may be interposed between the first electric terminal and the output terminal and/or a second inductance interposed between the second electric terminal and the output terminal.