公开(公告)号：US06357330B1

公开(公告)日：2002-03-19

申请号：US09227493

申请日：1999-01-07

申请人： M. Lawrence A. Dass ,  Isaura S. Gaeta ,  Krishna Seshan

发明人： M. Lawrence A. Dass ,  Isaura S. Gaeta ,  Krishna Seshan

IPC分类号： B23D530

CPC分类号： B28D5/0064 ,  B23D59/001 ,  Y10T83/0215 ,  Y10T83/145 ,  Y10T83/162 ,  Y10T83/263 ,  Y10T83/536 ,  Y10T83/538 ,  Y10T83/541

摘要： A wafer cutting apparatus which includes a wafer saw, a detector, and a control unit. The detector detects a variable of a wafer being sawed. The control unit utilizes the variable to control the saw.

摘要翻译： 一种晶片切割装置，其包括晶片锯，检测器和控制单元。 检测器检测被锯切的晶片的变量。 控制单元利用变量来控制锯。

公开(公告)号：US20020023725A1

公开(公告)日：2002-02-28

申请号：US09808814

申请日：2001-03-14

发明人： Michael Bryan ,  James K. Kai

IPC分类号： B32B001/00

CPC分类号： B32B43/006 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0064 ,  B28D5/0082 ,  Y10T29/49821 ,  Y10T29/49822 ,  Y10T83/364 ,  Y10T156/1374 ,  Y10T156/1928

摘要： A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.

摘要翻译： 切割工具将加压气体与锋利的边缘组合地提供到基底的边缘，以在选定的界面处切割基底。 将工具的边缘与衬底的周边（例如键合衬底）相接合，然后在大约与工具边缘的接触点处施加气体压力脉冲。 机械力和气体压力的组合将基板在选定的界面（例如施主晶片中的弱化层）分离成两半。

公开(公告)号：US06221740B1

公开(公告)日：2001-04-24

申请号：US09371436

申请日：1999-08-10

申请人： Michael A. Bryan ,  James K. Kai

发明人： Michael A. Bryan ,  James K. Kai

IPC分类号： H01L2130

CPC分类号： B32B43/006 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0064 ,  B28D5/0082 ,  H01L21/67092 ,  Y10T29/53683 ,  Y10T156/1939 ,  Y10T225/12 ,  Y10T225/18 ,  Y10T225/30 ,  Y10T225/386

摘要： A cleaving tool provides pressurized gas to the edge of a substrate to cleave the substrate at a selected interface. A substrate, such as a bonded substrate, is loaded into the cleaving tool, and two halves of the tool are brought together to apply a selected pressure to the substrate. A compliant pad of selected elastic resistance provides support to the substrate while allowing the substrate to expand during the cleaving process. Bringing the two halves of the tool together also compresses an edge seal against the perimeter of the substrate. A thin tube connected to a high-pressure gas source extends through the edge seal and provides a burst of gas to separate the substrate into at least two sheets. In a further embodiment, the perimeter of the substrate is struck with an edge prior to applying the gas pressure.

摘要翻译： 切割工具将加压气体提供到衬底的边缘以在所选择的界面处切割衬底。 衬底（例如键合衬底）被装载到劈开工具中，并且工具的两半被聚集在一起以将选择的压力施加到衬底上。 所选择的弹性阻力的柔性衬垫提供对衬底的支撑，同时允许衬底在裂开过程期间膨胀。 将工具的两个一半带到一起也可压缩衬底周边的边缘密封。 连接到高压气体源的细管延伸穿过边缘密封件并且提供气泡，以将基底分离成至少两个片。 在另一个实施例中，在施加气体压力之前，衬底的周边被边缘撞击。

公开(公告)号：US6112738A

公开(公告)日：2000-09-05

申请号：US285337

申请日：1999-04-02

申请人： Dale A. Witte ,  Tracy Ragan

发明人： Dale A. Witte ,  Tracy Ragan

IPC分类号： B28D5/00 ,  B28D5/04 ,  B28D1/08

CPC分类号： B28D5/045 ,  B28D5/0064 ,  B28D5/007 ,  H01L23/544 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2924/0002

摘要： Methods of slicing ingots of semiconductor material into wafers using a wire saw. The wire saw includes a wire that is movable in a forward direction and a reverse direction for slicing the ingots. The methods include defining an identification region of each wafer to be sliced from the ingots and aligning an alignment feature of the ingots in approximately the same position relative to the wire saw for each of the ingots. The identification region of the wafer is adapted for marking with an identification mark after slicing. The methods also include slicing the ingot into wafers with the wire saw. The slicing step includes moving the wire in the forward and reverse directions during slicing except when slicing in the identification region of each wafer and moving the wire only in the forward direction when slicing in the identification region of each wafer. In slicing the ingot into wafers, thickness variations relative to the size of the identification mark are reduced in the identification region.

