摘要:
A semiconductor device having a voltage sensing element is disclosed which allows reduction of power consumption in comparison with a conventional device and enables to obtain a sufficient output voltage to secure sensing accuracy even when an input voltage is small. In the voltage sensing element of the semiconductor device, an n.sup.- layer is formed on a front surface of a p.sup.- substrate. A p type diffused region and an n type diffused region are formed at a main surface of n.sup.- layer, spaced apart by a prescribed distance. An electrode is formed on p type diffused region, and an electrode is formed on n type diffused region. An electrode is formed on a rear surface of p.sup.- substrate. P.sup.- substrate and n.sup.- layer constitute a diode in a reversely biased state. As a result, power consumption is reduced in comparison with a conventional voltage dividing resistor circuit.
摘要:
In this semiconductor device, first, fifth and fourth impurity regions of a second conductivity type are formed on a main surface of a semiconductor layer of a first conductivity type with a predetermined space between each other. Second and third impurity regions of the first conductivity type are formed on the main surface of the first impurity region with a predetermined space between each other. A second gate electrode is formed between the second and third impurity regions. A first gate electrode is formed between the third impurity region and the semiconductor layer. A cathode electrode is connected to the third impurity region, and a short-circuit electrode is connected to first and second impurity regions. The first and fifth impurity regions are electrically short-circuited. Thereby, in the on state of the thyristor operation, the transistor including the second gate electrode can be off, whereby an entire hole current in the semiconductor layer forms a base current of one of the bipolar transistors, resulting in reduction of the holding current. Since the second gate electrode is provided independently from the first gate electrode, the gate length of the second gate electrode can be reduced, so that the on-resistance can be reduced, and thus the maximum controllable current can be increased.
摘要:
A high-breakdown voltage semiconductor device and a fabrication method are disclosed. A dielectric layer dielectrically isolates a semiconductor substrate from an n.sup.- type semiconductor layer. An n.sup.+ type semiconductor region having a lower resistance than the n.sup.+ type semiconductor layer is formed as if surrounded by a p.sup.+ type semiconductor region. The dielectric layer consists of a relatively thick first region and a relatively thin second region. The n.sup.+ type semiconductor region, which is located above the first region, occupies a narrower area than the first region. Thus, by forming the dielectric layer thick immediately under the first semiconductor layer and controlling the thickness of the dielectric layer at other potions, the breakdown voltage of the semiconductor device is improved without curbing RESURF effect.
摘要:
An object of the present invention is to provide a semiconductor device which is designed so as to increase a maximum controllable current and decrease hold current without degrading its characteristic and to provide a method of manufacturing such a semiconductor device. A transistor formation region 3 and a P diffusion region 15 are selectively formed through an insulating film 4 between gate electrodes 5 on an N.sup.- epitaxial layer 2. In a transistor formation region 3, an N.sup.+ diffusion region 12 is formed on a P diffusion region 11, a P diffusion region 13 is formed on the N.sup.+ diffusion region 12, and an N.sup.+ diffusion region 14 is selectively formed on a surface of the P diffusion region 13. Then, a cathode electrode 7 is formed on the P diffusion region 13, N.sup.+ diffusion region 14 and P diffusion region 15, and an anode electrode 8 is formed on a second major surface of the P.sup.+ substrate 1. Due to a structural characteristic that an increase in current between electrodes 7 and 8 causes no latch-up phenomenon, etc., a maximum controllable current can be increased, and hold current can be decreased.
摘要翻译:本发明的目的是提供一种半导体器件,其被设计为增加最大可控电流并降低保持电流而不降低其特性,并提供制造这种半导体器件的方法。 通过N-外延层2上的栅电极5之间的绝缘膜4选择性地形成晶体管形成区域3和P扩散区域15.在晶体管形成区域3中,在P扩散区域上形成N +扩散区域12 如图11所示,在N +扩散区域12上形成P扩散区域13,在P扩散区域13的表面上选择性地形成N +扩散区域14.然后,在P扩散区域13上形成阴极电极7, N +扩散区域14和P扩散区域15,并且阳极电极8形成在P +衬底1的第二主表面上。由于电极7和8之间的电流增加不产生闩锁现象的结构特征, 可以增加最大可控电流,并且可以降低保持电流。
摘要:
A general object of the present invention is to make a maximum controllable current large without exerting adverse effect on other characteristics. In a surface of an n.sup.- layer 2 formed on a p.sup.+ substrate 1, p diffusion regions 3a, 3b and 3c are formed separated by n.sup.+ diffusion regions 4a, 4b and an oxidation film 9. Above the p diffusion regions 3b and 3c, gate electrodes 5a and 5b are formed insulated from the surrounding by an oxidation film 6. An Al-Si electrode 7 is in contact with the p diffusion region 3a and the n.sup.+ diffusion region 4a while a metal electrode 8 is in contact with the p.sup.+ substrate 1. By virtue of interposition of the oxidation film 9, a thyristor consisting of the n.sup.+ diffusion region 4a, p diffusion region 3a, n.sup.- layer 2 and p.sup.+ substrate 1 is prevented from being actuated.
