公开(公告)号：US20120261694A1

公开(公告)日：2012-10-18

申请号：US13273665

申请日：2011-10-14

申请人： Bo-Yun JANG ,  Sung-Soon PARK ,  Joo-Seok PARK

发明人： Bo-Yun JANG ,  Sung-Soon PARK ,  Joo-Seok PARK

IPC分类号： H01L33/44 ,  C09K11/78

CPC分类号： C09K11/0883 ,  C09K11/7734 ,  H01L33/502 ,  H05B33/145

摘要： The present disclosure provides α-SiAlON phosphors, a method of preparing the same, and an LED chip package using the same. The method includes weighing and mixing raw materials of Ca0.8-xRexAlaySi12-yO1.2N14.8 (Re is a rare-earth element, 0≦x≦0.2, 2.6≦y≦3.0, and 0.6≦a≦0.95), and sintering the mixed raw materials via normal pressure sintering to prepare phosphors having a composition of Ca0.8-xRexAlaySi12-yO1.2N14.8.

摘要翻译： 本公开提供了α-SiAlON荧光体，其制备方法和使用其的LED芯片封装。 该方法包括称重和混合Ca0.8-xRexAlaySi12-yO1.2N14.8原料（Re为稀土元素，0＆nlE; x＆nlE; 0.2,2.6＆nlE; y＆nlE; 3.0和0.6＆nlE; a＆nlE; 0.95） ，并通过常压烧结烧结混合原料，以制备具有Ca0.8-xRexAlaySi12-yO1.2N14.8组成的荧光体。

公开(公告)号：US20060014101A1

公开(公告)日：2006-01-19

申请号：US11225317

申请日：2005-09-12

申请人： Liu He ,  Sung-Soon Park ,  Haixing Zheng ,  Grace Tang ,  Aylin Vance

发明人： Liu He ,  Sung-Soon Park ,  Haixing Zheng ,  Grace Tang ,  Aylin Vance

IPC分类号： G03C1/492

CPC分类号： G02B1/111 ,  Y10T428/31507 ,  Y10T428/31612 ,  Y10T428/31645

摘要： A radiation-curable anti-reflective coating is disclosed. The coating may be deposited on a substrate by spinning, dipping or rolling. The anti-reflective coating may have two layers in which case the anti-reflective coating has a V-shaped reflectance pattern in the visible wavelength spectrum. The anti-reflective coating may have three layers in which case the anti-reflective coating has a broadband reflectance pattern in the visible wavelength spectrum.

公开(公告)号：US06833619B1

公开(公告)日：2004-12-21

申请号：US10425134

申请日：2003-04-28

申请人： Sang Jae Jang ,  Sun Goo Lee ,  Sung Su Park ,  Sung Soon Park

发明人： Sang Jae Jang ,  Sun Goo Lee ,  Sung Su Park ,  Sung Soon Park

IPC分类号： H01L2334

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a cavity passing through the resin layer vertically at a center area thereof, a plurality of electrically conductive patterns formed at a bottom surface of the resin layer, and a conductive plan. An adhesive layer of a predetermined thickness is formed at an upper part of an inside of the cavity. A semiconductor die is positioned inside the cavity of the substrate and has a plurality of bond pads formed at a bottom surface thereof, a bottom surface of the adhesive layer being bonded to a top surface thereof. A plurality of conductive wires for electrically connecting the bond pads of the semiconductor die to the electrically conductive patterns are formed at a bottom surface of the substrate. An encapsulant is used for covering the semiconductor die formed at the lower part of the adhesive layer, the conductive wires and the cavity. A plurality of solder balls are fused to the electrically conductive patterns, which is formed at the bottom surface of the substrate.

