摘要:
Multimodal or multispectral images of cells comprising a population of cells are simultaneously collected. Photometric and/or morphometric image features identifiable in the images are used to identify differences between first and second populations of cells. The differences can include changes in a relative percentage of different cell types in each population, or a change in a first type of cell present in the first population of cells and the same type of cell in the second population of cells. The changes may be indicative of a disease state, indicative of a relative effectiveness of a therapy, or indicative of a health of the person from whom the cells populations were obtained.
摘要:
Embodiments described herein are directed to simultaneously presenting a virtual touchpad and a graphical user interface of an operating system on the same display. A user can interact with the OS using the virtual touchpad, and user touches are read by a touch-screen portion of the display assigned to the touchpad. Touch input software converts touch packets from user touches into data packets relevant to the screen and display resolution of either the display or a portion of the display presenting the OS. Gesture-recognition software applies rules to the converted packets to determine which actions the user meant by the touches. And an application controlling a mouse cursor manipulates the mouse cursor according to the mouse actions.
摘要:
Dibenzyl amine compounds and derivatives, pharmaceutical compositions containing such compounds and the use of such compounds to elevate certain plasma lipid levels, including high density lipoprotein-cholesterol and to lower certain other plasma lipid levels, such as LDL-cholesterol and triglycerides and accordingly to treat diseases which are exacerbated by low levels of HDL cholesterol and/or high levels of LDL-cholesterol and triglycerides, such as atherosclerosis and cardiovascular diseases in some mammals, including humans.
摘要:
Quinoline compounds, pharmaceutical compositions containing such compounds and the use of such compounds to elevate certain plasma lipid levels, including high density lipoprotein-cholesterol and to lower certain other plasma lipid levels, such as LDL-cholesterol and triglycerides and accordingly to treat diseases which are exacerbated by low levels of HDL cholesterol and/or high levels of LDLcholesterol and triglycerides, such as atherosclerosis and cardiovascular diseases in some mammals, including humans.
摘要:
The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.
摘要:
An archival cartridge management system for conditioning removable data cartridges and normal archival operations is disclosed. The archival cartridge management system includes a cartridge holder and a controller. The cartridge holder has a connector configured for coupling to a removable data cartridge. The connector is coupled to the controller, which performs archival functions on removable data cartridges. The controller reads from removable data cartridges to determine if at least some data stored on a removable data cartridge should be refreshed. If so, the controller refreshes data stored on the removable data cartridge.
摘要:
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.
摘要:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
摘要:
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.
摘要:
One or more heat pipes are connected between a component on a circuit card and the frame of a circuit card assembly for transfer of heat to the frame of the circuit card assembly. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. Heat collector can be attached to the heat generating components of a circuit card between the heat pipe and the component to provide improved thermal transfer. A number of heat collectors with pairs of heat pipes extending in opposite directions from the collector to the frame can be used to allow the heat pipes to effectively dissipate heat form the circuit card assembly regardless of the orientation of the circuit card assembly.