摘要:
A thyristor structure comprises a p.sup.+ -type substrate (21), an n-type base layer (22), a first p-type diffusion region (23) and an n.sup.+ -type diffusion region (25). A MOS structure comprises the base layer (22), first and second p-type diffusion regions (23, 24) and the n.sup.+ -type diffusion region (25). A positive voltage is applied to a gate electrode (27) to form a channel in a portion of the first diffusion region (23) just under the gate electrode (27), so that a cathode electrode (28) supplies carriers to the base layer (22) through the n.sup.+ -type diffusion region (25) and the channel, to turn on the thyristor. A negative voltage is applied to the gate electrode (27) to form a channel in a portion of the base layer (22) just under the gate electrode (27), so that the first p-type diffusion region (23) and the n.sup.+ -type diffusion region (25) are shorted through the channel, the second p-type diffusion region (24) and the cathode electrode (28), to turn off the thyristor.
摘要:
Between electrodes (9) and (10) are formed a p.sup.+ substrate (2), an n.sup.- epitaxial layer (1) having a protruding portion (3), an n.sup.+ diffusion region (4) and p.sup.+ diffusion regions (13). Control electrodes (6) are formed on insulating films (5) on opposite sides of the protruding portion (3) and n.sup.+ diffusion region (4). The potential at the control electrodes (6) is increased or decreased with the potential at an electrode (10) increased relative to an electrode (9) to generate potential barrier or conductivity modulation in the n.sup.- epitaxial layer (1), whereby a semiconductor device turns off or on. Introduced holes are drawn through the p.sup.+ diffusion regions (13) when the semiconductor device turns off, to provide a small resistance and a short distance when the holes are drawn without changes in the area of the n.sup.+ diffusion region (4). This permits the semiconductor device to have small switching loss and high switching speed with a low ON-voltage.
摘要:
A semiconductor device includes an N.sup.- type semiconductor layer (2). The N.sup.- type semiconductor layer (2) includes a triangular pole trench (10), an apex portion thereof contains a gate electrode (5). The trench (10) penetrates the semiconductor layer (2) and a P type well region (3) and projects into an N.sup.+ type source region (4). A source electrode (7) is disposed so as to be insulated from the semiconductor layer (2) by an oxide film (9) and in contact with the well region (3) and the source region (4). A drain electrode (8) is connected to the semiconductor layer (2) through an N.sup.+ type semiconductor substrate (1). With a higher potential at the gate electrode (5) than at the source electrode (7), the well region (3) is partially inverted into N type near the trench (10). Thus, the semiconductor device is turned on due to a channel created associated to the conductivity type inversion. Most of current flow allowed in the semiconductor layer (2) by the channel flows near the trench (10). Hence, even when process patterns are refined, electrode-to-electrode insulation remains undegraded in the semiconductor device, attaining low on-resistance and high off-breakdown voltage.
摘要:
Conductive plates (16a-16e), or floating semiconductor regions (17a-17d), or conductive plates (16a, 16c, 16e) and floating semiconductor regions (17a, 17d) are disposed in alignment so that a coupling capacitance between the conductive plates and/or the floating semiconductor regions which are adjacent to each other decrease as a distance from a first or second semiconductor region (12, 13) increases. Therefore, the respective potentials at the conductive plates or the floating semiconductor regions can be varied linearly (or at equal potential differences), and corresponding potential distribution can be achieved on the surface of a semiconductor substrate (11). As a result, electric field concentration on the surface of the semiconductor substrate (11) just under a high potential conductive layer (14) can be prevented effectively even by the use of an insulating layer (15) with a common thickness.
摘要:
There is provided p diffusion regions (18a, 18b) in the surface of an end portion of the n island (7) formed on the p.sup.- substrate (12). The insulation film (14) is formed on the n island (7) to form therein conductive plates (16a-16e). The p diffusion regions (18a, 18b) and the conductive plates (16a-16e) are alternately arranged and so aligned that adjacent pairs of end portions thereof overlap with each other. Capacitances of capacitive coupling of the conductive plates (16a-16e) and the p diffusion regions (18a, 18b) are optimized so that potentials of the conductive plates (16a-16e) and the p diffusion regions (18a, 18b) can substantially linearly change from a low level to a high level. Thus, the concentration of electric field can be prevented.