公开(公告)号：USD673935S1

公开(公告)日：2013-01-08

申请号：US29404736

申请日：2011-10-25

Applicant: Sang-Ho Lee

Designer： Sang-Ho Lee

公开(公告)号：US20120319267A1

公开(公告)日：2012-12-20

申请号：US13163611

申请日：2011-06-17

Applicant: DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

Inventor： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC: H01L23/34 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.

Abstract translation: 一种制造集成电路封装系统的方法，包括：提供基底; 将具有接触垫的包装堆叠组件附接在所述基底基板上; 将具有锥形侧的空腔的封装直接施加在封装堆叠组件上方，该接触垫暴露在空腔中; 将凹陷的电路单元附接在所述空腔和所述接触垫上，所述凹腔由所述凹陷电路单元和所述空腔的锥形侧形成; 并将热结构安装在凹进的电路单元，空腔和封装之上。

公开(公告)号：US20120290303A1

公开(公告)日：2012-11-15

申请号：US13466700

申请日：2012-05-08

Applicant: Sang Ho LEE ,  Hoon KIM ,  Dong Ook KOO ,  Dae Sung JUNG

Inventor： Sang Ho LEE ,  Hoon KIM ,  Dong Ook KOO ,  Dae Sung JUNG

IPC: G10L15/04

CPC classification number: G10L15/22 ,  G10L15/30

Abstract: A speech recognition system and method based on word-level candidate generation are provided. The speech recognition system may include a speech recognition result verifying unit to verify a word sequence and a candidate word for at least one word included in the word sequence when the word sequence and the candidate word are provided as a result of speech recognition. A word sequence displaying unit may display the word sequence in which the at least one word is visually distinguishable from other words of the word sequence. The word sequence displaying unit may display the word sequence by replacing the at least one word with the candidate word when the at least one word is selected by a user.

Abstract translation: 提供了一种基于词级候选生成的语音识别系统和方法。 语音识别系统可以包括语音识别结果验证单元，用于当作为语音识别的结果提供单词序列和候选词时，验证单词序列和包含在单词序列中的至少一个单词的候选词。 字序列显示单元可以显示字序列，其中至少一个字在视觉上与单词序列的其他单词区分开。 当用户选择至少一个单词时，字序列显示单元可以通过用候选词替换至少一个单词来显示单词序列。

公开(公告)号：US20120241676A1

公开(公告)日：2012-09-27

申请号：US13388702

申请日：2010-08-03

Applicant: Jin Hong Kim ,  Sang Ho Lee ,  Gyung Rok Kim ,  Il Yong Jeong ,  Sun Choi ,  Seung Hoon Oh ,  Gyoo Tae Kim ,  Yong Il Lee

Inventor： Jin Hong Kim ,  Sang Ho Lee ,  Gyung Rok Kim ,  Il Yong Jeong ,  Sun Choi ,  Seung Hoon Oh ,  Gyoo Tae Kim ,  Yong Il Lee

IPC: C01B3/24 ,  C01B3/38

CPC classification number: C10J3/00 ,  C01B3/24 ,  C01B2203/0272 ,  C10J2300/093 ,  C10J2300/0966 ,  C10J2300/0973 ,  C10J2300/0986 ,  C10J2300/1659 ,  C10J2300/1665 ,  C10J2300/1807 ,  C10K1/003 ,  C10K3/06

Abstract: The present invention relates to a method for gasification of carbon-containing materials, and more specifically, to a method for gasification of carbon-containing materials which allows an increase in carbon efficiency and a reduction in carbon dioxide emission, comprising the steps of: gasification of carbon-containing materials to methane; thermal decomposition of CH4 to C and H2; and conversion of CO2 to CO using the carbon produced during the decomposition. The method of the present invention greatly increases carbon efficiency and reduces the generation of carbon dioxide.

