公开(公告)号：US20050079279A1

公开(公告)日：2005-04-14

申请号：US10966417

申请日：2004-10-15

申请人： Gong Gu ,  Paul Burrows ,  Stephen Forrest

发明人： Gong Gu ,  Paul Burrows ,  Stephen Forrest

IPC分类号： H05B33/02 ,  C09K11/06 ,  G09F9/30 ,  G09F13/22 ,  H01J1/62 ,  H01L51/00 ,  H01L51/50 ,  H05B33/10 ,  H05B33/12 ,  H05B33/26 ,  B05D5/06

CPC分类号： H01L51/5012 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/0097 ,  H01L2251/5338 ,  H05B33/10 ,  H05B33/12

摘要： An organic light emitting device (OLED) is disclosed for which the hole transporting layer, the electron transporting layer and/or the emissive layer, if separately present, is comprised of a non-polymeric material. A method for preparing such OLED's using vacuum deposition techniques is further disclosed.

摘要翻译： 公开了一种有机发光器件（OLED），其中空穴传输层，电子传输层和/或发射层（如果单独存在）由非聚合材料构成。 进一步公开了使用真空沉积技术制备这种OLED的方法。

公开(公告)号：US06813182B2

公开(公告)日：2004-11-02

申请号：US10160802

申请日：2002-05-31

申请人： Craig M Perlov ,  Stephen Forrest

发明人： Craig M Perlov ,  Stephen Forrest

IPC分类号： G11C1136

CPC分类号： H01L27/285 ,  B82Y10/00 ,  G11C13/0009 ,  G11C13/0014 ,  G11C17/16 ,  G11C17/165 ,  G11C2213/71 ,  G11C2213/72 ,  H01L27/1021 ,  H01L51/0053 ,  H01L51/0078 ,  H01L51/0595

摘要： A donor/acceptor-organic-junction sheet employed within an electronic memory array of a cross-point diode memory. The donor/acceptor-organic-junction sheet is anistropic with respect to flow of electrical current and is physically unstable above a threshold current. Thus, the volume of the donor/acceptor-organic-junction sheet between a row line and column line at a two-dimensional memory array grid point serves both as the diode component and as the fuse component of a diode-and-fuse memory element and is electrically insulated from similar volumes of the donor/acceptor-organic-junction sheet between neighboring grid point intersections.

摘要翻译： 在交叉点二极管存储器的电子存储器阵列内采用的施主/受体 - 有机结合片。 供体/受体 - 有机结合片相对于电流流动是无向的，并且在阈值电流之上物理上是不稳定的。 因此，在二维存储阵列栅极点处的行线和列线之间的施主/受体 - 有机结合片的体积既用作二极管组分又用作二极管和熔丝存储元件的熔丝组分 并且与相邻网格点交点之间的供体/受体 - 有机连接片的类似体积电绝缘。

公开(公告)号：US06362069B1

公开(公告)日：2002-03-26

申请号：US09750195

申请日：2000-12-28

申请人： Stephen Forrest ,  Milind R. Gokhale ,  Hongsheng Wang

发明人： Stephen Forrest ,  Milind R. Gokhale ,  Hongsheng Wang

IPC分类号： H01L2176

CPC分类号： H01S5/18341 ,  G02B6/4221 ,  G02B6/4224 ,  G02B6/4232 ,  H01L21/2007 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/8113 ,  H01L2924/12032 ,  H01S5/0217 ,  H01S5/02272 ,  H01S5/18369 ,  H01S5/18377 ,  H01S5/18394 ,  H01S2301/176 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing VCSELs which involves a flip-bonding process wherein the top surface of the VCSEL wafer is bonded face down onto a surrogate substrate. The process begins in a manner similar to traditional double dielectric stack based VCSEL, but then involves flip-bonding the wafer onto an In or Ag epoxy coated surrogate substrate. The InP substrate is then selectively etched. After flip-bonding the wafer fabrication proceeds on the freshly etched surface which now forms the top surface. Next, standard mesa-isolation and contact formation techniques are performed on this newly etched surface.

