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81.发明申请SPACER FILL STRUCTURE, METHOD AND DESIGN STRUCTURE FOR REDUCING DEVICE VARIATION 失效隔膜填充结构，减少设备变化的方法和设计结构公开(公告)号：US20090319973A1
公开(公告)日：2009-12-24
申请号：US12144004
申请日：2008-06-23
CPC分类号： G06F17/5068 , G06F2217/12 , Y02P90/265
摘要： A design structure is provided for spacer fill structures and, more particularly, spacer fill structures, a method of manufacturing and a design structure for reducing device variation is provided. The structure includes a plurality of dummy fill shapes in different areas of a device which are configured such that gate perimeter to gate area ratio will result in a total perimeter density being uniform across a chip.
摘要翻译： 提供了用于间隔物填充结构的设计结构，并且更具体地，提供了间隔件填充结构，制造方法和用于减小装置变化的设计结构。 该结构包括在器件的不同区域中的多个虚拟填充形状，其被配置为使得栅极周边与栅极面积比将导致芯片上的总周长密度是均匀的。
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82.发明申请DEVICE STRUCTURES INCLUDING DUAL-DEPTH TRENCH ISOLATION REGIONS AND DESIGN STRUCTURES FOR A STATIC RANDOM ACCESS MEMORY 审中-公开设备结构包括双深度分离隔离区域和静态随机访问存储器的设计结构公开(公告)号：US20090267156A1
公开(公告)日：2009-10-29
申请号：US12111285
申请日：2008-04-29
申请人： Brent A. Anderson , Andres Bryant , Josephine B. Chang , Michael A. Guillorn , Ryoji Hasumi , Edward J. Nowak , Mickey H. Yu
发明人： Brent A. Anderson , Andres Bryant , Josephine B. Chang , Michael A. Guillorn , Ryoji Hasumi , Edward J. Nowak , Mickey H. Yu
IPC分类号： H01L27/092 , G06F17/50
CPC分类号： H01L21/823481 , H01L27/1104
摘要： Device structures and design structures for a static random access memory. The device structure includes a well of a first conductivity type in a semiconductor layer, first and second deep trench isolation regions in the semiconductor layer that laterally bound a device region in the well, and first and second pluralities of doped regions of a second conductivity type in the first device region. A shallow trench isolation region extends laterally across in the device region to connect the first and second deep trench isolation regions, and is disposed in the device region between the first and second pluralities of doped regions. The shallow trench isolation region extends from the top surface into the semiconductor layer to a first depth such that the well is continuous beneath the shallow trench isolation region. A gate stack controls carrier flow between a pair of the first plurality of doped regions.
摘要翻译： 静态随机存取存储器的器件结构和设计结构。 器件结构包括在半导体层中的第一导电类型的阱，半导体层中的横向地限定阱中的器件区域的第一和第二深沟槽隔离区以及第二和第二多个第二导电类型的掺杂区 在第一个设备区域。 浅沟槽隔离区域在器件区域中横向延伸以连接第一和第二深沟槽隔离区域，并且设置在第一和第二多个掺杂区域之间的器件区域中。 浅沟槽隔离区域从顶表面延伸到半导体层到第一深度，使得阱在浅沟槽隔离区域下连续。 栅极堆叠控制一对第一多个掺杂区域之间的载流子流动。
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公开(公告)号：US20090261425A1
公开(公告)日：2009-10-22
申请号：US12106476
申请日：2008-04-21
IPC分类号： H01L29/78 , H01L21/336 , H01L21/84
CPC分类号： H01L21/26513 , H01L21/26586 , H01L29/66803 , H01L29/785
摘要： A method patterns pairs of semiconducting fins on an insulator layer and then patterns a linear gate conductor structure over and perpendicular to the fins. Next, the method patterns a mask on the insulator layer adjacent the fins such that sidewalls of the mask are parallel to the fins and are spaced from the fins a predetermined distance. The method performs an angled impurity implant into regions of the fins not protected by the gate conductor structure and the mask. This process forms impurity concentrations within the fins that are asymmetric and that mirror one another in adjacent pairs of fins.