摘要翻译： 半导体封装具有包括近似平板的树脂层，在其中心区域垂直穿过树脂层的空腔，形成在树脂层的底面的多个导电图案的基板，以及导电图 。 在空腔的内部的上部形成预定厚度的粘合剂层。 半导体管芯位于衬底的腔内部，并且在其底表面上形成有多个接合焊盘，粘合剂层的底表面粘合到其顶表面。 在基板的底面形成有用于将半导体管芯的接合焊盘电连接到导电图案的多个导线。 密封剂用于覆盖形成在粘合剂层的下部，导电线和空腔的半导体管芯。 多个焊球与形成在基板的底面的导电图案熔合。

公开(公告)号：US06942924B2

公开(公告)日：2005-09-13

申请号：US10001639

申请日：2001-10-31

申请人： Liu He ,  Sung-Soon Park ,  Haixing Zheng ,  Grace Tang ,  Aylin Vance

发明人： Liu He ,  Sung-Soon Park ,  Haixing Zheng ,  Grace Tang ,  Aylin Vance

IPC分类号： C08F2/46 ,  G02B1/11 ,  B32B9/00

CPC分类号： G02B1/111 ,  Y10T428/31507 ,  Y10T428/31612 ,  Y10T428/31645

摘要： A radiation-curable anti-reflective coating is disclosed. The coating may be deposited on a substrate by spinning, dipping or rolling. The anti-reflective coating may have two layers in which case the anti-reflective coating has a V-shaped reflectance pattern in the visible wavelength spectrum. The anti-reflective coating may have three layers in which case the anti-reflective coating has a broadband reflectance pattern in the visible wavelength spectrum.

摘要翻译： 公开了一种可辐射固化的抗反射涂层。 可以通过旋转，浸渍或滚压将涂层沉积在基底上。 抗反射涂层可以具有两层，在这种情况下，抗反射涂层在可见波长光谱中具有V形反射率图案。 抗反射涂层可以具有三层，在这种情况下，抗反射涂层在可见波长光谱中具有宽带反射图案。

公开(公告)号：US06638630B2

公开(公告)日：2003-10-28

申请号：US09991765

申请日：2001-11-21

申请人： Sung-Soon Park ,  Haixing Zheng

发明人： Sung-Soon Park ,  Haixing Zheng

IPC分类号： B32B904

CPC分类号： G02B1/111 ,  C03C17/3417 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667

摘要： Coating solutions having anti-reflective and anti-static properties, a coating derived therefrom, a substrate coated with the coating and methods for their preparation. A coating includes a sol-gel alkoxide polymeric material and a conductive colloidal metal compound material.

公开(公告)号：US06372354B1

公开(公告)日：2002-04-16

申请号：US09394987

申请日：1999-09-13

申请人： Sung-Soon Park ,  Haixing Zheng

发明人： Sung-Soon Park ,  Haixing Zheng

IPC分类号： B32B904

CPC分类号： G02B1/111 ,  C03C17/3417 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667

摘要： Coating solutions having anti-reflective and anti-static properties, a coating derived therefrom, a substrate coated with the coating and methods for their preparation. A coating includes a sol-gel alkoxide polymeric material and a conductive colloidal metal oxide material.

摘要翻译： 具有抗反射和抗静电性能的涂层溶液，由其衍生的涂层，涂覆有涂层的基材及其制备方法。 涂层包括溶胶 - 凝胶醇盐聚合物材料和导电胶体金属氧化物材料。

公开(公告)号：US07091571B1

公开(公告)日：2006-08-15

申请号：US10735184

申请日：2003-12-11

申请人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

发明人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

IPC分类号： H01L31/0232 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/189 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is an image sensor package and a method for manufacturing the same. The image sensor package comprises an image sensor die, a substrate, a support wall having screw threads on the outer peripheral surface thereof and a mount into which a barrel including a plurality of lenses and an infrared blocking glass is mounted. The screw threads formed on the outer peripheral surface of the support wall are engaged with those formed on the inner peripheral surface of the mount. At least one passive element is provided on the substrate at the outer peripheral side of the support wall, thereby increasing the packaging density of the image sensor package.

摘要翻译： 公开了一种图像传感器封装及其制造方法。 图像传感器封装包括图像传感器芯片，基板，在其外周表面上具有螺纹的支撑壁和安装有安装有多个透镜和红外阻挡玻璃的镜筒的安装件。 形成在支撑壁的外周面上的螺纹与安装件的内周面上形成的螺纹接合。 在支撑壁的外周侧的基板上设置至少一个无源元件，从而增加图像传感器封装的封装密度。

公开(公告)号：US06936922B1

公开(公告)日：2005-08-30

申请号：US10672886

申请日：2003-09-26

申请人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

发明人： Sung Soon Park ,  Sang Jae Jang ,  Choon Heung Lee ,  Seon Goo Lee ,  Eun Sook Sohn ,  Sung Su Park

IPC分类号： H01L23/16 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L23/16 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09736 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.