Abstract translation: 本发明涉及含碳材料的气化方法，更具体地说，涉及一种能够提高碳效率和减少二氧化碳排放的含碳材料的气化方法，包括以下步骤：气化 含碳材料到甲烷; CH4到C和H2的热分解; 并使用分解过程中产生的碳将CO 2转化为CO。 本发明的方法大大地提高了碳效率并减少了二氧化碳的产生。

公开(公告)号：US08275389B2

公开(公告)日：2012-09-25

申请号：US12337088

申请日：2008-12-17

Applicant: Sung-Beom Jung ,  Jae-Yeong Kwon ,  Soo-Yeul Oh ,  Pyeong-Hwan Wee ,  Sang-Jun Lee ,  Young-Hak Choi ,  Sang-Ho Lee

Inventor： Sung-Beom Jung ,  Jae-Yeong Kwon ,  Soo-Yeul Oh ,  Pyeong-Hwan Wee ,  Sang-Jun Lee ,  Young-Hak Choi ,  Sang-Ho Lee

IPC: H04W74/00 ,  H04W24/00 ,  H04W4/00 ,  H04B7/00

CPC classification number: H04W60/04 ,  H04B17/318 ,  H04W68/00

Abstract: An apparatus and method for determining operation of location update in a broadband wireless communication system are provided. The apparatus includes a receiver, an interpreter, and a determiner. In an idle mode, the receiver receives a paging advertisement message from a Base Station (BS). The interpreter identifies paging group identification information included in the paging advertisement message. The determiner determines one of execution and non-execution of a location update process due to a change of a paging group if the paging group identification information is different from paging group identification information included in a previously received paging advertisement message.

Abstract translation: 提供了一种用于确定宽带无线通信系统中的位置更新操作的装置和方法。 该装置包括接收器，解释器和确定器。 在空闲模式中，接收机从基站（BS）接收寻呼广告消息。 解释器识别寻呼广告消息中包括的寻呼组标识信息。 如果寻呼组识别信息不同于先前接收的寻呼广告消息中包括的寻呼组标识信息，则由于寻呼组的改变，确定器确定位置更新过程的执行和不执行之一。

公开(公告)号：US08239853B2

公开(公告)日：2012-08-07

申请号：US11953191

申请日：2007-12-10

Applicant: Sang Ho Lee

Inventor： Sang Ho Lee

IPC: G06F9/44

CPC classification number: H04L51/38

Abstract: A method of displaying an attachment file list in a mobile communication terminal comprises receiving a message, selecting an attachment file list view menu in order to check entire attachment files comprised in the message, and extracting the attachment files comprised in the message and then displaying a list of the extracted attachment files.

Abstract translation: 一种在移动通信终端中显示附件文件列表的方法包括接收消息，选择附件文件列表视图菜单以便检查包含在消息中的整个附件文件，以及提取消息中包含的附件​​文件，然后显示 提取的附件文件列表。

公开(公告)号：US08229205B2

公开(公告)日：2012-07-24

申请号：US12253618

申请日：2008-10-17

Applicant: Chan-Kyeong Hyon ,  Young-Seog Kang ,  Sang-Ho Lee ,  Hyun-Jong Lee

Inventor： Chan-Kyeong Hyon ,  Young-Seog Kang ,  Sang-Ho Lee ,  Hyun-Jong Lee

IPC: G06K9/00 ,  G06K9/36 ,  G06K9/32

CPC classification number: G03F1/84

Abstract: A pattern matching method for use in manufacturing a semiconductor memory device increases a pattern matching rate between a GDS image and an SEM image. The pattern matching method includes extracting a scanning electron microscope (SEM) image and a graphic data system (GDS) image to perform a pattern matching; performing a two-dimensional Fourier transform (FFT) for the extracted GDS image and analyzing a low spatial frequency; deciding whether or not a pattern is a repeated pattern or non-repeated pattern by using the analyzed low spatial frequency; and limiting an X/Y range for a pattern matching when the decision result is for the repeated pattern, and then performing the pattern matching between the SEM image and the GDS image.

Abstract translation: 用于制造半导体存储器件的图案匹配方法增加了GDS图像和SEM图像之间的图案匹配率。 模式匹配方法包括提取扫描电子显微镜（SEM）图像和图形数据系统（GDS）图像以执行模式匹配; 对所提取的GDS图像执行二维傅里叶变换（FFT）并分析低空间频率; 通过使用所分析的低空间频率来确定图案是否是重复图案或非重复图案; 并且当判定结果用于重复图案时，限制用于模式匹配的X / Y范围，然后执行SEM图像和GDS图像之间的图案匹配。

