摘要:
Programmable logic structures include logic blocks that operate at very low supply voltages. According to the invention, a pass transistor is positioned between logic blocks. Since the logic blocks of the invention operate at very low supply voltages, the pass transistor can be overdriven on, thereby reducing the added resistance. In one embodiment of the invention, the pass transistor is a low threshold transistor. In this embodiment, the pass transistor is also overdriven off to reduce leakage current and further isolate the logic blocks.
摘要:
Buried platform wells are specifically used to electrically interact with the platform transistors of the invention. The dopant concentration distribution of the buried platform wells is used to change the threshold voltage of the platform transistors of the invention by introducing a tail dopant concentration into the active region of the platform transistors. The platform transistors of the invention can also be used in conjunction with standard transistors, on a single structure, to provide both low and relatively high threshold voltage transistors on a single structure. Consequently, using the method and structure of the invention, considerable versatility and design flexibility are achieved with minimum additional structural complexity.
摘要:
Low voltage latches are designed such that all the transistors included in the latch are low threshold transistors and voltage scalability of the latches of the invention is further increased by designing latches with uniform stack height components. One embodiment of the invention allows for minimum supply voltages of 60 millivolts, an improvement of over thirteen hundred percent compared with the typical prior art minimum voltage requirement of 800 millivolts.
摘要:
To reduce p-n junction leakage at the boundary between lightly doped wells formed in lightly doped bulk materials, a high concentration region is implanted at the junction. The high concentration region contains a relatively high dopant level, and thus reduces the width of the depletion region at the junction. The reduced width of the depletion region in turn reduces junction leakage.
摘要:
Low threshold voltage MOS devices having buried electrodes are disclosed herein. Such devices have source and drain regions which include tip regions and plug regions. The buried electrodes have bottom boundaries located above the bottoms of the plug regions. The buried electrode has the same conductivity type as the device's bulk (albeit at a higher dopant concentration) and, of course, the opposite conductivity type as the device's source and drain. The exact dopant concentrations and locations of the buried electrodes should be provided such that punch through is avoided in MOS devices.
摘要:
Systems and methods for adjusting threshold voltage. A threshold voltage of a transistor of an integrated circuit is measured. A bias voltage, which when applied to a body well of the transistor corrects a difference between the threshold voltage and a desired threshold voltage for the transistor, is determined. The bias voltage is encoded into non-volatile storage on the integrated circuit. The non-volatile storage can be digital and/or analog.
摘要:
A method and system of voltage compensated integrated circuits. Operating characteristics of integrated circuitry are enhanced by application of voltage compensation.
摘要:
Software controlled transistor body bias. A target frequency is accessed. Using software, transistor body-biasing values are determined for the target frequency in order to enhance a characteristic of a circuit. The bodies of the transistors are biased based on the body-biasing values, wherein the characteristic is enhanced.
摘要:
A method and system of adaptive power control. Characteristics of a specific integrated circuit are used to adaptively control power of the integrated circuit.
摘要:
Layout patterns for the deep well region to facilitate routing the body-bias voltage in a semiconductor device are provided and described. The layout patterns include a diagonal sub-surface mesh structure, an axial sub-surface mesh structure, a diagonal sub-surface strip structure, and an axial sub-surface strip structure. A particular layout pattern is selected for an area of the semiconductor device according to several factors.