Method for manufacturing a CBRAM semiconductor memory
    83.
    发明授权
    Method for manufacturing a CBRAM semiconductor memory 有权
    制造CBRAM半导体存储器的方法

    公开(公告)号:US07718537B2

    公开(公告)日:2010-05-18

    申请号:US11238117

    申请日:2005-09-29

    IPC分类号: H01L21/302

    摘要: A method for manufacturing CBRAM switching elements and CBRAM semiconductor memories with improved switching characteristics so as to remove superfluous, weak, cluster-like, or unbound selenium at the surface of a GeSe layer is solved by the present invention in that, after the generation of an active matrix material or GeSe layer, respectively, a reactive sputter etching process is performed in which the surface layer of the active matrix material or GeSe layer, respectively, is removed at least partially so as to modify the surface structure thereof.

    摘要翻译: 本发明解决了一种用于制造具有改进的开关特性以便在GeSe层表面去除多余的,弱的,簇状的或未结合的硒的CBRAM开关元件和CBRAM半导体存储器的方法,因为在产生 分别进行有源矩阵材料或GeSe层的反应性溅射蚀刻工艺,其中分别去除有源矩阵材料或GeSe层的表面层,以至少部分地去除其表面结构。

    Memory device
    85.
    发明授权
    Memory device 有权
    内存设备

    公开(公告)号:US07718467B2

    公开(公告)日:2010-05-18

    申请号:US12049484

    申请日:2008-03-17

    IPC分类号: H01L29/08

    摘要: A phase change memory cell is disclosed. The phase change memory cell includes a first thin film spacer and a second thin film spacer. The first thin film spacer defines a sub-lithographic dimension and is electrically coupled to a first electrode. The second thin film spacer defines a sub-lithographic dimension and is electrically coupled between a second electrode and the first thin film spacer. In this regard, the phase change memory cell is formed at a boundary where the first thin film spacer electrically contacts the second thin film spacer.

    摘要翻译: 公开了一种相变存储器单元。 相变存储单元包括第一薄膜间隔物和第二薄膜间隔物。 第一薄膜间隔物限定亚光刻尺寸并且电耦合到第一电极。 第二薄膜间隔物限定了亚光刻尺寸,并且电耦合在第二电极和第一薄膜间隔物之间​​。 在这方面,相变存储单元形成在第一薄膜间隔物与第二薄膜间隔物电接触的边界处。

    Test method and semiconductor device
    86.
    发明授权
    Test method and semiconductor device 失效
    测试方法和半导体器件

    公开(公告)号:US07715257B2

    公开(公告)日:2010-05-11

    申请号:US11928790

    申请日:2007-10-30

    申请人: Thorsten Bucksch

    发明人: Thorsten Bucksch

    IPC分类号: G11C7/00

    摘要: A test method and a semiconductor device is disclosed. One embodiment provides sending out a test signal by a semiconductor device. A reflected signal generated in reaction is compared to the test signal with a first threshold value. The reflected signal is compared with a second threshold value differing from the first threshold value.

    摘要翻译: 公开了一种测试方法和半导体器件。 一个实施例提供了通过半导体器件发送测试信号。 将反应中产生的反射信号与具有第一阈值的测试信号进行比较。 将反射信号与不同于第一阈值的第二阈值进行比较。

    Integrated Circuit with a Contact Structure Including a Portion Arranged in a Cavity of a Semiconductor Structure
    87.
    发明申请
    Integrated Circuit with a Contact Structure Including a Portion Arranged in a Cavity of a Semiconductor Structure 有权
    具有包含在半导体结构的腔中的部分的接触结构的集成电路

    公开(公告)号:US20100090285A1

    公开(公告)日:2010-04-15

    申请号:US12251864

    申请日:2008-10-15

    摘要: An integrated circuit includes a contact structure with a buried first and a protruding second portion. The buried first portion is arranged in a cavity formed in a semiconductor structure and is in direct contact with the semiconductor structure. The protruding second portion is arranged above the main surface of the semiconductor structure and in direct contact with a conductive structure that is spaced apart from or separated from the main surface of the semiconductor structure. An insulator structure is arranged below and in direct contact with the contact structure.