公开(公告)号：US08210238B2

公开(公告)日：2012-07-03

申请号：US12306216

申请日：2007-06-22

Applicant: Jung Wook Cho ,  Hyun Seok Jeong ,  Jong Min Park ,  Goo Hwa Kim ,  Oh Duck Kwon ,  Joong Kil Park ,  Soon Kyu Lee ,  Sang Ho Lee ,  Ki Hyeon Moon

Inventor： Jung Wook Cho ,  Hyun Seok Jeong ,  Jong Min Park ,  Goo Hwa Kim ,  Oh Duck Kwon ,  Joong Kil Park ,  Soon Kyu Lee ,  Sang Ho Lee ,  Ki Hyeon Moon

IPC: B22D11/00 ,  B22D11/108

CPC classification number: B22D11/108 ,  B22D11/111 ,  B22D11/165

Abstract: A continuous casting machine and method using molten mold flux, wherein the continuous casting machine includes a mold cover for covering an upper portion of a mold; a mold flux melting unit for melting mold flux to be supplied into the mold; and a mold flux delivery unit for supplying the mold with the molten mold flux melted in the mold flux melting unit, wherein the delivery unit includes an injection tube with one end connected to the mold flux melting unit and the other end positioned in the mold through the mold cover, and an injection tube heater for heating the injection tube. Since a slag bear continuous casting machine and method using molten mold flux is removed, the consumption of mold flux is greatly increased compared with the case of a conventional casting work, so that the friction between a mold and a solidified shell is reduced. As a result, an amount of scarfing of a cast piece is greatly reduced and no carbon pick-up occurs.

Abstract translation: 一种使用熔融熔渣的连续铸造机和方法，其中连续铸造机包括用于覆盖模具上部的模具盖; 用于熔化待供应到模具中的熔渣的熔模熔化单元; 以及模具通量输送单元，用于向模具供应在熔剂熔化单元中熔化的熔融熔渣，其中所述输送单元包括注射管，所述注射管的一端连接到模具熔剂单元，而另一端位于模具通过 模具盖和用于加热注射管的注射管加热器。 由于除去渣渣连续铸造机和使用熔融模具助熔剂的方法，与常规铸造工艺相比，模具焊剂的消耗大大增加，使得模具和固化壳体之间的摩擦力降低。 结果，铸件的切割量大大降低，并且不会发生碳吸收。

公开(公告)号：US20120158297A1

公开(公告)日：2012-06-21

申请号：US13332147

申请日：2011-12-20

Applicant: Jae Ho Kim ,  Sang Ho Lee ,  Yeong Jin Kim

Inventor： Jae Ho Kim ,  Sang Ho Lee ,  Yeong Jin Kim

IPC: G01C21/00

CPC classification number: G01C21/206 ,  G06Q30/0639 ,  G07G1/0081 ,  H04L67/02 ,  H04W4/026 ,  H04W4/027 ,  H04W4/029 ,  H04W4/33 ,  H04W4/80

Abstract: Disclosed is an indoor location recognition system capable of providing location based services indoors. The indoor location recognition system includes a portable terminal including a short range location recognition system and a wireless communication system using an RFID technology and a two-dimensional bar code technology, a geomagnetic sensor, a camera, an RFID reader or tag, an indoor navigation device calculating a moving distance from revolutions of a wheel of a shopping cart to transmit the calculated moving distance to the portable terminal, shopping mall map information transmitted to the portable terminal, and shopping mall application programs providing location based services. The shopping mall to which the indoor location recognition system according to the exemplary embodiments of the present invention is applied can reduce initial installation costs and operation costs while providing high accuracy of location estimation.

Abstract translation: 公开了一种能够在室内提供基于位置的服务的室内位置识别系统。 室内位置识别系统包括便携式终端，其包括短距离位置识别系统和使用RFID技术和二维条形码技术的无线通信系统，地磁传感器，相机，RFID读取器或标签，室内导航 计算从购物车的车轮旋转移动的移动距离，以将计算出的移动距离传送到便携式终端，发送到便携式终端的购物中心地图信息，以及提供基于位置的服务的购物中心应用程序。 根据本发明的示例性实施例的室内位置识别系统应用的商场可以降低初始安装成本和操作成本，同时提供高精度的位置估计。

公开(公告)号：US08189344B2

公开(公告)日：2012-05-29

申请号：US12136037

申请日：2008-06-09

Applicant: Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

Inventor： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC: H01L23/02 ,  H01L21/00 ,  H05K1/16

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

Abstract translation: 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。