CONTACT BARS FOR MODIFYING STRESS IN SEMICONDUCTOR DEVICE AND RELATED METHOD
    3.
    发明申请
    CONTACT BARS FOR MODIFYING STRESS IN SEMICONDUCTOR DEVICE AND RELATED METHOD 审中-公开
    用于修改半导体器件中的应力的接触棒及相关方法

    公开(公告)号:US20130240997A1

    公开(公告)日:2013-09-19

    申请号:US13424319

    申请日:2012-03-19

    摘要: Solutions for forming stress optimizing contact bars and contacts are disclosed. In one aspect, a semiconductor device is disclosed including an n-type field effect transistor (NFET) having source/drain regions; a p-type field effect transistor (PFET) having source/drain regions; a stress inducing layer over both the NFET and the PFET, the stress inducing layer inducing only one of a compressive stress and a tensile stress; a contact bar extending through the stress inducing layer and coupled to at least one of the source/drain regions of a selected device of the PFET and the NFET to modify a stress induced in the selected device compared to a stress induced in the other device; and a round contact extending through the stress inducing layer and coupled to at least one of the source/drain regions of the other device of the PFET and the NFET.

    摘要翻译: 公开了用于形成应力优化接触棒和触点的解决方案。 一方面,公开了一种具有源极/漏极区域的n型场效应晶体管(NFET)的半导体器件; 具有源极/漏极区域的p型场效应晶体管(PFET) 在NFET和PFET两者上的应力诱导层,应力诱导层仅引起压缩应力和拉伸应力之一; 接触棒延伸穿过应力感应层并且耦合到PFET和NFET的所选器件的源/漏区中的至少一个,以修改与在另一器件中感应的应力相比在所选器件中感应的应力; 以及延伸穿过应力感应层并且耦合到PFET和NFET的另一个器件的源极/漏极区域中的至少一个的圆形接触。

    Semiconductor Devices with Improved Self-Aligned Contact Areas
    7.
    发明申请
    Semiconductor Devices with Improved Self-Aligned Contact Areas 有权
    具有改进的自对准接触区域的半导体器件

    公开(公告)号:US20110193163A1

    公开(公告)日:2011-08-11

    申请号:US12702684

    申请日:2010-02-09

    IPC分类号: H01L29/786 H01L21/336

    摘要: A field effect device includes a channel region disposed on a silicon on insulator (SOI) layer, a gate portion disposed on the channel region, a source region disposed on the SOI layer and connected to the channel region having a horizontal surface and a vertical surface, the vertical surface arranged perpendicular to a linear axis of the device, a silicide portion that includes the horizontal surface and vertical surface of the source region, a contact including a metallic material in contact with the horizontal surface and vertical surface of the source region, and a drain region connected to the channel region disposed on the SOI layer.

    摘要翻译: 场效应器件包括设置在绝缘体上硅(SOI)层上的沟道区域,设置在沟道区上的栅极部分,设置在SOI层上的源极区域,并连接到具有水平表面和垂直表面的沟道区域 垂直于装置的线性轴排列的垂直表面,包括源区域的水平表面和垂直表面的硅化物部分,包括与源区域的水平表面和垂直表面接触的金属材料的触点, 以及连接到设置在SOI层上的沟道区的漏极区。

    Rotated field effect transistors and method of manufacture
    9.
    发明授权
    Rotated field effect transistors and method of manufacture 失效
    旋转场效应晶体管及其制造方法

    公开(公告)号:US07795098B1

    公开(公告)日:2010-09-14

    申请号:US11873886

    申请日:2007-10-17

    IPC分类号: H01L21/336

    摘要: An apparatus and method for manufacturing rotated field effect transistors. The method comprises providing a substrate including a first gate structure and a second gate structure, which are not parallel to each other. The method further includes performing a first ion implant substantially orthogonal to an edge of the first gate structure to form a first impurity region and performing a second ion implant at a direction different than that of the first ion implant and substantially orthogonal to an edge of the second gate structure to form a second impurity region under the edge of the second gate structure.

    摘要翻译: 用于制造旋转场效应晶体管的装置和方法。 该方法包括提供包括彼此不平行的第一栅极结构和第二栅极结构的衬底。 该方法还包括执行基本上与第一栅极结构的边缘正交的第一离子注入以形成第一杂质区域,并且在不同于第一离子注入的方向上执行第二离子注入并且基本上垂直于第 第二栅极结构,以在第二栅极结构的边缘下方形成第二杂质区域。

    FETS with self-aligned bodies and backgate holes
    10.
    发明授权
    FETS with self-aligned bodies and backgate holes 有权
    具有自对准主体和后盖孔的FET

    公开(公告)号:US07659579B2

    公开(公告)日:2010-02-09

    申请号:US11539288

    申请日:2006-10-06

    IPC分类号: H01L29/78

    摘要: A FET has a shallow source/drain region, a deep channel region, a gate stack and a back gate that is surrounded by dielectric. The FET structure also includes halo or pocket implants that extend through the entire depth of the channel region. Because a portion of the halo and well doping of the channel is deeper than the source/drain depth, better threshold voltage and process control is achieved. A back-gated FET structure is also provided having a first dielectric layer in this structure that runs under the shallow source/drain region between the channel region and the back gate. This first dielectric layer extends from under the source/drain regions on either side of the back gate and is in contact with a second dielectric such that the back gate is bounded on each side or isolated by dielectric.

    摘要翻译: FET具有浅电源/漏极区域,深沟道区域,栅极堆叠和被电介质包围的背栅极。 FET结构还包括延伸通过通道区域的整个深度的晕或凹坑植入物。 因为沟道的一部分光晕和阱掺杂比源极/漏极深度更深,所以实现了更好的阈值电压和过程控制。 还提供了后栅化FET结构,其具有在该结构中的第一介电层,其在沟道区域和后栅极之间的浅源极/漏极区域下方延伸。 该第一电介质层从背栅的两侧的源极/漏极区下方延伸并与第二电介质接触,使得后栅极在每一侧上界定或通过电介质隔离。