公开(公告)号：US07765838B2

公开(公告)日：2010-08-03

申请号：US11654524

申请日：2007-01-18

申请人： Young Ho Kim ,  Byoung Soo Je ,  Si Moon Jeon ,  Dong Won Kim

发明人： Young Ho Kim ,  Byoung Soo Je ,  Si Moon Jeon ,  Dong Won Kim

IPC分类号： D06F37/26

CPC分类号： D06F37/264 ,  B29C45/37 ,  D06F37/206 ,  D06F37/262 ,  D06F37/263

摘要： A tub of a washing machine that prevents vibration and noise and a method of manufacturing the tub are provided. The tub includes a rear tub portion, a front tub portion located in front of the rear tub portion, and one or more linear reinforcing portions formed on at least one of the rear and front tub portions and extending in a direction parallel to a central axis of the front and rear tub portions.

摘要翻译： 提供一种防止振动和噪音的洗衣机的浴缸和制造浴缸的方法。 桶包括后桶部分，位于后桶部分前面的前桶部分和形成在后桶和前桶部分中的至少一个上并沿平行于中心轴线的方向延伸的一个或多个线性加强部分 的前后槽部分。

公开(公告)号：US07718202B2

公开(公告)日：2010-05-18

申请号：US12240503

申请日：2008-09-29

申请人： Jung Joon Lee ,  Jeong-Hyung Lee ,  Young Soo Hong ,  Young Ho Kim ,  Young Deuk Choi

发明人： Jung Joon Lee ,  Jeong-Hyung Lee ,  Young Soo Hong ,  Young Ho Kim ,  Young Deuk Choi

IPC分类号： A61K36/254 ,  A61K36/00

CPC分类号： A23L33/105 ,  A21D2/14 ,  A21D2/36 ,  A21D13/80 ,  A23G1/48 ,  A23G3/48 ,  A23G4/068 ,  A23G9/42 ,  A23L2/52 ,  A61K36/254

摘要： The present invention relates to an alcohol extract of ogalpi, erectile dysfunction improving health food and a treating agent containing the same, more precisely, an alcohol extract of ogalpi having an effect of improving erectile dysfunction, erectile dysfunction improving health food and an erectile dysfunction treating agent containing the same. The alcohol extract of ogalpi of the present invention has a promoting effect of penile erectility, so that it can be effectively used for the improvement of erectile dysfunction.

摘要翻译： 本发明涉及一种卵黄醇提取物，改善健康食品的勃起功能障碍及含有该成分的治疗剂，更准确地说，是具有改善勃起功能障碍，改善勃起功能障碍的健康食品和勃起功能障碍治疗的卵黄醇提取物 含有相同的代理 本发明的欧氏提取物具有阴茎勃起的促进作用，因此可以有效地用于改善勃起功能障碍。

公开(公告)号：US07710971B2

公开(公告)日：2010-05-04

申请号：US11592136

申请日：2006-11-03

申请人： Jae Deok Lim ,  Young Ho Kim ,  Seung Ho Ryu ,  Bo Heung Chung ,  Ki Young Kim

发明人： Jae Deok Lim ,  Young Ho Kim ,  Seung Ho Ryu ,  Bo Heung Chung ,  Ki Young Kim

IPC分类号： H04L12/56

CPC分类号： H04L63/1416 ,  H04L63/101 ,  H04L69/16 ,  H04L69/161

摘要： A method of blocking network attacks using information included in a packet, and an apparatus thereof are provided. The method includes: receiving a packet containing information on the packet including at least information on a source from which the packet is sent, and information on a destination to which the packet is sent; and extracting the information on the packet included in the packet, comparing the information with a predetermined access control condition, and blocking or passing the packet. By doing so, a packet being transferred with a routing header capable of bypassing a security device as in an Internet Protocol version 6 (IPv6) network can be appropriately blocked or passed. Accordingly, security problems caused by the routing header can be overcome, and as a result, usage of the routing header can be promoted. Also, since a routing header can be used for transmitting a packet along a desired path, the routing header can be widely used without security problems, and can ease network security concerns relating to IPv6 networks that are expected to come into increasingly wide use.

