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88 条记录 (耗时 0.024 秒)

    Method for manufacturing lead frame
    81.
    发明授权
    Method for manufacturing lead frame 失效
    具有细的铅双层结构的引线框架的制造方法

    公开(公告)号：US6077727A

    公开(公告)日：2000-06-20

    申请号：US786285

    申请日：1997-01-22

    申请人： Kenji Osawa ,  Makoto Ito

    发明人： Kenji Osawa ,  Makoto Ito

    IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

    CPC分类号： H01L24/50 ,  H01L21/4828 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082

    摘要： There is provided a method for manufacturing a lead frame which can easily manufacture a high quality lead frame.A pattern layer is selectively formed on a copper plate and the surface of the substrate having formed this pattern layer is then plated with gold to form a gold layer using the pattern layer as the mask. Next, the gold layer is then plated with copper to form a copper layer, thereby forming a fine lead consisting of two layers of gold layer and copper layer. Thereafter, the pattern layer is selectively removed, an insulated resist film is formed and the copper plate is etched. In this case, the gold layer is used as the etching stop layer. Thereby, the lead frame having the fine lead of double-layer structure can be formed.

    摘要翻译： 提供一种可以容易地制造高品质引线框的引线框的制造方法。 在铜板上选择性地形成图案层，并且使用图案层作为掩模，将形成该图案层的基板的表面镀金以形成金层。 接着，用铜镀金层形成铜层，由此形成由两层金层和铜层构成的细小导线。 此后，选择性地去除图案层，形成绝缘抗蚀剂膜，并蚀刻铜板。 在这种情况下，金层用作蚀刻停止层。 由此，可以形成具有双层结构的细导线的引线框架。

    Film circuit and method of manufacturing the same
    82.
    发明授权
    Film circuit and method of manufacturing the same 失效
    薄膜电路及其制造方法

    公开(公告)号：US5843810A

    公开(公告)日：1998-12-01

    申请号：US794203

    申请日：1997-01-31

    申请人： Kazuhiro Sato ,  Kenji Osawa

    发明人： Kazuhiro Sato ,  Kenji Osawa

    IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L23/3107 ,  H01L23/495 ,  H01L23/4985 ,  H01L24/50 ,  Y10S438/977

    摘要： A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.

    摘要翻译： 围绕通过电极的电连接到互连部分的半导体元件的加强环通过悬挂部分设置为一体。 通过使用例如通过使用三层以上的层叠体作为基底的引线框架成形技术来形成环来代替外部引线来制造膜电路，在一侧形成内部引线 引线由另一侧的表面层形成。 以这种方式，在由绝缘膜和在绝缘膜的至少一个主平面上电连接电极和半导体元件的其他电子部件的多个互连部分（引线）的薄膜电路中， 仅通过将薄膜电路放置在半导体元件上而相对于半导体元件对准半导体元件周围的环，并且依次降低半导体器件的组装要求。

    Laminated printed coil structure
    83.
    发明授权
    Laminated printed coil structure 失效
    层压印刷线圈结构

    公开(公告)号：US4804574A

    公开(公告)日：1989-02-14

    申请号：US14267

    申请日：1987-02-12

    申请人： Kenji Osawa ,  Shiyouichi Muramoto ,  Yoshio Watanabe ,  Takanori Kawahara ,  Takaaki Koizumi

    发明人： Kenji Osawa ,  Shiyouichi Muramoto ,  Yoshio Watanabe ,  Takanori Kawahara ,  Takaaki Koizumi

    IPC分类号： H01F5/00 ,  H02K3/26 ,  H02K3/50 ,  H02K5/22 ,  H05K1/14 ,  B32B3/00 ,  H02K1/00 ,  H02K1/22 ,  H02K11/00

    CPC分类号： H02K5/225 ,  H02K3/26 ,  H02K2203/03 ,  H02K2211/03 ,  Y10S428/901 ,  Y10T428/24917

    摘要： A laminated printed coil structure comprising a wiring board having an insulating substrate, lead terminals and connecting pad portions connected to the lead terminals and formed on one surface of the insulating substrate, and a plurality of printed coil elements each having an insulating layer, coil patterns, a pair of terminals for the coil patterns and a connecting pad electrically isolated from the terminals formed on the insulating layer. The printed coil elements are piled up and laminated on the wiring board such that the connecting pad portions of the wiring board, the terminals of the coil patterns on one of the printed coil elements and the connecting pad on another printed coil element are placed in alignment, and that each one terminal for the coil pattern on each of the printed coil elements to a respective lead terminal is connected, and that each coil pattern is from then led out to the lead terminals of the wiring board.

    摘要翻译： 一种层压印刷线圈结构，包括具有绝缘基板的布线板，连接到引线端子并形成在绝缘基板的一个表面上的引线端子和连接焊盘部分，以及多个印刷线圈元件，每个印刷线圈元件具有绝缘层，线圈图案 ，用于线圈图案的一对端子和与形成在绝缘层上的端子电隔离的连接焊盘。 打印的线圈元件堆叠并层叠在布线板上，使得布线板的连接焊盘部分，印刷线圈元件之一上的线圈图案的端子和另一印刷线圈元件上的连接焊盘放置成对准 并且将各印刷线圈元件上的线圈图案的每个端子连接到相应的引线端子，并且将每个线圈图案从那里引出到布线板的引线端子。