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    Wafer bake apparatus
    81.
    发明申请
    Wafer bake apparatus 失效
    晶圆烘焙设备

    公开(公告)号：US20060049168A1

    公开(公告)日：2006-03-09

    申请号：US11206842

    申请日：2005-08-19

    Applicant: Dong-woo Lee ,  Jin-sung Lee ,  Jong-kill Lim ,  Bang-weon Lee ,  Tae-sang Park ,  Tae-gyu Kim

    Inventor： Dong-woo Lee ,  Jin-sung Lee ,  Jong-kill Lim ,  Bang-weon Lee ,  Tae-sang Park ,  Tae-gyu Kim

    IPC: H05B3/68

    CPC classification number: H01L21/67109 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/6838

    Abstract: A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

    Abstract translation: 晶片烘烤装置包括与晶片提升单元联动操作的气缸结构的气流控制单元，并且在晶片和热板之间引起空气流动。 因此，当将晶片放置在烘烤位置时，晶片和热板之间的空气下降。 结果，晶片不再受到空气阻力的影响，并且可以更准确地放置在烘烤位置。 此外，当烘烤的晶片被提升到卸载位置时，加热板和晶片之间的空气上升，这又支持晶片并防止晶片的变形。

    Temperature measuring apparatus using change of magnetic field
    82.
    发明申请
    Temperature measuring apparatus using change of magnetic field 有权
    使用磁场变化的温度测量装置

    公开(公告)号：US20050286607A1

    公开(公告)日：2005-12-29

    申请号：US11167093

    申请日：2005-06-28

    Applicant: Tae-gyu Kim ,  Seong-gu Kim

    Inventor： Tae-gyu Kim ,  Seong-gu Kim

    IPC: G01J5/00 ,  G01K7/00 ,  G01K13/00

    CPC classification number: G01K7/00

    Abstract: A temperature measuring apparatus measures the temperature of a wafer in real time using a change of magnetic field during a thermal process. The temperature measuring apparatus includes: at least one conductive structure disposed on one surface of the wafer, in which an electrical conductivity of the conductive structure varies depending on temperature; a magnetic field generator installed facing the conductive structure with respect to a center of the wafer; and a magnetic field measuring sensor installed above the conductive structure.

    Abstract translation: 温度测量装置在热处理期间使用磁场的变化来实时测量晶片的温度。 所述温度测量装置包括：至少一个导电结构，设置在所述晶片的一个表面上，其中所述导电结构的导电性根据温度而变化; 相对于晶片的中心面向导电结构安装的磁场发生器; 以及安装在导电结构上方的磁场测量传感器。

    Optical device module using integral heat transfer module
    83.
    发明授权
    Optical device module using integral heat transfer module 有权
    光器件模块采用整体传热模块

    公开(公告)号：US06677555B2

    公开(公告)日：2004-01-13

    申请号：US09935825

    申请日：2001-08-23

    Applicant: Oh-Dal Kwon ,  Sun-Tae Jung ,  Tae-Gyu Kim

    Inventor： Oh-Dal Kwon ,  Sun-Tae Jung ,  Tae-Gyu Kim

    IPC: H05B300

    CPC classification number: G02B7/008 ,  G02B7/028 ,  G02B7/1815 ,  G05D23/19 ,  H01L23/38 ,  H01L31/024 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.

    Abstract translation: 一种使用整体传热模块的光学装置模块。 传热模块具有一体形成的热源和用于读取温度的温度传感器。 在封装光器件模块时简化了传热路径，使得光学器件可以避免由于不均匀的温度分布引起的性能下降。 可以降低功耗，并且可以确保优异的可加工性。

    Fusing roller assembly having working fluid and heater coil for quick heating and low power consumption for an electrophotographic image forming apparatus and method of making the same
    84.
    发明授权
    Fusing roller assembly having working fluid and heater coil for quick heating and low power consumption for an electrophotographic image forming apparatus and method of making the same 失效
    具有用于快速加热的工作流体和加热器线圈的定影辊组件和用于电子照相成像设备的低功率消耗的定影辊组件及其制造方法

    公开(公告)号：US06571080B2

    公开(公告)日：2003-05-27

    申请号：US09947657

    申请日：2001-09-07

    Applicant: Kyung-woo Lee ,  Tae-gyu Kim

    Inventor： Kyung-woo Lee ,  Tae-gyu Kim

    IPC: G03G1520

    CPC classification number: G03G15/2053 ,  H05B3/0095

    Abstract: A structurally improved fusing roller assembly based on a heat pipe principle is provided. The fusing roller assembly includes a fusing roller that serves as a heat pipe, and a resistance heater and/or a halogen lamp inside the fusing roller, so that the surface of the fusing roller can be instantaneously heated up to a target fusing temperature. The fusing roller assembly can be heated up to a target fusing temperature within a shorter period of time without need for a warm-up period and a stand-by period, so that power consumption decreases.