摘要翻译： 一种方法在绝缘体层上形成一对半导体翅片，然后在鳍片上并垂直于翅片形成线性栅极导体结构。 接下来，该方法在与鳍片相邻的绝缘体层上形成掩模，使得掩模的侧壁平行于翅片并与翅片间隔预定距离。 该方法对未被栅极导体结构和掩模保护的鳍片的区域进行倾斜的杂质注入。 该方法在翅片内形成不对称的杂质浓度，并且在相邻的翅片对中彼此相互镜像。
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84.发明申请FIN-TYPE FIELD EFFECT TRANSISTOR STRUCTURE WITH MERGED SOURCE/DRAIN SILICIDE AND METHOD OF FORMING THE STRUCTURE 有权具有合并源/排水硅酸盐的FIN型场效应晶体管结构及形成结构的方法公开(公告)号：US20090020819A1
公开(公告)日：2009-01-22
申请号：US11778217
申请日：2007-07-16
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/785 , H01L29/41791 , H01L29/66795 , H01L2029/7858
摘要： Disclosed herein are embodiments of a multiple fin fin-type field effect transistor (i.e., a multiple fin dual-gate or tri-gate field effect transistor) in which the multiple fins are partially or completely merged by a highly conductive material (e.g., a metal silicide). Merging the fins in this manner allow series resistance to be minimized with little, if any, increase in the parasitic capacitance between the gate and source/drain regions. Merging the semiconductor fins in this manner also allows each of the source/drain regions to be contacted by a single contact via as well as more flexible placement of that contact via.
摘要翻译： 这里公开了多鳍片式场效应晶体管（即，多鳍式双栅极或三栅极场效应晶体管）的实施例，其中多个散热片部分或完全由高导电材料（例如， 金属硅化物）。 以这种方式合并散热片使串联电阻最小化，栅极和源极/漏极区之间的寄生电容几乎不增加。 以这种方式合并半导体散热片也允许每个源极/漏极区域通过单个触点通孔接触，以及该触点通孔的更灵活的放置。
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公开(公告)号：US07473605B2
公开(公告)日：2009-01-06
申请号：US11866435
申请日：2007-10-03
IPC分类号： H01L21/336
CPC分类号： H01L29/785 , H01L29/42384 , H01L29/66795
摘要： Disclosed are embodiments of a trigate field effect transistor that comprises a fin-shaped semiconductor body with a channel region and source/drain regions on either side of the channel region. Thick gate dielectric layers separate the top surface and opposing sidewalls of the channel region from the gate conductor in order to suppress conductivity in the channel planes. A thin gate dielectric layer separates the upper corners of the channel region from the gate conductor in order to optimize conductivity in the channel corners. To further emphasize the current flow in the channel corners, the source/drain regions can be formed in the upper corners of the semiconductor body alone. Alternatively, source/drain extension regions can be formed only in the upper corners of the semiconductor body adjacent to the gate conductor and deep source/drain diffusion regions can be formed in the ends of the semiconductor body.
摘要翻译： 公开了一种触发场效应晶体管的实施例，其包括具有沟道区的鳍状半导体本体和沟道区两侧的源极/漏极区。 厚栅电介质层将沟道区的顶表面和相对的侧壁与栅极导体分开，以便抑制沟道平面中的导电性。 薄栅极电介质层将沟道区的上角与栅极导体分开，以便优化沟道角中的导电性。 为了进一步强调通道角中的电流流动，源极/漏极区域可以单独形成在半导体主体的上角部。 或者，源极/漏极延伸区域仅可以形成在与栅极导体相邻的半导体本体的上角处，并且可以在半导体本体的端部形成深的源极/漏极扩散区域。
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公开(公告)号：US20080185644A1
公开(公告)日：2008-08-07
申请号：US11539288
申请日：2006-10-06
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/78612 , H01L29/66772 , H01L29/78621 , H01L29/78648
摘要： A FET has a shallow source/drain region, a deep channel region, a gate stack and a back gate that is surrounded by dielectric. The FET structure also includes halo or pocket implants that extend through the entire depth of the channel region. Because a portion of the halo and well doping of the channel is deeper than the source/drain depth, better threshold voltage and process control is achieved. A back-gated FET structure is also provided having a first dielectric layer in this structure that runs under the shallow source/drain region between the channel region and the back gate. This first dielectric layer extends from under the source/drain regions on either side of the back gate and is in contact with a second dielectric such that the back gate is bounded on each side or isolated by dielectric.
摘要翻译： FET具有浅电源/漏极区域，深沟道区域，栅极堆叠和被电介质包围的背栅极。 FET结构还包括延伸通过通道区域的整个深度的晕或凹坑植入物。 因为沟道的一部分光晕和阱掺杂比源极/漏极深度更深，所以实现了更好的阈值电压和过程控制。 还提供了后栅化FET结构，其具有在该结构中的第一介电层，其在沟道区域和后栅极之间的浅源极/漏极区域下方延伸。 该第一电介质层从背栅的两侧的源极/漏极区下方延伸并与第二电介质接触，使得后栅极在每一侧上界定或通过电介质隔离。
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公开(公告)号：US20080116517A1
公开(公告)日：2008-05-22
申请号：US11561488
申请日：2006-11-20
IPC分类号： H01L29/78 , H01L29/786 , H01L21/84 , H01L21/336
CPC分类号： H01L29/785 , H01L21/31155 , H01L21/76283 , H01L21/823807 , H01L21/823821 , H01L21/823878 , H01L27/1203 , H01L29/1037 , H01L29/66621 , H01L29/66795 , H01L29/7843 , H01L29/7846 , H01L29/7849
摘要： A semiconductor device including semiconductor material having a bend and a trench feature formed at the bend, and a gate structure at least partially disposed in the trench feature. A method of fabricating a semiconductor structure including forming a semiconductor material with a trench feature over a layer, forming a gate structure at least partially in the trench feature, and bending the semiconductor material such that stress is induced in the semiconductor material in an inversion channel region of the gate structure.
