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    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    81.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 审中-公开

    公开(公告)号：US20200183105A1

    公开(公告)日：2020-06-11

    申请号：US16793550

    申请日：2020-02-18

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/516 ,  H04B10/40

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    LIGHT ENGINE BASED ON SILICON PHOTONICS TSV INTERPOSER
    82.
    发明申请
    LIGHT ENGINE BASED ON SILICON PHOTONICS TSV INTERPOSER 审中-公开

    公开(公告)号：US20200152574A1

    公开(公告)日：2020-05-14

    申请号：US16738844

    申请日：2020-01-09

    Applicant: INPHI CORPORATION

    Inventor： Liang DING ,  Radhakrishnan L. NAGARAJAN

    IPC: H01L23/538 ,  H01L25/16 ,  H01L23/00 ,  G02B6/42

    Abstract: A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.

    OPTICAL DISPERSION COMPENSATOR ON SILICON
    86.
    发明申请
    OPTICAL DISPERSION COMPENSATOR ON SILICON 审中-公开

    公开(公告)号：US20190041580A1

    公开(公告)日：2019-02-07

    申请号：US16157409

    申请日：2018-10-11

    Applicant: INPHI CORPORATION

    Inventor： Xiaoguang TU ,  Radhakrishnan L. NAGARAJAN ,  Masaki KATO

    IPC: G02B6/293 ,  G02B6/122 ,  G02B6/02 ,  G02B6/30

    CPC classification number: G02B6/29394 ,  G02B6/021 ,  G02B6/1225 ,  G02B6/29395 ,  G02B6/30 ,  G02B2006/12061 ,  G02B2006/1215 ,  G02B2006/12159 ,  H04B10/25133

    Abstract: An optical dispersion compensator integrated with a silicon photonics system including a first phase-shifter coupled to a second phase-shifter in parallel on the silicon substrate characterized in an athermal condition. The dispersion compensator further includes a third phase-shifter on the silicon substrate to the first phase-shifter and the second phase-shifter through two 2×2 splitters to form an optical loop. A second entry port of a first 2×2 splitter is for coupling with an input fiber and a second exit port of a second 2×2 splitter is for coupling with an output fiber. The optical loop is characterized by a total phase delay tunable via each of the first phase-shifter, the second phase-shifter, and the third phase-shifter such that a normal dispersion (>0) at a certain wavelength in the input fiber is substantially compensated and independent of temperature.

    CLOSED LOOP MODULE CONTROL FOR COMMUNICATION
    89.
    发明申请
    CLOSED LOOP MODULE CONTROL FOR COMMUNICATION 审中-公开

    公开(公告)号：US20180212712A1

    公开(公告)日：2018-07-26

    申请号：US15411914

    申请日：2017-01-20

    Applicant: INPHI CORPORATION

    Inventor： Todd ROPE ,  Radhakrishnan L. NAGARAJAN

    IPC: H04L1/00 ,  H04B10/40 ,  H04B10/079 ,  H04L1/20

    CPC classification number: H04B10/07953 ,  H04B10/40 ,  H04L1/0047

    Abstract: The present invention is directed to communication systems and methods. According to an embodiment, a receiving optical transceiver determines signal quality for signals received from a transmitting optical transceiver. Information related to the signal quality is embedded into back-channel data and sent to the transmitting optical transceiver. The transmitting optical transceiver detects the presence of the back-channel data and adjusts one or more of its operating parameters based on the back-channel data. There are other embodiments as well.

    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS
    90.
    发明申请
    SINGLE-CHIP CONTROL MODULE FOR AN INTEGRATED SYSTEM-ON-A-CHIP FOR SILICON PHOTONICS 审中-公开

    公开(公告)号：US20180032466A1

    公开(公告)日：2018-02-01

    申请号：US15730451

    申请日：2017-10-11

    Applicant: INPHI CORPORATION

    Inventor： Siddharth SHETH ,  Radhakrishnan L. NAGARAJAN

    IPC: G06F13/42

    CPC classification number: G06F13/42 ,  G06F15/7807 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006

    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

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