公开(公告)号：US07847331B2

公开(公告)日：2010-12-07

申请号：US11030900

申请日：2005-01-10

申请人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

发明人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

IPC分类号： H01L29/792

CPC分类号： G11C16/0466 ,  H01L21/28282 ,  H01L29/66833 ,  H01L29/792

摘要： In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

摘要翻译： 在存储单元包括ONO膜的情况下，其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极，其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域，通过将BTBT产生的空穴注入氮化硅膜，同时向源极区域施加正电位，向存储栅极施加负电位，向选择栅极施加正电位，进行擦除操作，以及 使电流从漏极区域流向源极区域，从而改善非易失性半导体存储器件的特性。

公开(公告)号：US07667259B2

公开(公告)日：2010-02-23

申请号：US11452256

申请日：2006-06-14

申请人： Kan Yasui ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shin-Ichiro Kimura

发明人： Kan Yasui ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shin-Ichiro Kimura

IPC分类号： H01L21/00

CPC分类号： H01L27/115 ,  G11C16/0425 ,  H01L27/11568 ,  H01L29/42344

摘要： A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of an optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

摘要翻译： 提供了一种制造非易失性半导体存储器件的方法，其克服了由于利用侧壁结构同时形成自对准分裂栅型存储单元而产生的最佳栅极高度的差异而引入的注入离子的问题，以及 一个缩放的MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高，使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。

公开(公告)号：US07531853B2

公开(公告)日：2009-05-12

申请号：US11746230

申请日：2007-05-09

申请人： Shinichi Saito ,  Digh Hisamoto ,  Yoshinobu Kimura ,  Nobuyuki Sugii ,  Ryuta Tsuchiya

发明人： Shinichi Saito ,  Digh Hisamoto ,  Yoshinobu Kimura ,  Nobuyuki Sugii ,  Ryuta Tsuchiya

IPC分类号： H01L29/80 ,  H01L31/112 ,  H01L29/76 ,  H01L29/94 ,  H01L31/00

CPC分类号： H01L27/1203 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L29/045 ,  H01L29/7846 ,  H01L29/785

摘要： A semiconductor device and manufacturing method of the same is provided in which the driving current of a pMOSFET is increased, through a scheme formed easily using an existing silicon process. A pMOSFET is formed with a channel in a direction on a (100) silicon substrate. A compressive stress is applied in a direction perpendicular to the channel by an STI.

摘要翻译： 提供了一种半导体器件及其制造方法，其中通过使用现有的硅工艺容易地形成的方案，增加了pMOSFET的驱动电流。 在（100）硅衬底上形成具有<100>方向的沟道的pMOSFET。 通过STI在垂直于通道的方向上施加压应力。

公开(公告)号：US07443731B2

公开(公告)日：2008-10-28

申请号：US11727592

申请日：2007-03-27

申请人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C11/34 ,  G11C16/04

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US07442986B2

公开(公告)日：2008-10-28

申请号：US11797839

申请日：2007-05-08

申请人： Kan Yasui ,  Digh Hisamoto ,  Shinichiro Kimura

发明人： Kan Yasui ,  Digh Hisamoto ,  Shinichiro Kimura

IPC分类号： H01L29/788

CPC分类号： H01L27/11568 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/4232 ,  H01L29/792

摘要： In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

摘要翻译： 在其中使用电荷存储膜的非易失性存储器的MOS晶体管和用于选择它的MOS晶体管相邻形成的分离栅极型非易失性存储单元中，电荷存储特性得到改善，栅电极的电阻降低。 为了防止电荷存储薄膜的拐角部分的厚度减小并且提高电荷存储特性，在选择栅电极的侧壁上形成锥形。 此外，为了稳定地进行用于降低自对准栅电极的电阻的硅化物工艺，选择栅电极的侧壁凹陷。 或者，在自对准栅电极的上部和选择栅电极的上部之间形成不连续。

公开(公告)号：US20080128713A1

公开(公告)日：2008-06-05

申请号：US11790283

申请日：2007-04-24

申请人： Shinichi Saito ,  Digh Hisamoto ,  Tadashi Arai ,  Takahiro Onai

发明人： Shinichi Saito ,  Digh Hisamoto ,  Tadashi Arai ,  Takahiro Onai

IPC分类号： H01L33/00

CPC分类号： H01L33/34 ,  H01S5/3224

摘要： A light-emitting device according to the present invention includes a first electrode unit 9 for injecting an electron, a second electrode unit 10 for injecting a hole, and light-emitting units 11 and 12 electrically connected to the first electrode unit 9 and the second electrode unit 10 respectively, wherein the light-emitting units 11 and 12 are formed of single-crystal silicon, the light-emitting units 11 and 12 having a first surface (topside surface) and a second surface (underside surface) opposed to the first surface, plane orientation of the first and second surfaces being set to a (100) plane, thicknesses of the light-emitting units 11 and 12 in a direction orthogonal to the first and second surfaces being made extremely thin.