    Abstract translation: 提供了一种基于热管原理的结构改进的定影辊组件。 定影辊组件包括用作热管的定影辊和定影辊内部的电阻加热器和/或卤素灯，使得定影辊的表面可以瞬间加热到目标定影温度。 定影辊组件可以在更短的时间内加热到目标定影温度，而不需要预热时间和待机时间，从而功耗降低。

    Method of manufacturing light emitting device
    88.
    发明授权
    Method of manufacturing light emitting device 有权
    制造发光器件的方法

    公开(公告)号：US08927305B2

    公开(公告)日：2015-01-06

    申请号：US13562019

    申请日：2012-07-30

    Applicant: Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

    Inventor： Jong Sup Song ,  Jae Sung You ,  Tae Gyu Kim

    IPC: H01L21/00 ,  H01L33/52 ,  H01L33/50

    CPC classification number: H01L33/52 ,  H01L33/505 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

    Abstract: There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.

    Abstract translation: 提供一种制造发光器件的方法，该方法包括：将多个发光器件安装在粘合剂层上; 使用按压构件将多个发光装置的上表面布置成水平布置; 通过施加包括至少一种荧光体材料的树脂来形成覆盖所述粘合剂层上的所述多个发光器件的波长转换部分; 使用所述按压部件对所述波长转换部的上表面进行平面化; 以及从所述多个发光器件分离所述粘合剂层。

    LIGHT-EMITTING CONTORL CIRCUIT, LIGHT-EMITTING CONTROL METHOD AND SHIFT REGISTER
    90.
    发明申请
    LIGHT-EMITTING CONTORL CIRCUIT, LIGHT-EMITTING CONTROL METHOD AND SHIFT REGISTER 有权
    发光控制电路，发光控制方法和移位寄存器

    公开(公告)号：US20140285108A1

    公开(公告)日：2014-09-25

    申请号：US14126640

    申请日：2012-11-21

    Applicant: Tae Gyu Kim ,  Pil Seok Kim ,  Ying Wang

    Inventor： Tae Gyu Kim ,  Pil Seok Kim ,  Ying Wang

    IPC: H05B33/08

    CPC classification number: H05B33/0896 ,  G09G3/3266 ,  G09G2300/0861 ,  G09G2310/0286 ,  G11C19/184

    Abstract: A light-emitting control circuit, a light-emitting control method and a shift register. The light-emitting control circuit comprises an inputting terminal (Input), an input sampling unit (11), an outputting unit (12), a resetting unit (13), an output pulling-down unit (14) and an outputting terminal for a light-emitting control signal (EM[n]). The input sampling unit (11) samples an input signal under a control of a first clock signal (CK1); the outputting unit (12) generates a light-emitting control signal under a control of a second clock signal (CK2) after the input sampling unit (11) samples the input signal; the resetting unit (13) resets the light-emitting control signal through the output pulling-down unit (14) under a control of a third clock signal (13). An OLED device is in an OFF state during a process for writing display data into pixel cells and the OLED device is turned on to emit light after the display data is written into the pixel cells, thus a display image is guaranteed not to generate flickers due to an unstable state of a pixel circuit as the data is written.

    Abstract translation: 发光控制电路，发光控制方法和移位寄存器。 发光控制电路包括输入端子（Input），输入采样单元（11），输出单元（12），复位单元（13），输出下拉单元（14）和输出端子 发光控制信号（EM [n]）。 输入采样单元（11）在第一时钟信号（CK1）的控制下采样输入信号; 输出单元（12）在输入采样单元（11）对输入信号进行采样之后，在第二时钟信号（CK2）的控制下产生发光控制信号; 复位单元（13）在第三时钟信号（13）的控制下通过输出拉出单元（14）复位发光控制信号。 在将显示数据写入像素单元的过程中，OLED器件处于截止状态，并且在将显示数据写入像素单元之后，OLED器件导通以发光，从而保证显示图像不会产生闪烁 到数据写入时的像素电路的不稳定状态。

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