摘要:
A resin composition containing a silica-based filler which differs in refractive index by ±0.03 from the curable base resin and has a thermal conductivity no lower than 0.5 W/m·K, and a light-emitting diode encapsulated with said resin composition. The resin composition is preferably prepared from a curable silicone resin which imparts a cured product having a refractive index of 1.45 to 1.55 and cristobalite powder dispersed therein.
摘要:
A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.
摘要:
An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO3/2) units (wherein Φ represents a phenyl group) within the cured product, determined by solid 29Si-DD/MAS analysis, is within a range from 0.13 mol/100 g to 0.37 mol/100 g.
摘要:
An addition-curable silicone composition is provided. The composition includes (A) a resin structure organopolysiloxane and (B) a platinum group metal-based catalyst. The component (A) has silicon-bonded alkenyl groups and hydrosilyl groups, and includes a structure in which R22SiO units, wherein R2 is a methyl group, etc., are connected together in a continuous repeating sequence, and the number of units in the continuous repeating sequence is within a range from 5 to 300. The composition can be prepared in a solid or semisolid form, and hence is suitable conventional molding apparatus such as a transfer molding apparatus, and upon curing, forms a hard resin cured product that exhibits excellent flexibility and minimal surface tack.
摘要:
The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.
摘要:
A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.
摘要翻译:提供了不是发光半导体器件的半导体器件。 该装置用室温下为固体且成型温度为液体的有机硅树脂组合物包封,并固化成具有根据JIS K 6253的D型硬度计测得的硬度至少为30的透明制品,并且其伸长率 拉伸试验至少5%。
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要:
Silica particles having 4-30% of an organopolysiloxane grafted to surfaces thereof are provided. A silicone composition loaded with such silica particles has high transparency, minimized permeability to corrosive gases, and improved encapsulation ability.
摘要:
A silicone composition is provided comprising (A) an organopolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3aR4bSiO(4−a−b)/2 units, wherein R1, R2, and R3 are methyl, ethyl, propyl, cyclohexyl or phenyl, R4 is vinyl or allyl, a is 0, 1 or 2, b is 1 or 2, a+b is 2 or 3, the number of recurring R22SiO units being 10 to 300, (B) an organohydrogenpolysiloxane of resin structure consisting of R1SiO1.5, R22SiO, and R3cHdSiO(4−c−d)/2 units, wherein R1, R2, and R3 are as defined above, c is 0, 1 or 2, d is 1 or 2, c+d is 2 or 3, the number of recurring R22SiO units being 10 to 300, and (C) a platinum catalyst. The silicone composition cures into a product exhibiting flexibility and minimized surface tack, and can be effectively molded on the existing molding machines.
摘要:
The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0