公开(公告)号：US08022539B2

公开(公告)日：2011-09-20

申请号：US12272765

申请日：2008-11-17

申请人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/04

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof; molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, including having the contact pads exposed; and forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有接触焊盘和连接引线的引线框架; 将基极集成电路耦合到接触焊盘; 耦合在基底集成电路，连接引线，接触焊盘或其组合之间的芯片互连; 在连接引线，基底集成电路和芯片互连件上模制封装体，包括暴露接触焊盘; 以及在所述封装主体上形成底表面，包括形成与所述底表面共面的所述连接引线。

公开(公告)号：US07911040B2

公开(公告)日：2011-03-22

申请号：US11965621

申请日：2007-12-27

申请人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L23/50 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing an integrated circuit die; forming a top paddle over the integrated circuit die wherein the top paddle has planar dimensions smaller than planar dimensions of the integrated circuit die; forming leads adjacent the top paddle; attaching first connectors to the integrated circuit die and the top paddle; attaching second connectors to the integrated circuit die and the leads; and forming an encapsulant over the first connectors, the second connectors, the integrated circuit die, and the top paddle.

摘要翻译： 一种集成电路封装系统，包括：提供集成电路管芯; 在所述集成电路管芯上形成顶部焊盘，其中所述顶部焊盘具有小于所述集成电路管芯的平面尺寸的平面尺寸; 在顶板附近形成引线; 将第一连接器连接到集成电路管芯和顶部焊盘; 将第二连接器连接到集成电路管芯和引线; 以及在所述第一连接器，所述第二连接器，所述集成电路管芯和所述顶部焊盘上形成密封剂。

公开(公告)号：US20100311206A1

公开(公告)日：2010-12-09

申请号：US12858615

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L21/50 ,  H01L21/78 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

摘要翻译： 半导体晶片包含多个半导体管芯。 切割半导体晶片以分离半导体管芯。 将半导体管芯转移到载体上。 在载体上的半导体管芯的周围形成管芯延伸区域。 载体被移除。 在管芯延伸区域中的第一和第二偏移行中形成多个通孔通孔（THV）。 导电材料沉积在THV中。 第一RDL形成在半导体管芯上的接触焊盘和THV之间。 第二RDL形成在与THV电接触的半导体管芯的背面上。 形成与第二RDL电接触的凸块下金属化。 在凸块下方形成焊料凸块。 单芯片延伸区域以分离半导体管芯。

公开(公告)号：US07790576B2

公开(公告)日：2010-09-07

申请号：US11947377

申请日：2007-11-29

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Arnel Senosa Trasporto

IPC分类号： H01L21/30

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor wafer contains a plurality of semiconductor die. The semiconductor wafer is diced to separate the semiconductor die. The semiconductor die are transferred onto a carrier. A die extension region is formed around a periphery of the semiconductor die on the carrier. The carrier is removed. A plurality of through hole vias (THV) is formed in first and second offset rows in the die extension region. A conductive material is deposited in the THVs. A first RDL is formed between contact pads on the semiconductor die and the THVs. A second RDL is formed on a backside of the semiconductor die in electrical contact with the THVs. An under bump metallization is formed in electrical contact with the second RDL. Solder bumps are formed on the under bump metallization. The die extension region is singulated to separate the semiconductor die.

摘要翻译： 半导体晶片包含多个半导体管芯。 切割半导体晶片以分离半导体管芯。 将半导体管芯转移到载体上。 在载体上的半导体管芯的周围形成管芯延伸区域。 载体被移除。 在管芯延伸区域中的第一和第二偏移行中形成多个通孔通孔（THV）。 导电材料沉积在THV中。 第一RDL形成在半导体管芯上的接触焊盘和THV之间。 第二RDL形成在与THV电接触的半导体管芯的背面上。 形成与第二RDL电接触的凸块下金属化。 在凸块下方形成焊料凸块。 单芯片延伸区域以分离半导体管芯。

公开(公告)号：US07777354B2

公开(公告)日：2010-08-17

申请号：US12132121

申请日：2008-06-03

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/28 ,  H01L21/48

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.