摘要翻译： 本发明提供一种制造VCSEL的方法，其涉及一种倒装工艺，其中VCSEL晶片的顶表面正面朝下地接合到替代基板上。 该过程以类似于传统的基于双介质堆叠的VCSEL的方式开始，但是然后涉及将晶片倒置到In或Ag环氧树脂涂层的替代基板上。 然后选择性地蚀刻InP衬底。 在翻转接合之后，晶片制造在现在形成顶表面的新蚀刻表面上进行。 接下来，在这个新蚀刻的表面上进行标准台面隔离和接触形成技术。

公开(公告)号：US5859866A

公开(公告)日：1999-01-12

申请号：US797276

申请日：1997-02-07

申请人： Stephen Forrest ,  Chih-Ping Chao ,  Miland Gokhale ,  Ligeng Xu

发明人： Stephen Forrest ,  Chih-Ping Chao ,  Miland Gokhale ,  Ligeng Xu

IPC分类号： G02B6/12 ,  G02B6/42 ,  H01S5/026 ,  H01S5/10 ,  H01S3/19 ,  G02B6/10 ,  G02B6/26 ,  H01S3/098

CPC分类号： G02B6/12004 ,  G02B6/42 ,  H01S5/0265 ,  H01S5/1032 ,  G02B2006/12121 ,  G02B2006/12142 ,  G02B2006/12164 ,  G02B6/4214

摘要： A monolithically integrated vertical twin-waveguide structure reduces the sensitivity of the device performance characteristics due to the laser cavity length and variations in the layer structure. This is achieved by the introduction of an absorption or loss layer between the active and passive regions. This layer eliminates the propagation of the even mode, while having minimal effect on the odd mode. The threshold current densities and differential efficiencies of the devices are unaffected by the loss layer. A coupling efficiency of 45% from the laser to the external passive waveguide is obtained.

摘要翻译： 单片集成的垂直双波导结构降低了由于激光腔长度和层结构变化引起的器件性能特性的灵敏度。 这是通过在主动和被动区域之间引入吸收或损失层来实现的。 该层消除了偶模式的传播，同时对奇数模式的影响最小。 器件的阈值电流密度和差分效率不受损耗层的影响。 获得从激光到外部无源波导的耦合效率为45％。

公开(公告)号：US09508957B2

公开(公告)日：2016-11-29

申请号：US12531595

申请日：2008-03-31

申请人： Stephen Forrest ,  Yiru Sun

发明人： Stephen Forrest ,  Yiru Sun

IPC分类号： H05B33/14 ,  H01L51/52 ,  H01L51/50

CPC分类号： H01L51/5275 ,  H01L51/5012

摘要： An OLED may include regions of a material having a refractive index less than that of the substrate, or of the organic region, allowing for emitted light in a waveguide mode to be extracted into air. These regions can be placed adjacent to the emissive regions of an OLED in a direction parallel to the electrodes. The substrate may also be given a nonstandard shape to further improve the conversion of waveguide mode and/or glass mode light to air mode. The outcoupling efficiency of such a device may be up to two to three times the efficiency of a standard OLED. Methods for fabricating such a transparent or top-emitting OLED is also provided.

摘要翻译： OLED可以包括具有小于衬底或有机区域的折射率的材料的区域，从而允许波导模式中的发射光被提取到空气中。 这些区域可以在与电极平行的方向上与OLED的发射区域相邻放置。 衬底也可以被赋予非标准形状，以进一步改善波导模式和/或玻璃模式光到空气模式的转换。 这种器件的输出耦合效率可高达标准OLED效率的两到三倍。 还提供了制造这种透明或顶部发光OLED的方法。

公开(公告)号：US08631759B2

公开(公告)日：2014-01-21

申请号：US12697357

申请日：2010-02-01

申请人： Stephen Forrest ,  Xin Xu ,  Xiangfei Qi ,  Marcelo Davanco

发明人： Stephen Forrest ,  Xin Xu ,  Xiangfei Qi ,  Marcelo Davanco

IPC分类号： B05C1/00 ,  B05C11/00 ,  C23C14/00

CPC分类号： H01L51/0004 ,  B29D11/00807 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L51/0022

摘要： An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.

摘要翻译： 使用弹性体印模将材料沉积在非平面基底上。 使用真空模具来使弹性体印模变形，施加压力以将材料从印模转移到基底。 通过减小由真空模具施加的真空度，可以使用印模的弹性来施加该压力。 也可以通过向衬底和/或印模施加力来施加压力。 使用弹性体印记允许图案化层被沉积在非平面基板上，同时具有减小对图案化层的损伤的机会。

公开(公告)号：US20130068165A1

公开(公告)日：2013-03-21

申请号：US13235981

申请日：2011-09-19

申请人： Stephen Forrest ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Diane L. Peters

发明人： Stephen Forrest ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Diane L. Peters

