Abstract:
An electrical protection device is provided. The device can be removably attached to or mounted inside of a power source, such as a vehicle, e.g., automobile, battery and can employ a replaceable fuse element. The device includes an overcurrent protection element, such as a fuse element, and provides any one or more of the following types of electrical protection: (i) overcurrent protection; (ii) accident or catastrophic event power cutout protection; and (iii) load dump protection. The system is configurable to protect certain vehicle electrical components from an overcurrent and allow others to operate independent of the overcurrent protection. Systems and methods employing the protection device are also illustrated and discussed.
Abstract:
A surface-mount fuse for protecting a circuit, which includes a substrate having first and second surfaces, each surface having first, second, third, and fourth ends, the substrate also having first, second, third, and fourth sides. The fuse includes a metal strip attached to the first surface of the substrate with a layer of adhesive material, the layer of adhesive material being disposed between the metal strip and the first surface of the substrate, the metal strip having a first connection region, a second connection region, and a non-linear fuse link therebetween. The fuse further includes first and second wire leads, the first wire lead being conductively connected to the first connection region and horizontally projecting away from the first connection region, the second wire lead being conductively connected to the second connection region and horizontally projecting away from the second connection region, for connecting the fuse to the remainder of the circuit. Alternatively, the wire leads can include clip leads or other terminal leads. The fuse also includes a protective layer disposed on the fuse link. A method for making the fuse is also disclosed.
Abstract:
A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.
Abstract:
The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.
Abstract:
A number of integrated circuit dies having on board protection against electrical overstress (EOS) transients are provided. Generally, the devices have an integrated circuit die with an outer periphery and a functional die area. A plurality of conductive input/output pads are formed on the integrated circuit die. Typically, a first conductive guard rail is disposed on the integrated circuit die and forms a gap between each one of the input/output pads. A voltage variable material is disposed in the gaps between the conductive guard rail and the input/output pads. Typically, a plurality of electrical leads are electrically connected to a respective one of the plurality of conductive input/output pads. At normal operating voltages, the voltage variable material is non-conductive. However, in response to an EOS transient, the voltage variable material switches to a low resistance state, providing a conductive path between the conductive guard rail and the input/output pads.
Abstract:
A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.