摘要:
A semiconductor device chip, semiconductor device system, and a method. One embodiment provides a semiconductor device chip including a device for determining whether the semiconductor device chip is to be placed in a current saving operating mode.
摘要:
A method of forming an integrated circuit having a capacitor is disclosed. In one embodiment, the method includes forming a capacitor element with a first electrode, a dielectric layer and a second electrode. The capacitor element is formed using a support layer.
摘要:
A method for manufacturing CBRAM switching elements and CBRAM semiconductor memories with improved switching characteristics so as to remove superfluous, weak, cluster-like, or unbound selenium at the surface of a GeSe layer is solved by the present invention in that, after the generation of an active matrix material or GeSe layer, respectively, a reactive sputter etching process is performed in which the surface layer of the active matrix material or GeSe layer, respectively, is removed at least partially so as to modify the surface structure thereof.
摘要:
The present invention relates to a transistor comprising a gate channel area and a gate stack having mechanical stress arranged on the gate channel area.
摘要:
A phase change memory cell is disclosed. The phase change memory cell includes a first thin film spacer and a second thin film spacer. The first thin film spacer defines a sub-lithographic dimension and is electrically coupled to a first electrode. The second thin film spacer defines a sub-lithographic dimension and is electrically coupled between a second electrode and the first thin film spacer. In this regard, the phase change memory cell is formed at a boundary where the first thin film spacer electrically contacts the second thin film spacer.
摘要:
A test method and a semiconductor device is disclosed. One embodiment provides sending out a test signal by a semiconductor device. A reflected signal generated in reaction is compared to the test signal with a first threshold value. The reflected signal is compared with a second threshold value differing from the first threshold value.
摘要:
An integrated circuit includes a contact structure with a buried first and a protruding second portion. The buried first portion is arranged in a cavity formed in a semiconductor structure and is in direct contact with the semiconductor structure. The protruding second portion is arranged above the main surface of the semiconductor structure and in direct contact with a conductive structure that is spaced apart from or separated from the main surface of the semiconductor structure. An insulator structure is arranged below and in direct contact with the contact structure.
摘要:
A chalcogenide layer includes a composition of compounds having the formula MmX1-m, where M denotes one or more elements selected from the group consisting of group IVb elements of the periodic system, group Vb elements of the periodic system and transition metals, X denotes one or more elements selected from the group consisting of S, Se and Te, and m has a value of between 0 and 1. The chalcogenide layer further includes an oxygen or nitrogen content in the range from 0.001 atomic % to 75 atomic %.
摘要:
A method for manufacturing an integrated circuit having a magnetic tunnel junction device is disclosed. The method includes depositing a bottom pinning structure above the bottom conductive structure. A first ferromagnetic structure is deposited above the bottom pinning structure in a chamber. A tunnel barrier structure is deposited above the first ferromagnetic layer structure in the chamber, and a second ferromagnetic structure is deposited above the tunnel barrier structure of the magnetic tunnel junction device in another chamber.
摘要:
A method of formation of contacts with cobalt silicide since is disclosed. For example, after siliciding with the SOM solution, both unreacted sections of the deposition layer including, for example, cobalt as initial layer for the siliciding and an oxidation protection layer including titanium and deposited by means of cathode beam sputtering, for instance, may be removed rapidly and with high selectivity relative to the cobalt silicide and other, densified metal structures and metal layers.