摘要:
In a flash memory, after an initial write operation ends, each bit line associated with a memory cell subjected to a write is precharged and each bit line associated with a memory cell that is not subjected to the write is discharged and verified to detect a memory cell low in threshold voltage and a memory cell thus detected is subjected to an additional write. The verification can be verified without being affected by a current flowing through the memory cell that is not subjected to the write. All memory cells can have their respective threshold voltages set accurately.
摘要:
In this AG-AND type flash memory, a layered bit line configuration where a memory array is divided into a plurality of sub blocks, new main bit lines are allocated so as to correspond to each sub block, and a main bit line is selectively connected to a global bit line in an upper layer via a switch is adopted, so that charge sharing write-in is carried out between two main bit lines. Accordingly, write-in of data into the flash memory can be carried out with low power consumption, and the threshold voltage can be controlled with precision.
摘要:
When a data write sequence is started, initially, write data is latched in a data latch circuit corresponding to one memory mat. Then, a program pulse is applied to the memory mat, and data read from a memory cell, which is a data write target bit in the memory mat, is performed. Thereafter, verify determination of the memory mat is performed. After a verify operation for the memory mat is completed, a program pulse is applied to another memory mat, and a verify operation for another memory mat is performed.
摘要:
In a flash memory, after an initial write operation ends, each bit line associated with a memory cell subjected to a write is precharged and each bit line associated with a memory cell that is not subjected to the write is discharged and verified to detect a memory cell low in threshold voltage and a memory cell thus detected is subjected to an additional write. The verification can be verified without being affected by a current flowing through the memory cell that is not subjected to the write. All memory cells can have their respective threshold voltages set accurately.
摘要:
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
摘要:
An insulated gate type field effect transistor in a memory cell array is a transistor having a gate insulating film which is thicker than a gate insulating film of an insulated gate type field effect transistor in an array peripheral circuit. DRAM (Dynamic Random Access Memory) cell-based semiconductor memory device can be implemented which allows a burn-in test to be accurately performed without degrading sensing operation characteristics even under a low power supply voltage.
摘要:
In a multi-bit test, an I/O combiner degenerates data of a plurality of bits read from a memory cell array to first to fourth data bus pairs in parallel and outputs the degenerated data to a fifth data bus. A read amplifier compares a logic level of the degenerated data received from the I/O combiner with a logic level of expected value data. If the logic level of the degenerated data coincides with the logic level of the expected value data, the read amplifier determines that data write and read to and from the plurality of bits have been normally performed. As a result, a semiconductor memory device can detect a word line defect in the multi-bit test.
摘要:
By devising the arrangement of memory arrays surrounding the central region of the chip, the total length of a data bus can be reduced. The memory arrays are arranged such that one of two memory arrays that are located at the positions point-symmetric with respect to the central region corresponds to lower DQ terminals, and the other memory array corresponds to upper DQ terminals. Preferably, the memory arrays corresponding to the upper DQ terminals and the memory arrays corresponding to the lower DQ terminals are each located collectively. Thus, a semiconductor memory device with improved data propagation characteristics on the data bus can be provided.
摘要:
A control circuit & mode register outputs a signal responsive to each command to a VDC control circuit. The VDC control circuit outputs a signal PWRUP changing the quantity of a through current Ic of a comparator stored in a VDC in response to the command. The VDC control circuit internally generates a signal of which pulse width corresponds to a prescribed delay time, in response to input of the command. Therefore, activation of each bank may not be monitored but current consumption can be reduced by preferably controlling a power supply current while minimizing the number of delay circuits and wires.
摘要:
A semiconductor memory device includes a mode detection circuit for generating a mode detection signal in response to external input signals /RAS, /CAS and /WE, an internal potential generating circuit for generating and supplying to an output node an internal potential, in response to an activated potential control signal, and an internal potential control circuit for activating a potential control signal when a potential at the output node has not yet reached a predetermined potential in a case where mode detection signal indicates a mode other than the test mode, and for activating the potential control signal when the potential at the output node has not yet reached an externally supplied external reference potential in a case where the mode detection signal indicates the test mode. When external input signals are applied at a predetermined timing, a mode detection signal indicating the test mode is generated, and when the potential at the output node of the internal potential generating circuit has not yet reached the external reference potential, an internal potential is generated and supplied to the output node. Therefore, the internal potential can be controlled in accordance with the external reference potential.