摘要翻译： 公开了一种可用于半导体封装的电气基板。 电气基板包括芯绝缘层。 绝缘层的第一表面具有电路图案。 电路图案中的一些从第一表面上升到它们的高度，因为电路图形的第一子部分（包括球形区域）比第一表面的第一子部分比相同电路图案的第二子部分进一步延伸，并且还进一步延伸 从第一个表面比其他电路图案的球场。 因此，熔融到阶梯式电路图案的球台的焊球比与非阶梯式电路图案的球面熔合的相同尺寸的焊球相比，从第一表面延伸出来，从而避免了由于翘曲引起的电连接问题 电气基板。

公开(公告)号：US6117366A

公开(公告)日：2000-09-12

申请号：US84964

申请日：1998-05-27

申请人： Sung-soon Park ,  Ji-won Lee ,  Yoon-ho Jun ,  Hun-soo Kim ,  Dong-sik Zang

发明人： Sung-soon Park ,  Ji-won Lee ,  Yoon-ho Jun ,  Hun-soo Kim ,  Dong-sik Zang

IPC分类号： C09D5/24 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00

CPC分类号： H01B1/22

摘要： A composition for a transparent conductive layer, a transparent conductive layer formed of the composition, and a method for forming the transparent conductive layer. The composition comprises a metal (M.sub.1) particle, a binding agent and a solvent, wherein the metal (M.sub.1) particle has an average particle diameter of 10.about.30 nm and is at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), lead (Pb), cobalt (Co), rhodium (Rh), ruthenium (Ru), palladium (Pd) and tin (Sn), and wherein the binding agent is at least one compound selected from the group consisting of polypyrrole, polyvinylpyrrolidone, polyvinylalcohol and silicon alkoxide oligomer. Therefore, the transparent conductive layer which is excellent in conductivity and transmittance can be formed by a low-temperature sintering process.

摘要翻译： 用于透明导电层的组合物，由该组合物形成的透明导电层以及形成透明导电层的方法。 该组合物包含金属（M1）颗粒，粘合剂和溶剂，其中金属（M1）颗粒的平均粒径为10nm，并且是选自金（Au）， 银（Ag），铂（Pt），铜（Cu），镍（Ni），铅（Pb），钴（Co），铑（Rh），钌（Ru），钯（Pd）和锡（Sn） 并且其中所述粘合剂是选自聚吡咯，聚乙烯吡咯烷酮，聚乙烯醇和硅醇盐低聚物中的至少一种化合物。 因此，可以通过低温烧结工艺形成导电性和透射率优异的透明导电层。

公开(公告)号：US09127197B2

公开(公告)日：2015-09-08

申请号：US13273665

申请日：2011-10-14

申请人： Bo-Yun Jang ,  Sung-Soon Park ,  Joo-Seok Park

发明人： Bo-Yun Jang ,  Sung-Soon Park ,  Joo-Seok Park

IPC分类号： C09K11/78 ,  H01L33/44 ,  C09K11/08 ,  C09K11/77 ,  H05B33/14 ,  H01L33/50

CPC分类号： C09K11/0883 ,  C09K11/7734 ,  H01L33/502 ,  H05B33/145

摘要： The present disclosure provides α-SiAlON phosphors, a method of preparing the same, and an LED chip package using the same. The method includes weighing and mixing raw materials of Ca0.8-xRexAlaySi12-yO1.2N14.8 (Re is a rare-earth element, 0≦x≦0.2, 2.6≦y≦3.0, and 0.6≦a≦0.95), and sintering the mixed raw materials via normal pressure sintering to prepare phosphors having a composition of Ca0.8-xRexAlaySi12-yO1.2N14.8.

摘要翻译： 本公开提供了α-SiAlON荧光体，其制备方法和使用其的LED芯片封装。 该方法包括称重和混合Ca0.8-xRexAlaySi12-yO1.2N14.8原料（Re为稀土元素，0＆nlE; x＆nlE; 0.2,2.6＆nlE; y＆nlE; 3.0和0.6＆nlE; a＆nlE; 0.95） ，并通过常压烧结烧结混合原料，以制备具有Ca0.8-xRexAlaySi12-yO1.2N14.8组成的荧光体。