IPC分类号： C23C16/04 ,  B32B37/02

CPC分类号： C23C14/12 ,  C23C14/228 ,  C23C14/243 ,  Y10T137/85938

摘要： A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

摘要翻译： 用于微流体递送系统的微流体装置，例如有机蒸气喷射印刷装置，包括通过双阳极结合直接结合到微加工模具和金属板的玻璃层。 通过在微细晶粒和玻璃层的界面处形成第一阳极结，并在金属板和玻璃层的界面处形成第二阳极结，形成双阳极结，其中使用 电压低于用于形成第一阳极键的电压。 第二阳极键形成为相对于玻璃层反转的电压的极性和第一阳极键的形成。 金属板包括允许将微流体装置从夹具中移出的附件特征。

公开(公告)号：US20130001731A1

公开(公告)日：2013-01-03

申请号：US13536003

申请日：2012-06-28

申请人： Stephen Forrest ,  Jeramy D. Zimmerman ,  Xin Xu ,  Christopher Kyle Renshaw

发明人： Stephen Forrest ,  Jeramy D. Zimmerman ,  Xin Xu ,  Christopher Kyle Renshaw

IPC分类号： H01L31/18 ,  H01L27/144

CPC分类号： H01L27/14643 ,  H01L27/1446 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/022408 ,  H01L31/0304 ,  H01L31/03926 ,  H01L31/075 ,  H01L31/1844 ,  H01L31/1892 ,  Y02E10/544 ,  Y02E10/548

摘要： A method of fabricating an optoelectronic device includes creating an optoelectronic structure on a first substrate. The optoelectronic structure includes a release layer and a plurality of inorganic semiconductor layers supported by the release layer. The plurality of inorganic semiconductor layers is configured to be active in operation of the optoelectronic device. The plurality of inorganic semiconductor layers are permanently attached to a second substrate, which is flexible. The plurality of inorganic semiconductor layers are released from the first substrate after the attaching step, and the second substrate is deformed to a non-planar configuration.

摘要翻译： 制造光电子器件的方法包括在第一衬底上产生光电子结构。 光电结构包括释放层和由释放层支撑的多个无机半导体层。 多个无机半导体层被配置为在光电子器件的操作中是有效的。 多个无机半导体层永久地附接到柔性的第二基板上。 在安装步骤之后，多个无机半导体层从第一基板释放，第二基板变形为非平面构造。

公开(公告)号：US20120007791A1

公开(公告)日：2012-01-12

申请号：US13176053

申请日：2011-07-05

申请人： Anthony Grbic ,  Carl Pfeiffer ,  Xin Xu ,  Stephen Forrest

发明人： Anthony Grbic ,  Carl Pfeiffer ,  Xin Xu ,  Stephen Forrest

IPC分类号： H01Q1/36 ,  H01P11/00

CPC分类号： H01Q11/083 ,  H01Q1/38 ,  H01Q9/27 ,  H01Q11/08

摘要： Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.

摘要翻译： 本文公开了一种制造天线的方法，其中从第一晶片形成柔性印模，第一晶片将图案传送到柔性印模，其中天线基板用第二模具成形为三维轮廓， 其中柔性印模定位在第二模具中，以将柔性印模变形成三维轮廓，并且其中柔性印模上的金属层被冷焊以在天线基板上产生一组天线迹线，根据 模式。 然后可以电镀天线迹线。

公开(公告)号：US07964439B2

公开(公告)日：2011-06-21

申请号：US10979448

申请日：2004-11-03

申请人： Changsoon Kim ,  Yifang Cao ,  Winston O. Soboyejo ,  Stephen Forrest

发明人： Changsoon Kim ,  Yifang Cao ,  Winston O. Soboyejo ,  Stephen Forrest

IPC分类号： H01L51/40

CPC分类号： H01L51/0022 ,  B33Y10/00 ,  B33Y30/00 ,  H01L51/0004 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/0516 ,  H01L51/0545 ,  H01L51/56

摘要： The invention provides a method of depositing a layer of a conductive material, e.g. metal, metal oxide or electroconductive polymer, from a patterned stamp, preferably a soft, elastomeric stamp, to a substrate after an organic layer has been transferred from a patterned stamp to an organic layer over the substrate. The patterned metal or organic layer may be used for example, in a wide range of electronic devices. The present methods are particularly suitable for nanoscale patterning of organic electronic components.

摘要翻译： 本发明提供一种沉积导电材料层的方法，例如， 金属，金属氧化物或导电聚合物，在有机层已经从图案化的印模转移到衬底上的有机层之后，从图案化的印模，优选软的弹性体印模到基底。 图案化的金属或有机层可以用于例如广泛的电子器件中。 本发明的方法特别适用于有机电子元件的纳米尺度图案化。