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107 条记录 (耗时 0.028 秒)

    Multi-chip assembly with optically coupled die
    84.
    发明授权
    Multi-chip assembly with optically coupled die 有权
    具有光耦合模的多芯片组装

    公开(公告)号：US08189361B2

    公开(公告)日：2012-05-29

    申请号：US12938608

    申请日：2010-11-03

    申请人： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

    发明人： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

    IPC分类号： H01L31/147

    CPC分类号： H01L23/48 ,  H01L25/0652 ,  H01L2924/00014 ,  H01L2224/48

    摘要： Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

    摘要翻译： 公开了包括光耦合管芯的多芯片组件的实施例。 多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。 一个基板上的至少一个管芯与另一个基板上的至少一个相对的管芯光学连通。 描述和要求保护其他实施例。

    Substrate With Raised Edge Pads
    87.
    发明申请
    Substrate With Raised Edge Pads 审中-公开
    基板带凸边垫

    公开(公告)号：US20110239454A1

    公开(公告)日：2011-10-06

    申请号：US13159642

    申请日：2011-06-14

    申请人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    发明人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    IPC分类号： H01R43/00 ,  H01R43/02

    CPC分类号： H05K7/1061 ,  Y10T29/49117

    摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

    摘要翻译： 可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。 侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。 在一些实施例中，凸起边缘可以具有闭合的几何形状。 然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。 此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。 这增加了连接的电效率及其安全性。

    Multi-chip assembly with optically coupled die
    88.
    发明授权
    Multi-chip assembly with optically coupled die 有权
    具有光耦合模的多芯片组装

    公开(公告)号：US07851809B2

    公开(公告)日：2010-12-14

    申请号：US12456224

    申请日：2009-06-12

    申请人： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

    发明人： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

    IPC分类号： H01L31/147

    CPC分类号： H01L23/48 ,  H01L25/0652 ,  H01L2924/00014 ,  H01L2224/48

    摘要： Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

    摘要翻译： 公开了包括光耦合管芯的多芯片组件的实施例。 多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。 其中一个基板上的至少一个管芯与另一基板上的至少一个相对的管芯光学连通。 描述和要求保护其他实施例。