摘要翻译： 一种包括半导体材料的半导体器件，该半导体材料具有形成在该弯曲处的弯曲部和沟槽特征，以及至少部分地设置在沟槽特征中的栅极结构。 一种制造半导体结构的方法，包括在层上形成具有沟槽特征的半导体材料，在沟槽特征中至少部分地形成栅极结构，以及弯曲半导体材料，使得在反转沟道中的半导体材料中产生应力 栅结构的区域。
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公开(公告)号：US07335563B2
公开(公告)日：2008-02-26
申请号：US11164070
申请日：2005-11-09
IPC分类号： H01L21/336
CPC分类号： H01L29/78621 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L21/84 , H01L29/66772
摘要： An apparatus and method for manufacturing rotated field effect transistors. The method comprises providing a substrate including a first gate structure and a second gate structure, which are not parallel to each other. The method further includes performing a first ion implant substantially orthogonal to an edge of the first gate structure to form a first impurity region and performing a second ion implant at a direction different than that of the first ion implant and substantially orthogonal to an edge of the second gate structure to form a second impurity region under the edge of the second gate structure.
摘要翻译： 用于制造旋转场效应晶体管的装置和方法。 该方法包括提供包括彼此不平行的第一栅极结构和第二栅极结构的衬底。 该方法还包括执行基本上与第一栅极结构的边缘正交的第一离子注入以形成第一杂质区域，并且在不同于第一离子注入的方向上执行第二离子注入并且基本上垂直于第 第二栅极结构，以在第二栅极结构的边缘下方形成第二杂质区域。
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公开(公告)号：US07274053B2
公开(公告)日：2007-09-25
申请号：US10904357
申请日：2004-11-05
IPC分类号： H01L27/148
CPC分类号： H01L29/785 , H01L27/1203 , H01L29/66795
摘要： A fin-type field effect transistor (FinFET) has a fin having a center channel portion, end portions comprising source and drain regions, and channel extensions extending from sidewalls of the channel portion of the fin. The structure also includes a gate insulator covering the channel portion and the channel extensions, and a gate conductor on the gate insulator. The channel extensions increase capacitance of the channel portion of the fin.
摘要翻译： 翅片型场效应晶体管（FinFET）具有鳍状物，其具有中心沟道部分，端部包括源极和漏极区域以及从鳍片的沟道部分的侧壁延伸的沟道延伸部。 该结构还包括覆盖沟道部分和沟道延伸部的栅极绝缘体以及栅极绝缘体上的栅极导体。 通道扩展增加了鳍片的通道部分的电容。
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公开(公告)号：US07105934B2
公开(公告)日：2006-09-12
申请号：US10711170
申请日：2004-08-30
IPC分类号： H01L29/76 , H01L21/332 , H01L21/335
CPC分类号： H01L29/785 , H01L29/42384 , H01L29/66795 , Y10S257/90
摘要： A FinFET device and a method of lowering a gate capacitance and extrinsic resistance in a field effect transistor, wherein the method comprises forming an isolation layer comprising a BOX layer over a substrate, configuring source/drain regions above the isolation layer, forming a fin structure over the isolation layer, configuring a first gate electrode adjacent to the fin structure, disposing a gate insulator between the first gate electrode and the fin structure, positioning a second gate electrode transverse to the first gate electrode, and depositing a third gate electrode on the fin structure, the first gate electrode, and the second gate electrode, wherein the isolation layer is formed beneath the insulator, the first gate electrode, and the fin structure. The method further comprises sandwiching the second gate electrode with a dielectric material. The fin structure is formed by depositing an oxide layer over a silicon layer.
摘要翻译： FinFET器件和降低场效应晶体管中的栅极电容和外在电阻的方法，其中所述方法包括在衬底上形成包括BOX层的隔离层，在隔离层上方构成源/漏区，形成鳍结构 在所述隔离层上方配置与所述鳍结构相邻的第一栅电极，在所述第一栅电极和所述鳍结构之间设置栅极绝缘体，将第二栅电极定位成横向于所述第一栅电极，以及将第三栅电极 鳍结构，第一栅电极和第二栅电极，其中隔离层形成在绝缘体下方，第一栅电极和鳍结构之下。 该方法还包括用电介质材料夹住第二栅电极。 翅片结构通过在硅层上沉积氧化物层而形成。
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