摘要翻译： 使用线锯将半导体材料锭切成晶片的方法。 线锯包括可沿向前方向和相反方向移动的线，用于切割锭。 这些方法包括定义要从锭切片的每个晶片的识别区域，并且将每个晶锭相对于线锯大致相同位置的锭的对准特征对准。 晶片的识别区域适于在切片之后用识别标记进行标记。 这些方法还包括用锭锯将锭切成晶片。 切片步骤包括在切片期间沿着正向和反向的方向移动导线，除了当在每个晶片的识别区域中切片时，在每个晶片的识别区域中切片并且仅在每个晶片的识别区域中切片时在正向移动线。 在将晶片切成晶片时，在识别区域中减小了相对于识别标记尺寸的厚度变化。

公开(公告)号：US4932389A

公开(公告)日：1990-06-12

申请号：US260200

申请日：1988-10-20

申请人： Yukihiro Saeki ,  Masatoshi Tagami

发明人： Yukihiro Saeki ,  Masatoshi Tagami

IPC分类号： B23Q5/26 ,  B28D1/22 ,  B28D5/00 ,  B28D5/02 ,  B28D7/00

CPC分类号： B28D5/028 ,  B28D5/0064 ,  B28D5/024

摘要： A slicing apparatus includes: an annular plate-like rotary blade adapted to be rotated about an axle thereof and having an inner peripheral cutting edge; a table for carrying a work; a first work-feeding mechanism for moving the work on the table in a direction parallel to the axis of the rotary blade; and a second work-feeding mechanism for moving the table in a direction parallel to the opposite side of the blade so as to cause the work on the table to be sliced by the blade. The second work feeding mechanism includes: a hydraulic cylinder operatively connected to the table; a pressure oil-supplying mechanism for supplying the hydraulic cylinder with a pressure oil; a rotary valve for controlling the flow rate of the pressure oil to be supplied to the hydraulic cylinder, the rotary valve having a rotary input shaft of which rotational position determines the flow rate of the pressure oil passing through the rotary valve; a drive mechanism for rotating the input shaft of the rotary valve; a cutting speed sensor for substantially detecting the travel speed of the table which is moved by the hydraulic cylinder and for outputting a feedback signal; and a control unit for controlling the drive mechanism according to the feedback signal outputted by the speed sensor so that the actual travel speed of the table is equal to a predetermined travel speed for the table.

摘要翻译： 切片装置包括：环形板状旋转刀片，其适于绕其轴线旋转并具有内周切削刃; 一张载着工作的桌子; 第一加工机构，用于沿与所述旋转叶片的轴线平行的方向在所述工作台上移动所述工件; 以及第二加工机构，用于沿着平行于叶片的相对侧的方向移动工作台，以便使刀片上的工件被切割。 第二工作进给机构包括：可操作地连接到工作台的液压缸; 用于向液压缸供给压力油的压力供油机构; 用于控制供给到液压缸的压力油的流量的旋转阀，旋转阀具有旋转输入轴，旋转位置决定了通过旋转阀的压力油的流量; 用于旋转所述旋转阀的输入轴的驱动机构; 切割速度传感器，用于基本上检测由液压缸移动的工作台的行进速度并输出反馈信号; 以及控制单元，用于根据由速度传感器输出的反馈信号来控制驱动机构，使得工作台的实际行驶速度等于工作台的预定行驶速度。

公开(公告)号：US4696712A

公开(公告)日：1987-09-29

申请号：US791488

申请日：1985-10-25

申请人： Yuzo Nonaka

发明人： Yuzo Nonaka

IPC分类号： H01L21/301 ,  B28D5/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/68 ,  B32B31/18

CPC分类号： H01L21/67253 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2223/54413 ,  Y10T156/1064 ,  Y10T156/1348 ,  Y10T225/30

摘要： A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The system further includes a controlling device for forming a relative relation signal showing a relative relation between a first indication which has been or is applied to the frame and a second indication of the wafer, which wafer has been or is mounted to the frame, and memory means for memorizing the relative relation signal formed by the controlling device.