摘要翻译： 提供了使用包中包含的信息来阻止网络攻击的方法及其装置。 该方法包括：接收包含至少包括发送分组的源的信息的分组的分组以及发送分组的目的地的信息; 并提取关于分组中包含的分组的信息，将该信息与预定的访问控制条件进行比较，以及阻塞或传递分组。 通过这样做，可以适当地阻止或传递具有能够绕过互联网协议版本6（IPv6）网络的安全设备的路由报头传送的分组。 因此，可以克服由路由报头引起的安全问题，结果可以促进路由报头的使用。 另外，由于可以使用路由报头来沿着期望的路径发送分组，所以可以广泛地使用路由报头，而没有安全问题，并且可以减轻与预期将越来越广泛使用的IPv6网络有关的网络安全问题。

公开(公告)号：US07675374B2

公开(公告)日：2010-03-09

申请号：US12111555

申请日：2008-04-29

申请人： Byung Hun Min ,  Young Ho Kim ,  Byoung Gun Choi ,  Seok Bong Hyun

发明人： Byung Hun Min ,  Young Ho Kim ,  Byoung Gun Choi ,  Seok Bong Hyun

IPC分类号： H03L5/00

CPC分类号： H03L5/00 ,  H03B5/04 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1243

摘要： Provided is a voltage controlled oscillator to which a switching bias technique is applied so as to lower flicker noise of a bias circuit and enhance phase noise characteristics, thereby reducing the overall chip area to make it possible to achieve integration. A common mode voltage applied to the bias circuit is negatively fed back to an oscillation waveform. Therefore, it is possible to stabilize the magnitude of the oscillation waveform of the voltage controlled oscillator with respect to a change in an external condition.

摘要翻译： 提供了一种施加了开关偏压技术的压控振荡器，以便降低偏置电路的闪烁噪声并增强相位噪声特性，由此减小整个芯片面积以实现集成。 施加到偏置电路的共模电压被反馈回振荡波形。 因此，可以相对于外部条件的变化来稳定压控振荡器的振荡波形的大小。

公开(公告)号：US20090288454A1

公开(公告)日：2009-11-26

申请号：US12453840

申请日：2009-05-22

申请人： Jong Min Lee ,  Young Ho Kim ,  Jae Hyun Kim ,  Sang Hoon Lee

发明人： Jong Min Lee ,  Young Ho Kim ,  Jae Hyun Kim ,  Sang Hoon Lee

IPC分类号： D06F35/00

CPC分类号： D06F39/022

摘要： A detergent supply apparatus comprising a storage space adjacent to a washing space in which washing is performed, a detergent bottle seat provided in the storage space and adapted to receive a detergent bottle containing a liquid detergent, a detergent reservoir in fluid communication with the detergent bottle, and a connecting part adapted to fix a portion of the detergent bottle to the detergent reservoir such that the liquid detergent can flow through the connecting part and into the detergent reservoir by gravitational force.

摘要翻译： 一种洗涤剂供给装置，包括与进行洗涤的洗涤空间相邻的存储空间，设置在所述存储空间中并适于接收含有液体洗涤剂的洗涤剂瓶的洗涤剂瓶座，与所述洗涤剂瓶流体连通的洗涤剂储存器 以及适于将洗涤剂瓶的一部分固定到洗涤剂储存器的连接部件，使得液体洗涤剂可以通过重力流过连接部分并进入洗涤剂储存器。

公开(公告)号：USD591260S1

公开(公告)日：2009-04-28

申请号：US29324607

申请日：2008-09-16

申请人： Hyun Chul Kim ,  Young Ho Kim ,  Hyon I Kim

设计人： Hyun Chul Kim ,  Young Ho Kim ,  Hyon I Kim

公开(公告)号：US07485164B2

公开(公告)日：2009-02-03

申请号：US11232875

申请日：2005-09-23

申请人： Hoi Kil Jeong ,  Man Tae Hwang ,  Young Ho Kim ,  Jung Bae Hwang ,  Min Park

发明人： Hoi Kil Jeong ,  Man Tae Hwang ,  Young Ho Kim ,  Jung Bae Hwang ,  Min Park

IPC分类号： B01D45/12

CPC分类号： A47L9/1625 ,  A47L9/1641 ,  A47L9/1658 ,  A47L9/1683 ,  Y10S55/03

摘要： A dust collection unit for a vacuum cleaner includes a collection body having a plurality of filtering chambers different from each in a volume and a plurality of storing chambers storing foreign objects filtered in the filtering chambers, a bottom seal member defining a bottom of the collection body, and an exhaust member guiding airflow in the filtering chambers. The exhaust member contacts tops of the filtering chambers as well as an outer circumference of the collection body.

摘要翻译： 一种用于真空吸尘器的集尘装置，包括：收集体，其具有多个与体积不同的过滤室，以及多个储存室，储存在过滤室中过滤的异物;底部密封件，限定收集体的底部; 以及引导过滤室中的气流的排气构件。 排气构件接触过滤室的顶部以及收集体的外周。

公开(公告)号：US07091571B1

公开(公告)日：2006-08-15

申请号：US10735184

申请日：2003-12-11

申请人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

发明人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

IPC分类号： H01L31/0232 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/189 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is an image sensor package and a method for manufacturing the same. The image sensor package comprises an image sensor die, a substrate, a support wall having screw threads on the outer peripheral surface thereof and a mount into which a barrel including a plurality of lenses and an infrared blocking glass is mounted. The screw threads formed on the outer peripheral surface of the support wall are engaged with those formed on the inner peripheral surface of the mount. At least one passive element is provided on the substrate at the outer peripheral side of the support wall, thereby increasing the packaging density of the image sensor package.