摘要翻译： 根据本发明的发光器件包括用于注入电子的第一电极单元9，用于注入孔的第二电极单元10和与第一电极单元9电连接的发光单元11和12， 电极单元10，其中发光单元11和12由单晶硅形成，发光单元11和12具有与第一表面相对的第一表面（顶侧表面）和第二表面（下表面） 第一和第二表面的表面，平面取向被设置为（100）面，发光单元11和12在与第一和第二表面正交的方向上的厚度非常薄。

公开(公告)号：US07339827B2

公开(公告)日：2008-03-04

申请号：US11147243

申请日：2005-06-08

申请人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

发明人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

IPC分类号： G11C16/06 ,  G11C16/32 ,  G11C5/06 ,  G11C16/08 ,  G11C16/24

CPC分类号： G11C16/3418 ,  G11C16/0466 ,  G11C16/3427 ,  H01L27/115 ,  H01L29/4232 ,  H01L29/792

摘要： In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.

摘要翻译： 关于字线偏差的上升和下降，本发明采用使存储晶体管侧的扩散区电压Vs变化的过程，在电压Vs经过一定的中间值Vsx之后，栅极电压Vmg为 存储晶体管被改变。 或者，采用使存储晶体管的栅极电压Vmg改变的过程，并且在电压Vmg经过一定的中间值Vmgx之后，存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定，导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。

公开(公告)号：US20060234454A1

公开(公告)日：2006-10-19

申请号：US11404899

申请日：2006-04-17

申请人： Kan Yasui ,  Shinichiro Kimura ,  Digh Hisamoto ,  Tetsuya Ishimaru

发明人： Kan Yasui ,  Shinichiro Kimura ,  Digh Hisamoto ,  Tetsuya Ishimaru

IPC分类号： H01L21/336

CPC分类号： H01L29/792 ,  G11C16/0425 ,  G11C16/0466 ,  H01L27/105 ,  H01L27/11568 ,  H01L29/40117 ,  H01L29/42344 ,  H01L29/66833

摘要： After forming a first dielectric film on the main surface of a semiconductor substrate, a first conductive film is formed on the first dielectric film, and then, the surface of the first conductive film is planarized by a CMP method. Subsequently, the first conductive film and the first dielectric film are etched, thereby forming a select gate having a first gate electrode and a first gate dielectric film. Subsequently, after forming a second dielectric film on the sidewall of the first gate electrode and the main surface, a second conductive film is formed on the second dielectric film, and the second conductive film is etched, thereby forming a memory gate having a second gate electrode and a second gate dielectric film.

摘要翻译： 在半导体衬底的主表面上形成第一电介质膜之后，在第一电介质膜上形成第一导电膜，然后通过CMP方法将第一导电膜的表面平坦化。 随后，蚀刻第一导电膜和第一电介质膜，从而形成具有第一栅极电极和第一栅极电介质膜的选择栅极。 随后，在第一栅电极和主表面的侧壁上形成第二电介质膜之后，在第二电介质膜上形成第二导电膜，并且蚀刻第二导电膜，从而形成具有第二栅极的存储栅极 电极和第二栅极电介质膜。

公开(公告)号：US20050230736A1

公开(公告)日：2005-10-20

申请号：US11030900

申请日：2005-01-10

申请人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

发明人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

IPC分类号： G11C16/02 ,  G11C16/04 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8247 ,  H01L27/105 ,  H01L27/115 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792

CPC分类号： G11C16/0466 ,  H01L21/28282 ,  H01L29/66833 ,  H01L29/792

摘要： In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

摘要翻译： 在存储单元包括ONO膜的情况下，其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极，其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域，通过将BTBT产生的空穴注入氮化硅膜，同时向源极区域施加正电位，向存储栅极施加负电位，向选择栅极施加正电位，进行擦除操作，以及 使电流从漏极区域流向源极区域，从而改善非易失性半导体存储器件的特性。

公开(公告)号：US20050085039A1

公开(公告)日：2005-04-21

申请号：US10901347

申请日：2004-07-29

申请人： Kan Yasui ,  Digh Hisamoto ,  Shinichiro Kimura

发明人： Kan Yasui ,  Digh Hisamoto ,  Shinichiro Kimura

IPC分类号： H01L21/28 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/4763 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/423 ,  H01L29/788 ,  H01L29/792

CPC分类号： H01L27/11568 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/4232 ,  H01L29/792

摘要： In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

摘要翻译： 在其中使用电荷存储膜的非易失性存储器的MOS晶体管和用于选择它的MOS晶体管相邻形成的分离栅极型非易失性存储单元中，电荷存储特性得到改善，栅电极的电阻降低。 为了防止电荷存储薄膜的拐角部分的厚度减小并且提高电荷存储特性，在选择栅电极的侧壁上形成锥形。 此外，为了稳定地进行用于降低自对准栅电极的电阻的硅化物工艺，选择栅电极的侧壁凹陷。 或者，在自对准栅电极的上部和选择栅电极的上部之间形成不连续。