    摘要翻译: 集成电路包括具有埋入的第一和突出的第二部分的接触结构。 掩埋的第一部分布置在形成于半导体结构中并与半导体结构直接接触的空腔中。 突出的第二部分布置在半导体结构的主表面上方,并且与与半导体结构的主表面间隔开或分离的导电结构直接接触。 绝缘体结构布置在接触结构的下方并直接接触。

    Reactive sputtering process for optimizing the thermal stability of thin chalcogenide layers
    88.
    发明授权
    Reactive sputtering process for optimizing the thermal stability of thin chalcogenide layers 失效
    用于优化薄硫族化物层的热稳定性的反应溅射工艺

    公开(公告)号:US07692175B2

    公开(公告)日:2010-04-06

    申请号:US11214023

    申请日:2005-08-30

    IPC分类号: H01L29/02

    摘要: A chalcogenide layer includes a composition of compounds having the formula MmX1-m, where M denotes one or more elements selected from the group consisting of group IVb elements of the periodic system, group Vb elements of the periodic system and transition metals, X denotes one or more elements selected from the group consisting of S, Se and Te, and m has a value of between 0 and 1. The chalcogenide layer further includes an oxygen or nitrogen content in the range from 0.001 atomic % to 75 atomic %.

    摘要翻译: 硫族化物层包括具有式MmX1-m的化合物的组合物,其中M表示选自周期系统的IVb族元素,周期系中的Vb族元素和过渡金属的一种或多种元素,X表示一种 或更多选自S,Se和Te的元素,并且m具有0和1之间的值。硫族化物层还包括0.001原子%至75原子%范围内的氧或氮含量。

    Method of forming integrated circuit having a magnetic tunnel junction device
    89.
    发明授权
    Method of forming integrated circuit having a magnetic tunnel junction device 有权
    形成具有磁性隧道结装置的集成电路的方法

    公开(公告)号:US07682841B2

    公开(公告)日:2010-03-23

    申请号:US11743497

    申请日:2007-05-02

    IPC分类号: H01L21/00

    摘要: A method for manufacturing an integrated circuit having a magnetic tunnel junction device is disclosed. The method includes depositing a bottom pinning structure above the bottom conductive structure. A first ferromagnetic structure is deposited above the bottom pinning structure in a chamber. A tunnel barrier structure is deposited above the first ferromagnetic layer structure in the chamber, and a second ferromagnetic structure is deposited above the tunnel barrier structure of the magnetic tunnel junction device in another chamber.

    摘要翻译: 公开了一种具有磁性隧道结装置的集成电路的制造方法。 该方法包括在底部导电结构上方沉积底部钉扎结构。 第一铁磁结构沉积在腔室中的底部钉扎结构上方。 在腔室中的第一铁磁层结构上方沉积隧道势垒结构,并且在另一个室中的磁性隧道结装置的隧道势垒结构上方沉积第二铁磁结构。

    Method of removing refractory metal layers and of siliciding contact areas
    90.
    发明授权
    Method of removing refractory metal layers and of siliciding contact areas 失效
    去除难熔金属层和硅化接触区域的方法

    公开(公告)号:US07679149B2

    公开(公告)日:2010-03-16

    申请号:US11669500

    申请日:2007-01-31

    IPC分类号: H01L29/76

    摘要: A method of formation of contacts with cobalt silicide since is disclosed. For example, after siliciding with the SOM solution, both unreacted sections of the deposition layer including, for example, cobalt as initial layer for the siliciding and an oxidation protection layer including titanium and deposited by means of cathode beam sputtering, for instance, may be removed rapidly and with high selectivity relative to the cobalt silicide and other, densified metal structures and metal layers.

    摘要翻译: 公开了一种与硅化钴形成接触的方法。 例如,在用SOM溶液硅化后,例如包括例如作为硅化的初始层的钴的钴的沉积层的未反应部分和包括钛并通过阴极射线溅射沉积的氧化保护层可以是 相对于硅化钴和其它致密的金属结构和金属层,快速且高选择性地去除。