摘要翻译： 公开了一种图像传感器封装及其制造方法。 图像传感器封装包括图像传感器芯片，基板，在其外周表面上具有螺纹的支撑壁和安装有安装有多个透镜和红外阻挡玻璃的镜筒的安装件。 形成在支撑壁的外周面上的螺纹与安装件的内周面上形成的螺纹接合。 在支撑壁的外周侧的基板上设置至少一个无源元件，从而增加图像传感器封装的封装密度。

公开(公告)号：US06982485B1

公开(公告)日：2006-01-03

申请号：US10076701

申请日：2002-02-13

申请人： Seon Goo Lee ,  Young Ho Kim ,  Choon Heung Lee

发明人： Seon Goo Lee ,  Young Ho Kim ,  Choon Heung Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L29/40

CPC分类号： H01L24/85 ,  H01L23/36 ,  H01L23/49805 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85815 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A semiconductor package and method of producing the same has a substrate having a resin layer with first and second surfaces. A plurality of electrically conductive patterns are formed on the resin layer. An aperture is also formed at the center of the substrate. A first semiconductor chip has first and second surfaces. The second surface of the first semiconductor chip has a plurality of input/output pads formed thereon. The first semiconductor chip is placed in the aperture of the substrate. A plurality of first conductive wires connect the input/output pads of the first semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. A second semiconductor chip having first and second surfaces is coupled to the first semiconductor chip. The second surface of the second semiconductor chip has a plurality of input/output pads formed thereon. A plurality of second conductive wires connect the input/output pads of the second semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. An encapsulate is used to encapsulate the aperture of the substrate, the first and second semiconductor chips, and the first and second conductive wires. A plurality of conductive balls are coupled to the electrically conductive patterns formed on the second surface of the resin layer of the substrate.

摘要翻译： 半导体封装及其制造方法具有具有第一和第二表面的树脂层的基板。 在树脂层上形成多个导电图案。 在基板的中心处还形成有孔。 第一半导体芯片具有第一和第二表面。 第一半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。 第一半导体芯片被放置在基板的孔中。 多个第一导线将第一半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。 具有第一和第二表面的第二半导体芯片被耦合到第一半导体芯片。 第二半导体芯片的第二表面具有形成在其上的多个输入/输出焊盘。 多个第二导线将第二半导体芯片的输入/输出焊盘连接到形成在树脂层的第二表面上的导电图案。 封装用于封装基板，第一和第二半导体芯片以及第一和第二导线的孔径。 多个导电球耦合到形成在基板的树脂层的第二表面上的导电图案。

公开(公告)号：US5990692A

公开(公告)日：1999-11-23

申请号：US853906

申请日：1997-05-09

申请人： Hwa Jin Jeong ,  Young Ho Kim

发明人： Hwa Jin Jeong ,  Young Ho Kim

IPC分类号： G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R31/2886 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/07802

摘要： A non-packaged semiconductor chip testing apparatus includes a lead frame having chips with a plurality of leads which are electrically isolated from the other leads, and are supported by adhesive tape and bonded to the chip via wires. The lead frame is placed on a holding plate having windows, so that the leads of the lead frame are exposed through the windows and contact test probes located under the plate. The test probes, such as pogo pins or bending leads, extend upwardly from a substrate. A base receives the substrate, with cables extending from a lower surface of the substrate passing through openings in the base, where they then connect a test board. After being pressed down by a pressing cover, the lead frame on the holding plate moves down so that the leads may contact the test probes. The pressing cover is movable up and down. Guide pins on the base are simultaneously inserted into through holes of the holding plate and lead frame, and extend into recesses in the pressing cover to ensure alignment.

摘要翻译： 未封装的半导体芯片测试装置包括具有多个引线的芯片的引线框架，其与其它引线电隔离，并且由胶带支撑并且经由导线连接到芯片。 引线框架放置在具有窗口的保持板上，使得引线框架的引线通过窗户暴露，并接触位于板下方的测试探针。 测试探针（例如弹簧销或弯曲引线）从基底向上延伸。 基座接收基板，电缆从基板的下表面延伸通过基座中的开口，然后连接测试板。 在通过按压盖按压之后，保持板上的引线框架向下移动，使得引线可以接触测试探针。 按压盖可上下移动。 基座上的引导销同时插入到保持板和引线框架的通孔中，并延伸到按压盖中的凹槽中以确保对准。