Light-emitting semiconductor device, mounted substrate, and fabrication method thereof
    82.
    发明授权
    Light-emitting semiconductor device, mounted substrate, and fabrication method thereof 有权
    发光半导体装置,安装基板及其制造方法

    公开(公告)号:US08319242B2

    公开(公告)日:2012-11-27

    申请号:US13179200

    申请日:2011-07-08

    IPC分类号: H01L33/00

    摘要: A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.

    摘要翻译: 发光半导体器件包括具有引线电极的引线框架,布置有引线框架的反射器和容纳在反射器中的发光半导体芯片,并且具有通过倒装芯片接合方法连接到引线电极的电极,其中 :引线框与发光半导体芯片之间的间隙填充有固化的底部填充材料,并且形成厚度为0.05至10μm的固化的氧化硅膜覆盖表面的发光半导体芯片和反射器。

    Addition-curable silicone composition and cured product thereof
    84.
    发明授权
    Addition-curable silicone composition and cured product thereof 有权
    可加成固化的硅氧烷组合物及其固化产物

    公开(公告)号:US08071707B2

    公开(公告)日:2011-12-06

    申请号:US12423315

    申请日:2009-04-14

    申请人: Tsutomu Kashiwagi

    发明人: Tsutomu Kashiwagi

    IPC分类号: C08G77/12

    摘要: An addition-curable silicone composition is provided. The composition includes (A) a resin structure organopolysiloxane and (B) a platinum group metal-based catalyst. The component (A) has silicon-bonded alkenyl groups and hydrosilyl groups, and includes a structure in which R22SiO units, wherein R2 is a methyl group, etc., are connected together in a continuous repeating sequence, and the number of units in the continuous repeating sequence is within a range from 5 to 300. The composition can be prepared in a solid or semisolid form, and hence is suitable conventional molding apparatus such as a transfer molding apparatus, and upon curing, forms a hard resin cured product that exhibits excellent flexibility and minimal surface tack.

    摘要翻译: 提供了可加成固化的有机硅组合物。 组合物包括(A)树脂结构的有机聚硅氧烷和(B)铂族金属类催化剂。 组分(A)具有硅键合的烯基和氢化硅烷基,并且包括其中R 2为甲基等的R 22 SiO单元以连续的重复序列连接在一起的结构,并且 连续重复序列在5至300的范围内。组合物可以以固体或半固体形式制备,因此是适合的传统模塑设备如传递模塑设备,并且在固化时形成硬树脂固化产物,其显示出 优异的柔韧性和最小的表面粘性。

    ISOCYANURIC RING-CONTAINING POLYSILOXANE HAVING VINYL GROUPS AT THE TERMINALS
    85.
    发明申请
    ISOCYANURIC RING-CONTAINING POLYSILOXANE HAVING VINYL GROUPS AT THE TERMINALS 有权
    在端子上具有乙烯基团的含异氰酸酯环的聚硅氧烷

    公开(公告)号:US20110105713A1

    公开(公告)日:2011-05-05

    申请号:US12938639

    申请日:2010-11-03

    IPC分类号: C08G77/20

    摘要: The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.

    摘要翻译: 本发明的目的是提供一种可以提供可以利用氢化硅烷化(加成反应)的性质的固化产物的异氰脲酸环的有机聚硅氧烷,并且适合用于光学半导体的封装材料。 因此,本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式(1)表示的有机聚硅氧烷:其中,X彼此独立地为1价有机基, 不具有不饱和键,R 1和R 2彼此独立地为甲基或苯基,P为1〜30的整数。

    LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS
    87.
    发明申请
    LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS 有权
    透镜成型硅树脂组合物和硅胶透镜

    公开(公告)号:US20100197870A1

    公开(公告)日:2010-08-05

    申请号:US12759293

    申请日:2010-04-13

    IPC分类号: C08G77/14

    摘要: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.

    摘要翻译: 硅氧烷树脂组合物,其包含(A)含有至少两个脂族不饱和键并且在25℃下具有100-1,000,000mPa·s粘度的有机聚硅氧烷,(B)具有至少三个与硅键合的氢原子的有机氢聚硅氧烷(SiH基) ),(C)铂族金属碱催化剂固化成无色透明部分,这是有用的透镜。

    Silicone composition and cured product
    89.
    发明申请
    Silicone composition and cured product 有权
    硅胶组合物和固化产物

    公开(公告)号:US20070129508A1

    公开(公告)日:2007-06-07

    申请号:US11633589

    申请日:2006-12-05

    申请人: Tsutomu Kashiwagi

    发明人: Tsutomu Kashiwagi

    IPC分类号: C08L83/04 C08G77/00

    摘要: A silicone composition is provided comprising (A) an organopolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3aR4bSiO(4−a−b)/2 units, wherein R1, R2, and R3 are methyl, ethyl, propyl, cyclohexyl or phenyl, R4 is vinyl or allyl, a is 0, 1 or 2, b is 1 or 2, a+b is 2 or 3, the number of recurring R22SiO units being 10 to 300, (B) an organohydrogenpolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3cHdSiO(4−c−d)/2 units, wherein R1, R2, and R3 are as defined above, c is 0, 1 or 2, d is 1 or 2, c+d is 2 or 3, the number of recurring R22SiO units being 10 to 300, and (C) a platinum catalyst. The silicone composition cures into a product exhibiting flexibility and minimized surface tack, and can be effectively molded on the existing molding machines.

    摘要翻译: 提供一种硅氧烷组合物,其包含(A)由R 1,SiO 2,R 2,R 2,R 2, (4-ab)/ 2(SiO 2)2 SiO 2和R 3 SiO 3(4-ab)/ 2 其中R 1,R 2,R 3和R 3是甲基,乙基,丙基,环己基或苯基, SUP> 4是乙烯基或烯丙基,a是0,1或2,b是1或2,a + b是2或3,重复R 2的数目< 2个SiO单元为10〜300,(B)树脂结构的有机氢聚硅氧烷,由R 1,SiO 2,Z 2,R 2, 二氧化硅和三氧化二锑(Ⅳ)4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 -cd)/ 2单元,其中R 1,R 2和R 3如上定义,c为0 ,1或2,d为1或2,c + d为2或3,重复的R 2 SiO 2单元数为10至300,和(C )铂催化剂。 有机硅组合物固化成具有柔韧性和最小化的表面粘性的产品,并且可以有效地模制在现有的成型机上。

    Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
    90.
    发明申请
    Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
    用于密封光学元件的树脂组合物,其固化产物,以及密封半导体元件的方法

    公开(公告)号:US20070099009A1

    公开(公告)日:2007-05-03

    申请号:US11586564

    申请日:2006-10-26

    IPC分类号: B32B9/04 C08G77/08

    摘要: The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0

    摘要翻译: 本发明提供了一种用于密封光学器件的组合物,该组合物可以形成具有优异的耐热性,耐紫外光性,光学透明性,韧性和粘附性的涂膜,并且还提供了该组合物的固化产物,以及密封方法 使用组合。 一种用于密封光学器件的树脂组合物,其包含:(i)聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷,其平均组成式为: -formulae description =“In-line Formulas”end =“lead”?> R&lt; 1&lt;&lt;&gt;(OX)b 4-ab)/ 2 <?in-line-formula description =“In-line Formulas”end =“tail”?>(其中,R 1表示烷基,烯基 基团或芳基; X表示由下式表示的基团的组合:R 1,R 2,R 3,R 4, O 2〜R 4为一价烃基),烷基,烯基,烷氧基烷基或酰基; a表示1.00〜1.5的数; b 表示满足0