摘要翻译： 集成电路封装系统包括：提供框架; 附接具有邻近框架的引线的引线封装，其中引线朝向与框架相对的一侧延伸; 以及在所述引线封装上施加封装密封剂，所述引线封装具有与所述框架相对部分地露出的引线。

公开(公告)号：US20100123227A1

公开(公告)日：2010-05-20

申请号：US12272765

申请日：2008-11-17

申请人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Frederick Rodriguez Dahilig ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L21/50 ,  H01L23/00

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof; molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, includes having the contact pads exposed; and forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有接触焊盘和连接引线的引线框架; 将基极集成电路耦合到接触焊盘; 耦合在基底集成电路，连接引线，接触焊盘或其组合之间的芯片互连; 在连接引线，基底集成电路和芯片互连件上成型封装体，包括使接触焊盘露出; 以及在所述封装主体上形成底表面，包括形成与所述底表面共面的所述连接引线。

公开(公告)号：US20090302442A1

公开(公告)日：2009-12-10

申请号：US12474757

申请日：2009-05-29

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49551 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.

摘要翻译： 一种制造集成电路管芯封装系统的方法，包括：提供具有管芯附接焊盘，隔离焊盘和连接器的引线框架; 将集成电路管芯连接到管芯附接焊盘和连接器; 在集成电路管芯，连接器，管芯附接焊盘和隔离焊盘上形成封装; 并且分离连接器和管芯附接板，由此隔离焊盘被电隔离。

公开(公告)号：US20090243082A1

公开(公告)日：2009-10-01

申请号：US12055526

申请日：2008-03-26

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49524 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24247 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： An integrated circuit package system includes: mounting an integrated circuit die adjacent to a lead; forming a first encapsulation around and exposing the integrated circuit die and the lead; and forming a planar interconnect between the integrated circuit die and the lead with the planar interconnect on the first encapsulation.

摘要翻译： 集成电路封装系统包括：将集成电路模具安装在与引线相邻的位置; 围绕并暴露集成电路管芯和引线而形成第一封装; 以及在所述第一封装上利用所述平面互连件在所述集成电路管芯和所述引线之间形成平面互连。

公开(公告)号：US20090243066A1

公开(公告)日：2009-10-01

申请号：US12054682

申请日：2008-03-25

申请人： Zigmund Ramirez Camacho ,  Abelardo Jr. Advincula ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Abelardo Jr. Advincula ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L23/3135 ,  H01L23/49537 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a mountable integrated circuit package system comprising: providing an inner integrated circuit package including a first external interconnect having a shoulder; connecting an intraconnect between a second external interconnect and the shoulder; and forming an outer encapsulation over the inner integrated circuit package, the intraconnect, and partially exposing the first external interconnect on a top encapsulation side of the outer encapsulation and the second external interconnect on a bottom encapsulation side of the outer encapsulation.

摘要翻译： 本发明提供一种可安装的集成电路封装系统，包括：提供内部集成电路封装，其包括具有肩部的第一外部互连; 连接第二外部互连和肩部之间的连接; 以及在所述内部集成电路封装上形成外部封装，在所述外部封装的底部封装侧上将所述外部封装的顶部封装侧上的所述第一外部互连和所述第二外部互连部分地暴露于所述第一外部互连。

公开(公告)号：US20090166885A1

公开(公告)日：2009-07-02

申请号：US11965621

申请日：2007-12-27

申请人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L23/50 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing an integrated circuit die; forming a top paddle over the integrated circuit die wherein the top paddle has planar dimensions smaller than planar dimensions of the integrated circuit die; forming leads adjacent the top paddle; attaching first connectors to the integrated circuit die and the top paddle; attaching second connectors to the integrated circuit die and the leads; and forming an encapsulant over the first connectors, the second connectors, the integrated circuit die, and the top paddle.

摘要翻译： 一种集成电路封装系统，包括：提供集成电路管芯; 在所述集成电路管芯上形成顶部焊盘，其中所述顶部焊盘具有小于所述集成电路管芯的平面尺寸的平面尺寸; 在顶板附近形成引线; 将第一连接器连接到集成电路管芯和顶部焊盘; 将第二连接器连接到集成电路管芯和引线; 以及在所述第一连接器，所述第二连接器，所述集成电路管芯和所述顶部焊盘上形成密封剂。