摘要:
The range-specified IP addresses are effectively stored to reduce the number of necessary entries thereby the memory capacity of TCAM is improved. The representative means of the present invention is that: the storage information (entry) and the input information (comparison information or search key) are the common block code such that any bit must be the logical value ‘1’; Match-lines are hierarchically structured and memory cells are arranged at the intersecting points of a plurality of sub-match lines and a plurality of search lines; Further the sub-match lines are connected to main-match lines through the sub-match detectors, respectively and main-match detectors are arranged on the main-match lines.
摘要:
A dummy cell includes a plurality of first memory cells MC for storing “1” or “0”, arranged at points of intersection between a plurality of word lines WR0 to WR7 and a plurality of first data lines D0 to D7, a plurality of first dummy cells MCH for storing “1” or “0”, arranged at points of intersection between the word lines WR0 to WR7 and a first dummy data line, and a plurality of second dummy cells MCL for storing “0”, arranged at points of intersection between the word lines WR0 to WR7 and a second dummy data line DD1.
摘要:
A dummy cell includes a plurality of first memory cells MC for storing “1” or “0”, arranged at points of intersection between a plurality of word lines WR0 to WR7 and a plurality of first data lines D0 to D7, a plurality of first dummy cells MCH for storing “1” or “0”, arranged at points of intersection between the word lines WR0 to WR7 and a first dummy data line, and a plurality of second dummy cells MCL for storing “0”, arranged at points of intersection between the word lines WR0 to WR7 and a second dummy data line DD1.
摘要:
In manufacturing a semiconductor memory by using conventional gain cells, it is difficult to integrate them similarly to 1T1C cells of a DRAM if mask alignment accuracy is considered. In order to achieve integration similarly to that of 1T1C cells by using gain cells, a memory cell block constituted as follows is used. A memory block (MCT) comprises a plurality of memory cells (MC0-MC3). Each memory cell includes a PMOS transistor (M0) for writing and an NMOS transistor (M1) for reading, and information is stored by holding electric charge in a storage node. The write transistors (M0) are arranged in parallel in a plurality of cells, each source-drain path is connected to a data line (DL). The read transistors (M1) are connected in series in a plurality of cells, and are connected to the data line (DL) via a block selection transistor (MB).
摘要:
In manufacturing a semiconductor memory by using conventional gain cells, it is difficult to integrate them similarly to 1T1C cells of a DRAM if mask alignment accuracy is considered. In order to achieve integration similarly to that of 1T1C cells by using gain cells, a memory cell block constituted as follows is used. A memory block (MCT) comprises a plurality of memory cells (MC0-MC3). Each memory cell includes a PMOS transistor (M0) for writing and an NMOS transistor (M1) for reading, and information is stored by holding electric charge in a storage node. The write transistors (M0) are arranged in parallel in a plurality of cells, each source-drain path is connected to a data line (DL). The read transistors (M1) are connected in series in a plurality of cells, and are connected to the data line (DL) via a block selection transistor (MB).
摘要:
A semiconductor device to output voltages at three levels to a word driver while alleviating the breakdown voltage in the MOS transistor. This invention is comprised of a breakdown-voltage reducing MOS transistor inserted in the word driver and two NMOS transistors to supply a read-out voltage to a word line. The word driver is moreover controlled by different voltage amplitudes on the main word lines and the common word lines.
摘要:
In a phase change memory, when M bit (8 bits=1 byte) data is written, erase operation and program operation are performed in units of n bit (M>n) data. Further, when M bit data is written, program operation is performed in units of the n bit (M>n) data. Further, when M bit data is read from the memory cell, read operation is performed in units of the n bit (M>n) data. For example, when the data is written into to the phase change memory, the data is not overwritten but program is performed after once erasing the target memory cell. The data size for erasure and the data size for program are made equal. Erase and program operation are performed only for the demanded data size.
摘要:
In a phase change memory, when M bit (8 bits=1 byte) data is written, erase operation and program operation are performed in units of n bit (M>n) data. Further, when M bit data is written, program operation is performed in units of the n bit (M>n) data. Further, when M bit data is read from the memory cell, read operation is performed in units of the n bit (M>n) data. For example, when the data is written into to the phase change memory, the data is not overwritten but program is performed after once erasing the target memory cell. The data size for erasure and the data size for program are made equal. Erase and program operation are performed only for the demanded data size.
摘要:
A semiconductor storage device crystallizes variable resistive element material layers arranged on side surfaces of multiple semiconductor layers in a stacked structure concurrently by applying a first current to any one of semiconductor layers in the stacked structure, and thereafter applies a second current to semiconductor layers other than a semiconductor layer to which the first current was applied.
摘要:
A recording layer 52 made of a chalcogenide material which stores a high-resistance state of a high electrical resistance value and a low-resistance state of a low electrical resistance value is used as a memory element RM in a memory cell region, and it is formed so that a concentration of Ga or In of a first layer 52a positioned on a lower electrode TP side of the recording layer 52 is higher than the corresponding concentration of a second layer 52b positioned on an upper electrode 53 side. For example, the recording layer is formed so that a content of Ga or In of the second layer is 5 atomic % or more smaller than that of the first layer. Also, a circuit which can reverse the voltage polarity between the upper electrode and the lower electrode in a set operation and a reset operation is provided.