摘要翻译： 一种半导体晶片安装和切割系统，包括用于将半导体晶片安装到框架上的晶片安装机和用于接收框架的晶片切割机和安装在其上的晶片从晶片安装机馈送并根据需要切割晶​​片。 该系统还包括一个控制装置，用于形成相对关系信号，该相对关系信号表示已经或被施加到该帧的第一指示与晶片已经或被安装到该框架的晶片的第二指示之间的相对关系;以及 用于存储由控制装置形成的相对关系信号的存储装置。

公开(公告)号：US4052132A

公开(公告)日：1977-10-04

申请号：US630189

申请日：1975-11-10

申请人： William L. Oates

发明人： William L. Oates

IPC分类号： B23B41/14 ,  B23B47/18 ,  B28D5/00 ,  B28D5/02 ,  B23B35/00

CPC分类号： B23B41/14 ,  B28D5/0058 ,  B28D5/0064 ,  B28D5/021 ,  Y10T408/03 ,  Y10T408/08 ,  Y10T408/17 ,  Y10T408/23

摘要： A drilling system and method for use on thin frangible workpieces, such as watch crystals and the like, in which the speed of rotation and pecking motion of the drill are programmed to execute a preset schedule of changes with minimal human intervention.In a preferred embodiment, the drill is mounted over the workpiece, which is pneumatically clamped on the work surface in a shallow water bath. The vertical pecking motion of the drill is under the dual control of a primary cable tensioned by weights on one end under control of a solenoid; and a secondary cable, the tension of which is responsive to the rotation of a master cam. The latter also initiates relay action for sequential operation of controls. The drill operates at an initial, relatively low rotational speed and a brisk pecking motion. At a preselected point near the lower end of the drill hole, the rotational speed of the drill is shifted to "high", and the pecking motion is slowed. Simultaneously, weights are lifted from the end of the primary cable, releasing the drill bit for the final slow descent through the remaining portion of the workpiece, reducing the possibility of breakout.

公开(公告)号：US198025A

公开(公告)日：1877-12-11

申请号：US198025D

CPC分类号： A21C11/00 ,  B28D5/0064 ,  Y10T83/4637

公开(公告)号：US12083705B2

公开(公告)日：2024-09-10

申请号：US17414680

申请日：2019-12-12

申请人： SILTRONIC AG

发明人： Axel Beyer ,  Stefan Welsch

IPC分类号： B28D5/04 ,  B24B27/06 ,  B28D5/00 ,  H01L21/67 ,  B23D59/00 ,  B28D7/00 ,  H01L21/02

CPC分类号： B28D5/0064 ,  B24B27/0633 ,  B28D5/0082 ,  B28D5/045 ,  H01L21/67092 ,  H01L21/67253 ,  B23D59/00 ,  B28D5/00 ,  B28D5/0058 ,  B28D5/007 ,  B28D5/04 ,  B28D7/00 ,  H01L21/0201

摘要： Semiconductor wafers are produced from a workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires tensioned between wire guide rollers and divided into wire groups, the wires moving in a running direction producing kerfs as wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups determined, and for each of the wire groups compensating movements of the wires of the wire group are induced as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element.

公开(公告)号：US20240269892A1

公开(公告)日：2024-08-15

申请号：US18438904

申请日：2024-02-12

申请人： TDK CORPORATION

发明人： Atsuhiro NONAKA ,  Takashi HORAI ,  Tomoko KITAMURA

IPC分类号： B28D5/00 ,  G05B13/02

CPC分类号： B28D5/0064 ,  G05B13/0265

摘要： A processing apparatus includes a rotatable blade, a blade driving shaft, a table, a position driving mechanism, a first sensor, a second sensor, a start/stop point information extraction section, a characteristic-vibration-information extraction section, and a characteristic-vibration-information extraction section. The shaft drives the blade. The table places a workpiece to be processed. The mechanism changes a relative position between the blade and the workpiece. The first sensor detects a vibration generated by driving the blade. The second sensor detects a vibration generated by driving the blade. The start/stop point information extraction section extracts at least one of a start point information regarding a contact start point and a stop point information regarding a contact stop point based on a detection result of the second sensor. The characteristic-vibration-information extraction section extracts a characteristic vibration information regarding a predetermined characteristic vibration and determines a position of the characteristic vibration.